SCPS194F May   2009  – January 2023 TCA6416A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Reset Timing Requirements
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Voltage Translation
      2. 8.3.2 I/O Port
      3. 8.3.3 Interrupt Output ( INT)
      4. 8.3.4 Reset Input ( RESET)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
    6. 8.6 Register Maps
      1. 8.6.1 Device Address
      2. 8.6.2 Control Register and Command Byte
      3. 8.6.3 Register Descriptions
      4. 8.6.4 Bus Transactions
        1. 8.6.4.1 Writes
        2. 8.6.4.2 Reads
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Minimizing ICC When I/Os Control LEDs
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TCA6416AUNIT
PW (TSSOP)RTW (WQFN)ZQS
(BGA MICROSTAR JUNIOR)
24 PINS24 PINS24 PINS
RθJAJunction-to-ambient thermal resistance108.843.6159.2°C/W
RθJC(top)Junction-to-case (top) thermal resistance54.046.2138.2°C/W
RθJBJunction-to-board thermal resistance62.822.193.6°C/W
ψJTJunction-to-top characterization parameter11.11.510.7°C/W
ψJBJunction-to-board characterization parameter62.322.295.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A10.7N/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.