SCPS239B June   2021  – October 2023 TCA39306-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics (Translating Down)
    7. 5.7 Switching Characteristics (Translating Up)
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Definition of threshold voltage
      2. 7.1.2 Correct Device Set Up
      3. 7.1.3 Disconnecting a Target from the Main Bus Using the EN Pin
      4. 7.1.4 Supporting Remote Board Insertion to Backplane with TCA39306-Q1
      5. 7.1.5 Switch Configuration
      6. 7.1.6 Controller on Side 1 or Side 2 of Device
      7. 7.1.7 LDO and TCA39306-Q1 Concerns
      8. 7.1.8 Current Limiting Resistance on VREF2
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN) Pin
      2. 7.3.2 Voltage Translation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Applications of I2C
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Bidirectional Voltage Translation
        2. 8.2.2.2 Sizing Pullup Resistors
        3. 8.2.2.3 Bandwidth
      3. 8.2.3 Application Curve
    3. 8.3 Systems Examples: I3C Usage Considerations
      1. 8.3.1 I3C Bus Switching
      2. 8.3.2 I3C Bus Voltage Translation
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2 Support Resources

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