SLOSE73A June   2021  – November 2021 TAS6424E-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 ESD Ratings
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics: Bridge-Tied Load (BTL)
    7. 7.7 Typical Characteristics: Bridge-Tied Load (BTL, 384 kHz)
    8. 7.8 Typical Characteristics: Parallel Bridge-Tied (PBTL)
    9. 7.9 Typical Characteristics: Parallel Bridge-Tied Load (PBTL, 384 kHz)
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Serial Audio Port
        1. 9.3.1.1 I2S Mode
        2. 9.3.1.2 Left-Justified Timing
        3. 9.3.1.3 Right-Justified Timing
        4. 9.3.1.4 TDM Mode
        5. 9.3.1.5 Supported Clock Rates
        6. 9.3.1.6 Audio-Clock Error Handling
      2. 9.3.2  DC Blocking
      3. 9.3.3  Volume Control and Gain
      4. 9.3.4  High-Frequency Pulse-Width Modulator (PWM)
      5. 9.3.5  EMI Management Features
        1. 9.3.5.1 Spread-Spectrum
        2. 9.3.5.2 Channel-to-Channel Output Phase Control
      6. 9.3.6  Gate Drive
      7. 9.3.7  Power FETs
      8. 9.3.8  Load Diagnostics
        1. 9.3.8.1 DC Load Diagnostics
        2. 9.3.8.2 Line Output Diagnostics
        3. 9.3.8.3 AC Load Diagnostics
          1. 9.3.8.3.1 Impedance Magnitude Measurement
          2. 9.3.8.3.2 Impedance Phase Reference Measurement
          3. 9.3.8.3.3 Impedance Phase Measurement
      9. 9.3.9  Protection and Monitoring
        1. 9.3.9.1 Overcurrent Limit (ILIMIT)
        2. 9.3.9.2 Overcurrent Shutdown (ISD)
        3. 9.3.9.3 DC Detect
        4. 9.3.9.4 Clip Detect
        5. 9.3.9.5 Global Overtemperature Warning (OTW), Overtemperature Shutdown (OTSD)
        6. 9.3.9.6 Channel Overtemperature Warning [OTW(i)] and Shutdown [OTSD(i)]
        7. 9.3.9.7 Undervoltage (UV) and Power-On-Reset (POR)
        8. 9.3.9.8 Overvoltage (OV) and Load Dump
      10. 9.3.10 Power Supply
        1. 9.3.10.1 Vehicle-Battery Power-Supply Sequence
          1. 9.3.10.1.1 Power-Up Sequence
          2. 9.3.10.1.2 Power-Down Sequence
        2. 9.3.10.2 Boosted Power-Supply Sequence
      11. 9.3.11 Hardware Control Pins
        1. 9.3.11.1 FAULT
        2. 9.3.11.2 WARN
        3. 9.3.11.3 MUTE
        4. 9.3.11.4 STANDBY
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operating Modes and Faults
    5. 9.5 Programming
      1. 9.5.1 I2C Serial Communication Bus
      2. 9.5.2 I2C Bus Protocol
      3. 9.5.3 Random Write
      4. 9.5.4 Sequential Write
      5. 9.5.5 Random Read
      6. 9.5.6 Sequential Read
    6. 9.6 Register Maps
      1. 9.6.1  Mode Control Register (address = 0x00) [default = 0x00]
      2. 9.6.2  Miscellaneous Control 1 Register (address = 0x01) [default = 0x32]
      3. 9.6.3  Miscellaneous Control 2 Register (address = 0x02) [default = 0x62]
      4. 9.6.4  SAP Control (Serial Audio-Port Control) Register (address = 0x03) [default = 0x04]
      5. 9.6.5  Channel State Control Register (address = 0x04) [default = 0x55]
      6. 9.6.6  Channel 1 Through 4 Volume Control Registers (address = 0x05–0x08) [default = 0xCF]
      7. 9.6.7  DC Load Diagnostic Control 1 Register (address = 0x09) [default = 0x00]
      8. 9.6.8  DC Load Diagnostic Control 2 Register (address = 0x0A) [default = 0x11]
      9. 9.6.9  DC Load Diagnostic Control 3 Register (address = 0x0B) [default = 0x11]
      10. 9.6.10 DC Load Diagnostic Report 1 Register (address = 0x0C) [default = 0x00]
      11. 9.6.11 DC Load Diagnostic Report 2 Register (address = 0x0D) [default = 0x00]
      12. 9.6.12 DC Load Diagnostics Report 3 Line Output Register (address = 0x0E) [default = 0x00]
      13. 9.6.13 Channel State Reporting Register (address = 0x0F) [default = 0x55]
      14. 9.6.14 Channel Faults (Overcurrent, DC Detection) Register (address = 0x10) [default = 0x00]
      15. 9.6.15 Global Faults 1 Register (address = 0x11) [default = 0x00]
      16. 9.6.16 Global Faults 2 Register (address = 0x12) [default = 0x00]
      17. 9.6.17 Warnings Register (address = 0x13) [default = 0x20]
      18. 9.6.18 Pin Control Register (address = 0x14) [default = 0x00]
      19. 9.6.19 AC Load Diagnostic Control 1 Register (address = 0x15) [default = 0x00]
      20. 9.6.20 AC Load Diagnostic Control 2 Register (address = 0x16) [default = 0x00]
      21. 9.6.21 AC Load Diagnostic Impedance Report Ch1 through Ch4 Registers (address = 0x17–0x1A) [default = 0x00]
      22. 9.6.22 AC Load Diagnostic Phase Report High Register (address = 0x1B) [default = 0x00]
      23. 9.6.23 AC Load Diagnostic Phase Report Low Register (address = 0x1C) [default = 0x00]
      24. 9.6.24 AC Load Diagnostic STI Report High Register (address = 0x1D) [default = 0x00]
      25. 9.6.25 AC Load Diagnostic STI Report Low Register (address = 0x1E) [default = 0x00]
      26. 9.6.26 Miscellaneous Control 3 Register (address = 0x21) [default = 0x00]
      27. 9.6.27 Clip Control Register (address = 0x22) [default = 0x01]
      28. 9.6.28 Clip Window Register (address = 0x23) [default = 0x14]
      29. 9.6.29 Clip Warning Register (address = 0x24) [default = 0x00]
      30. 9.6.30 ILIMIT Status Register (address = 0x25) [default = 0x00]
      31. 9.6.31 Miscellaneous Control 4 Register (address = 0x26) [default = 0x40]
      32. 9.6.32 Miscellaneous Control 5 Register (address = 0x28) [default = 0x0A]
      33. 9.6.33 Spread-Spectrum Control 1 Register (address = 0x77) [default = 0x00]
      34. 9.6.34 Spread Spectrum Control 2 Register (address = 0x78) [default = 0x3F]
      35. 9.6.35 Spread Spectrum Control 3 Register (address = 0x79) [default = 0x00]
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 AM-Radio Band Avoidance
      2. 10.1.2 Parallel BTL Operation (PBTL)
      3. 10.1.3 Demodulation Filter Design
      4. 10.1.4 Line Driver Applications
    2. 10.2 Typical Application
      1. 10.2.1 BTL Application
        1. 10.2.1.1 Design Requirements
          1. 10.2.1.1.1 Communication
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Hardware Design
          2. 10.2.1.2.2 Digital Input and the Serial Audio Port
          3. 10.2.1.2.3 Bootstrap Capacitors
          4. 10.2.1.2.4 Output Reconstruction Filter
      2. 10.2.2 PBTL Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Electrical Connection of Thermal pad and Heat Sink
      2. 12.1.2 EMI Considerations
      3. 12.1.3 General Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3.10 Power Supply

The device has three power supply inputs, VDD, PVDD, and VBAT, which are described as follows:

  • VDD:

    This pin is a 3.3 V supply pin that provides power to the low voltage circuitry.

  • VBAT:

    This pin is a higher voltage supply that can be connected to the vehicle battery or the regulated voltage rail in a boosted system within the recommended limits. For best performance, this rail should be 10 V or higher. See the Section 7.5 table for the maximum supply voltage. This supply rail is used for higher voltage analog circuits but not the output FETs.

  • PVDD:

    This pin is a high-voltage supply that can either be connected to the vehicle battery or to another voltage rail in a boosted system. The PVDD pin supplies the power to the output FETs and can be within the recommended operating limits, even if that is below the VBAT supply, to allow for dynamic voltage systems.

Several on-chip regulators are included for generating the voltages necessary for the internal circuitry. The external pins are provided only for bypass capacitors to filter the supply and should not be used to power other circuits.

The device can withstand fortuitous open ground and power conditions within the absolute maximum ratings for the device. Fortuitous open ground usually occurs when a speaker wire is shorted to ground, allowing for a second ground path through the body diode in the output FETs.