SLOSEA8 December   2024 TAS5815

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5.   Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
  8. Typical Characteristics
    1. 6.1 Bridge Tied Load (BTL) Configuration Curves with BD Modulation
    2. 6.2 Bridge Tied Load (BTL) Configuration Curves with 1SPW Modulation
    3. 6.3 Parallel Bridge Tied Load (PBTL) Configuration With BD Modulation
    4. 6.4 Parallel Bridge Tied Load (PBTL) Configuration With 1SPW Modulation
  9. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Supplies
      2. 7.3.2 Device Clocking
      3. 7.3.3 Serial Audio Port – Clock Rates
      4. 7.3.4 Serial Audio Port - Data Formats and Bit Depths
      5. 7.3.5 Clock Halt Auto-recovery
      6. 7.3.6 Sample Rate on the Fly Change
      7. 7.3.7 Digital Audio Processing
      8. 7.3.8 Class D Audio Amplifier
        1. 7.3.8.1 Speaker Amplifier Gain Select
    4. 7.4 Device Functional Modes
      1. 7.4.1 Software Control
      2. 7.4.2 Speaker Amplifier Operating Modes
        1. 7.4.2.1 BTL Mode
        2. 7.4.2.2 PBTL Mode
      3. 7.4.3 Low EMI Modes
        1. 7.4.3.1 Minimize EMI with Spread Spectrum
        2. 7.4.3.2 Minimize EMI with channel to channel phase shift
        3. 7.4.3.3 Minimize EMI with Multi-Devices PWM Phase Synchronization
      4. 7.4.4 Thermal Foldback
      5. 7.4.5 Device State Control
      6. 7.4.6 Device Modulation
        1. 7.4.6.1 BD Modulation
        2. 7.4.6.2 1SPW Modulation
        3. 7.4.6.3 Hybrid Modulation
      7. 7.4.7 Load Detect
        1. 7.4.7.1 Short Load Detect
        2. 7.4.7.2 Open Load Detect
    5. 7.5 Programming and Control
      1. 7.5.1 I2C Serial Communication Bus
      2. 7.5.2 Target Address
        1. 7.5.2.1 Random Write
        2. 7.5.2.2 Random Read
        3. 7.5.2.3 Sequential Write
        4. 7.5.2.4 Sequential Read
        5. 7.5.2.5 DSP Memory Book, Page and BQ update
        6. 7.5.2.6 Example Use
        7. 7.5.2.7 Checksum
          1. 7.5.2.7.1 Cyclic Redundancy Check (CRC) Checksum
          2. 7.5.2.7.2 Exclusive or (XOR) Checksum
      3. 7.5.3 Control via Software
        1. 7.5.3.1 Startup Procedures
        2. 7.5.3.2 Shutdown Procedures
        3. 7.5.3.3 Protection and Monitoring
          1. 7.5.3.3.1 Overcurrent Shutdown (OCSD)
          2. 7.5.3.3.2 DC Detect
          3. 7.5.3.3.3 Device Over Temperature Protection
          4. 7.5.3.3.4 Over Voltage Protection
          5. 7.5.3.3.5 Under Voltage Protection
          6. 7.5.3.3.6 Clock Fault
  10. Register Maps
    1. 8.1 CONTROL PORT Registers
  11. Application Information Disclaimer
    1. 9.1 Application Information
      1. 9.1.1 Bootstrap Capacitors
      2. 9.1.2 Inductor Selections
      3. 9.1.3 Power Supply Decoupling
      4. 9.1.4 Output EMI Filtering
    2. 9.2 Typical Application
      1. 9.2.1 2.0 (Stereo BTL) System
        1. 9.2.1.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Step 1: Hardware Integration
        2. 9.2.2.2 Step 2: Speaker Tuning
        3. 9.2.2.3 Step 3: Software Integration
      3. 9.2.3 MONO (PBTL) System
        1. 9.2.3.1 Design Requirements
      4. 9.2.4 Advanced 2.1 System (Two TAS5815 Devices)
  12. 10Power Supply Recommendations
    1. 10.1 DVDD Supply
    2. 10.2 PVDD Supply
  13. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 General Guidelines for Audio Amplifiers
      2. 11.1.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network
      3. 11.1.3 Optimizing Thermal Performance
        1. 11.1.3.1 Device, Copper, and Component Layout
        2. 11.1.3.2 Stencil Pattern
          1. 11.1.3.2.1 PCB footprint and Via Arrangement
          2. 11.1.3.2.2 Solder Stencil
    2. 11.2 Layout Example
  14. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  15. 13Revision History
  16. 14Mechanical and Packaging Information
    1. 14.1 Package Option Addendum

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Inductor Selections

It is required that the peak current is smaller than the OCP (Over current protection) value which is 7A (Typical), there are 3 cases which cause high peak current flow through inductor.

  1. During power up (idle state, no audio input), the duty cycle increases from 0 to θ.
    Equation 1. TAS5815
    Note:

    θ=0.5 (BD Modulation), 0.14 (1SPW Modulation), 0.14 (Hybrid Modulation). This formula just provide a rough estimation, suggest to measure the start-up current based on your LC filter.

    Table 9-1 Peak Current During Power Up
    PVDD L (uH) C (uF) Fsw (kHz) Ipeak_power_up
    24 4.7 0.68 384 6.07A
    24 4.7 0.68 768 3.25A
    24 10 0.68 384 3A
    24 10 0.68 768 1.55A
    12 4.7 0.68 384 3.32A
    12 10 0.68 384 1.55A
  2. During music playing, some audio burst signal (high frequency) with hard PVDD clipping causes PWM duty cycle increase dramatically. This is the worst case and it rarely happens.
    Equation 2. TAS5815
  3. Peak current due to Max output power. Ignore the ripple current flow through capacitor here.
Equation 3. TAS5815

Same PVDD and switching frequency, larger inductance means smaller idle current for lower power dissipation. It's suggested that inductor saturation current ISAT, is larger than the amplifier peak current during power-up and play audio.

Equation 4. TAS5815

In addition, the effective inductance at the peak current is required to be at least 80% of the inductance value in Table 9-2 to meet datasheet specifications.

Table 9-2 LC filter recommendation
Switching Frequency (kHz) Modulation Scheme Recommended Minimum Inductance (uH) for LC filter design
1024 1SPW 3.3 µH (or larger) + Capacitor (0.22uF~0.68uF)
768 4.7 µH (or larger) + Capacitor (0.22uF~0.68uF)
384 or 480 10 µH (or larger) +Capacitor (0.22uF~0.68uF)
384~1024 BD 8.2uH (or Larger) +Capacitor (0.22uF~0.68uF)

For inductor selection refer to LCFILTER-CALC-TOOL.