SLOSE66 november   2020 TAS6424MS-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Serial Audio Port
        1. 9.3.1.1 I2S Mode
        2. 9.3.1.2 Left-Justified Timing
        3. 9.3.1.3 Right-Justified Timing
        4. 9.3.1.4 TDM Mode
        5. 9.3.1.5 Supported Clock Rates
        6. 9.3.1.6 Audio-Clock Error Handling
      2. 9.3.2  High-Pass Filter
      3. 9.3.3  Volume Control and Gain
      4. 9.3.4  High-Frequency Pulse-Width Modulator (PWM)
      5. 9.3.5  Channel-to-Channel Phase Control
      6. 9.3.6  Gate Drive
      7. 9.3.7  Power FETs
      8. 9.3.8  Load Diagnostics
        1. 9.3.8.1 DC Load Diagnostics
        2. 9.3.8.2 Line Output Diagnostics
        3. 9.3.8.3 AC Load Diagnostics
          1. 9.3.8.3.1 Impedance Magnitude Measurement
          2. 9.3.8.3.2 Impedance Phase Reference Measurement
          3. 9.3.8.3.3 Impedance Phase Measurement
      9. 9.3.9  Protection and Monitoring
        1. 9.3.9.1 Overcurrent Limit (ILIMIT)
        2. 9.3.9.2 Overcurrent Shutdown (ISD)
        3. 9.3.9.3 DC Detect
        4. 9.3.9.4 Clip Detect
        5. 9.3.9.5 Global Overtemperature Warning (OTW), Overtemperature Shutdown (OTSD)
        6. 9.3.9.6 Channel Overtemperature Warning [OTW(i)] and Shutdown [OTSD(i)]
        7. 9.3.9.7 Undervoltage (UV) and Power-On-Reset (POR)
        8. 9.3.9.8 Overvoltage (OV) and Load Dump
      10. 9.3.10 Power Supply
        1. 9.3.10.1 Vehicle-Battery Power-Supply Sequence
        2. 9.3.10.2 Power-Down Sequence
        3. 9.3.10.3 Boosted Power-Supply Sequence
      11. 9.3.11 Hardware Control Pins
        1. 9.3.11.1 FAULT
        2. 9.3.11.2 WARN
        3. 9.3.11.3 MUTE
        4. 9.3.11.4 STANDBY
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operating Modes and Faults
    5. 9.5 Programming
      1. 9.5.1 I2C Serial Communication Bus
      2. 9.5.2 I2C Bus Protocol
      3. 9.5.3 Random Write
      4. 9.5.4 Sequential Write
      5. 9.5.5 Random Read
      6. 9.5.6 Sequential Read
    6. 9.6 Register Maps
      1. 9.6.1  Mode Control Register (address = 0x00) [default = 0x00]
      2. 9.6.2  Miscellaneous Control 1 Register (address = 0x01) [default = 0x32]
      3. 9.6.3  Miscellaneous Control 2 Register (address = 0x02) [default = 0x62]
      4. 9.6.4  SAP Control (Serial Audio-Port Control) Register (address = 0x03) [default = 0x04]
      5. 9.6.5  Channel State Control Register (address = 0x04) [default = 0x55]
      6. 9.6.6  Channel 1 Through 4 Volume Control Registers (address = 0x05–0x08) [default = 0xCF]
      7. 9.6.7  DC Load Diagnostic Control 1 Register (address = 0x09) [default = 0x00]
      8. 9.6.8  DC Load Diagnostic Control 2 Register (address = 0x0A) [default = 0x11]
      9. 9.6.9  DC Load Diagnostic Control 3 Register (address = 0x0B) [default = 0x11]
      10. 9.6.10 DC Load Diagnostic Report 1 Register (address = 0x0C) [default = 0x00]
      11. 9.6.11 DC Load Diagnostic Report 2 Register (address = 0x0D) [default = 0x00]
      12. 9.6.12 DC Load Diagnostics Report 3 Line Output Register (address = 0x0E) [default = 0x00]
      13. 9.6.13 Channel State Reporting Register (address = 0x0F) [default = 0x55]
      14. 9.6.14 Channel Faults (Overcurrent, DC Detection) Register (address = 0x10) [default = 0x00]
      15. 9.6.15 Global Faults 1 Register (address = 0x11) [default = 0x00]
      16. 9.6.16 Global Faults 2 Register (address = 0x12) [default = 0x00]
      17. 9.6.17 Warnings Register (address = 0x13) [default = 0x20]
      18. 9.6.18 Pin Control Register (address = 0x14) [default = 0x00]
      19. 9.6.19 AC Load Diagnostic Control 1 Register (address = 0x15) [default = 0x00]
      20. 9.6.20 AC Load Diagnostic Control 2 Register (address = 0x16) [default = 0x00]
      21. 9.6.21 AC Load Diagnostic Impedance Report Ch1 through Ch4 Registers (address = 0x17–0x1A) [default = 0x00]
      22. 9.6.22 AC Load Diagnostic Phase Report High Register (address = 0x1B) [default = 0x00]
      23. 9.6.23 AC Load Diagnostic Phase Report Low Register (address = 0x1C) [default = 0x00]
      24. 9.6.24 AC Load Diagnostic STI Report High Register (address = 0x1D) [default = 0x00]
      25. 9.6.25 AC Load Diagnostic STI Report Low Register (address = 0x1E) [default = 0x00]
      26. 9.6.26 Miscellaneous Control 3 Register (address = 0x21) [default = 0x00]
      27. 9.6.27 Clip Control Register (address = 0x22) [default = 0x01]
      28. 9.6.28 Clip Window Register (address = 0x23) [default = 0x14]
      29. 9.6.29 Clip Warning Register (address = 0x24) [default = 0x00]
      30. 9.6.30 ILIMIT Status Register (address = 0x25) [default = 0x00]
      31. 9.6.31 Miscellaneous Control 4 Register (address = 0x26) [default = 0x40]
  10. 10Application Information Disclaimer
    1. 10.1 Application Information
      1. 10.1.1 AM-Radio Band Avoidance
      2. 10.1.2 Parallel BTL Operation (PBTL)
      3. 10.1.3 Demodulation Filter Design
      4. 10.1.4 Line Driver Applications
    2. 10.2 Typical Applications
      1. 10.2.1 BTL Application
        1. 10.2.1.1 Design Requirements
          1. 10.2.1.1.1 Communication
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Hardware Design
          2. 10.2.1.2.2 Digital Input and the Serial Audio Port
          3. 10.2.1.2.3 Bootstrap Capacitors
          4. 10.2.1.2.4 Output Reconstruction Filter
      2. 10.2.2 PBTL Application
        1. 10.2.2.1 Design Requirements
          1. 10.2.2.1.1 Detailed Design Procedure
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
    2. 13.2 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3.1.1 I2S Mode

I2S timing uses the FSYNC pin to define when the data being transmitted is for the left channel and when the data is for the right channel. The FSYNC pin is low for the left channel and high for the right channel. The bit clock, SCLK, runs at 32 × fS or 64 × fS and is used to clock in the data. A delay of one bit clock occurs from the time the FSYNC signal changes state to the first bit of data on the data lines. The data is presented in 2s-complement form (MSB-first). The data is valid on the rising edge of the bit clock and is used to clock in the data.