SLOSE88 December   2024 TAS6754-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 ESD Ratings
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Supply
        1. 7.3.1.1 Power-Supply Sequence
          1. 7.3.1.1.1 Power-Up Sequence
          2. 7.3.1.1.2 Power-Down Sequence
        2. 7.3.1.2 Device Initialization and Power-On-Reset (POR)
      2. 7.3.2 Serial Audio Port
        1. 7.3.2.1 Left-Justified Timing
        2. 7.3.2.2 I2S Mode
        3. 7.3.2.3 DSP Mode
        4. 7.3.2.4 TDM Mode
        5. 7.3.2.5 SDOUT - Data Output
        6. 7.3.2.6 Device Clocking
          1. 7.3.2.6.1 Clock Rates
          2. 7.3.2.6.2 Clock Halt Auto-recovery
          3. 7.3.2.6.3 Sample Rate on the Fly Change
        7. 7.3.2.7 Clock Error Handling
      3. 7.3.3 Digital Audio Processing
        1. 7.3.3.1 PVDD Foldback
        2. 7.3.3.2 High-Pass Filter
        3. 7.3.3.3 Analog Gain
        4. 7.3.3.4 Digital Volume Control
          1. 7.3.3.4.1 Auto Mute
        5. 7.3.3.5 Gain Compensation Biquads
        6. 7.3.3.6 Low Latency Signal Path
        7. 7.3.3.7 Full Feature Low Latency Path
      4. 7.3.4 Class-D operation and Spread Spectrum Control
        1. 7.3.4.1 1L Modulation
        2. 7.3.4.2 High-Frequency Pulse-Width Modulator (PWM)
        3. 7.3.4.3 Spread Spectrum Control
        4. 7.3.4.4 Gate Drive
        5. 7.3.4.5 Power FETs
      5. 7.3.5 Load Diagnostics
        1. 7.3.5.1 DC Load Diagnostics
          1. 7.3.5.1.1 Automatic DC Load Diagnostics at Device Initialization
          2. 7.3.5.1.2 Automatic DC load diagnostics during Hi-Z or PLAY
          3. 7.3.5.1.3 Manual start of DC load diagnostics
          4. 7.3.5.1.4 Short-to-Ground
          5. 7.3.5.1.5 Short-to-Power
          6. 7.3.5.1.6 Shorted-Load and Open-Load
        2. 7.3.5.2 Line Output Diagnostics
        3. 7.3.5.3 AC Load Diagnostics
          1. 7.3.5.3.1 Operating Principal
          2. 7.3.5.3.2 Stimulus
          3. 7.3.5.3.3 Load Impedance
          4. 7.3.5.3.4 Tweeter Detection
        4. 7.3.5.4 Real-Time Load Diagnostics
        5. 7.3.5.5 DC Resistance Measurement
      6. 7.3.6 Protection and Monitoring
        1. 7.3.6.1 Overcurrent Limit (Cycle-By-Cycle)
        2. 7.3.6.2 Overcurrent Shutdown
        3. 7.3.6.3 Current Sense
        4. 7.3.6.4 DC Detect
        5. 7.3.6.5 Digital Clip Detect
        6. 7.3.6.6 Charge Pump
        7. 7.3.6.7 Temperature Protection and Monitoring
          1. 7.3.6.7.1 Overtemperature Shutdown
          2. 7.3.6.7.2 Overtemperature Warning
          3. 7.3.6.7.3 Thermal Gain Foldback
        8. 7.3.6.8 Power Failures
      7. 7.3.7 Hardware Control Pins
        1. 7.3.7.1 FAULT Pin
        2. 7.3.7.2 PD Pin
        3. 7.3.7.3 STBY Pin
        4. 7.3.7.4 GPIO Pins
          1. 7.3.7.4.1 General Purpose Input
          2. 7.3.7.4.2 General Purpose Output
        5. 7.3.7.5 Advanced GPIO functions
          1. 7.3.7.5.1 Clock Synchronization
            1. 7.3.7.5.1.1 External SYNC signal (GPIO sync)
            2. 7.3.7.5.1.2 Synchronization through the audio serial clock (SCLK)
            3. 7.3.7.5.1.3 TAS6754-Q1 as clock source for external devices
    4. 7.4 Device Functional Modes
      1. 7.4.1 Internal Reporting Signals
        1. 7.4.1.1 Fault Signal
        2. 7.4.1.2 Warning Signal
      2. 7.4.2 Device States and Flags
        1. 7.4.2.1 Audio Channel States
          1. 7.4.2.1.1 SHUTDOWN State
          2. 7.4.2.1.2 DEEP SLEEP State
          3. 7.4.2.1.3 LOAD DIAG State
          4. 7.4.2.1.4 SLEEP State
          5. 7.4.2.1.5 Hi-Z State
          6. 7.4.2.1.6 PLAY State
          7. 7.4.2.1.7 FAULT State
          8. 7.4.2.1.8 Auto Recovery (AUTOREC) State
        2. 7.4.2.2 Status and Memory Registers
      3. 7.4.3 Fault Events
        1. 7.4.3.1 Power Fault Events
          1. 7.4.3.1.1 DVDD Power-On-Reset (POR)
          2. 7.4.3.1.2 DVDD Undervoltage Fault
          3. 7.4.3.1.3 VBAT Undervoltage Fault
          4. 7.4.3.1.4 PVDD Overvoltage Fault
          5. 7.4.3.1.5 PVDD Undervoltage Fault
        2. 7.4.3.2 Overtemperature Shutdown (OTSD) Event
        3. 7.4.3.3 Overcurrent Limit Fault Event
        4. 7.4.3.4 Overcurrent Shutdown Event
        5. 7.4.3.5 DC Fault Event
        6. 7.4.3.6 Clock Error Event
        7. 7.4.3.7 Charge Pump Fault Event
      4. 7.4.4 Warning Events
        1. 7.4.4.1 Overtemperature Warning Event
        2. 7.4.4.2 Overcurrent Limit Warning Event
        3. 7.4.4.3 Clip Detect Warning Event
    5. 7.5 Programming
      1. 7.5.1 I2C Serial Communication Bus
      2. 7.5.2 I2C Address Selection
      3. 7.5.3 I2C Bus Protocol
      4. 7.5.4 Random Write
      5. 7.5.5 Sequential Write
      6. 7.5.6 Random Read
      7. 7.5.7 Sequential Read
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
      1. 8.1.1 Reconstruction Filter Design
    2. 8.2 Typical Application
      1. 8.2.1 BTL Application
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Electrical Connection of Thermal pad and Heat Sink
        2. 8.4.1.2 EMI Considerations
        3. 8.4.1.3 General Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

TAS6754-Q1 DKQ Package,56-Pin HSSOP with exposed Thermal Pad Up,Top View Figure 4-1 DKQ Package,56-Pin HSSOP with exposed Thermal Pad Up,Top View
Table 4-1 Pin Functions
PIN I/O(1) DESCRIPTION
NAME NO.
AVDD_BYP 54 PWR Voltage regulator bypass. Connect 1 µF capacitor from AVDD to AVDD_RET
AVDD_RET 53 PWR AVDD bypass capacitor return
BST_1P 40 PWR Bootstrap capacitor connection pins for high-side gate driver
BST_2P 45 PWR Bootstrap capacitor connection pins for high-side gate driver
BST_3P 17 PWR Bootstrap capacitor connection pins for high-side gate driver
BST_4P 12 PWR Bootstrap capacitor connection pins for high-side gate driver
CP 7 PWR Top of main storage capacitor for charge pump. Connect 50V 330 nF capacitor from pin to PVDD
CPC_BOT 5 PWR Bottom of flying capacitor for charge pump. Connect 50V 100 nF capacitor from pin to CPC_TOP pin
CPC_TOP 6 PWR Top of flying capacitor for charge pump. Connect 50V 100 nF capacitor from pin to CPC_BOT pin
DVDD 32 PWR DVDD supply input.
FAULT 3 DO Reports a fault (active low, open drain), 100-kΩ internal pull-up resistor
FSYNC 26 DI Audio frame clock input
GND 28 GND Ground
GPIO_1 23 DI/O General purpose IO, function set by register programming
GPIO_2 22 DI/O General purpose IO, function set by register programming
GVDD_BYP 52 PWR Gate drive voltage regulator derived from VBAT input pin. Connect 2.2 µF capacitor to GVDD_RET
GVDD_RET 4 PWR GVDD bypass capacitor return
I2C_ADDR 35 DI I2C address pin
NC 51 NC No internal connection. Leave unconnected or connect to ground.
OUT_1M 37 PWR Negative output for the channel
OUT_1P 41 PWR Positive output for the channel
OUT_2M 48 PWR Negative output for the channel
OUT_2P 44 PWR Positive output for the channel
OUT_3M 20 PWR Negative output for the channel
OUT_3P 16 PWR Positive output for the channel
OUT_4M 10 PWR Negative output for the channel
OUT_4P 13 PWR Positive output for the channel
PD 2 DI Shuts down the device for minimal power draw (active low), 110 kΩ internal pull-down resistor
PGND 11,18,19,38,39,46,47 GND Ground
PLL_BYP 30 PWR PLL supply bypass, derived from DVDD input
PVDD 9,14,15,21,36,42,43,49 PWR PVDD voltage input (can be connected to battery)
PVDD_SNS 8 PWR PVDD input for sensitive internal circuits. Keep at the same voltage level as PVDD
SCL 33 DI I2C clock input
SCLK 27 DI Audio input serial clock
SDA 34 DI/O I2C data input and output
SDIN_1 25 DI TDM data input and audio I2S data input for channels 1 and 2
SDOUT_1 24 DO I2S / TDM data output
STBY 1 DI Enables low power DEEP SLEEP state (active low), 110 kΩ internal pull-down resistor
VBAT 50 PWR Battery voltage input
VR_DIG_BYP 31 PWR DSP core regulator output. Connect 1uF to GND.
VR_DIG_RET 29 PWR VR_DIG bypass capacitor return
VREG_BYP 55 PWR 5V Internal voltage regulator
VREG_RET 56 PWR VREG bypass capacitor return
Thermal Pad - GND Provides electrical and thermal connection for the device. Heatsink must be connected to GND.
(1) DI = digital input, DO = digital output, DI/O = digital input/output, GND = ground, NC = no connect, NO = negative output, PO = positive output, PWR = power