SCPS279 February   2022 TCA9537

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 I2C Bus Timing Requirements
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 I/O Port
      2. 8.3.2 Interrupt (INT) Output
      3. 8.3.3 RESET Input
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset
      2. 8.4.2 Powered-Up
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
        1. 8.5.1.1 Writes
        2. 8.5.1.2 Reads
      2. 8.5.2 Software Reset Call
    6. 8.6 Register Maps
      1. 8.6.1 Device Address
      2. 8.6.2 Control Register and Command Byte
      3. 8.6.3 Register Descriptions
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Minimizing ICC When I/Os Control LEDs
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
VIK Input diode clamp voltage II = -18 mA 1.65 V to 5.5 V –1.2 V
VPORR Power-on reset voltage, VCC rising VI = VCC or GND, IO = 0 1.2 1.6 V
VPORF Power-on reset voltage, VCC falling VI = VCC or GND, IO = 0 0.75 1 V
VIH High-level input voltage SDA,SCL 1.65 to 5.5 V 0.7 × VCC V
VIH High-level input voltage P ports, RESET 1.65 to 5.5 V 0.7 × VCC V
VIL Low-level input voltage SDA,SCL 1.65 to 5.5 V 0.4 × VCC V
VIL Low-level input voltage P ports, RESET 1.65 to 5.5 V 0.3 × VCC V
VOH P-port high-level output voltage(1) IOH = -8 mA 1.65 V 1.2 V
2.3 V 1.8
3 V 2.6
4.5 V 4.1
4.75 V 4.1
IOH = -10 mA 1.65 V 1
2.3 V 1.7
3 V 2.5
4.5 V 4
4.75 V 4
IOL Low-level output current SDA VOL = 0.4 V 1.65 V to 5.5 V 20 mA
P0-P3 VOL = 0.5 V 8
VOL = 0.7 V 10
IOL Low-level output current INT VOL = 0.4 V 1.65 V to 5.5 V 4 mA
II Input leakage current P ports VI = VCC 1.65 V to 5.5 V 0 ±1 µA
VI = 5.5 V ( TA ≤ 105 ℃) 0 V 0 ±1
VI = 5.5 V 0 V 0 ±2
VI = GND 1.65 V to 5.5 V 0 ±1
II Input leakage current SCL, SDA input leakage VI = VCC or GND 1.65 V to 5.5 V 0 ±1 µA
II Input leakage current RESET input leakage VI = VCC 1.65 V to 5.5 V 0 ±1 µA
VI = GND 0 ±1
ICC Quiescent current Operating mode VI = VCC, I/O = inputs, fSCL = 400 kHz, tr = tf = 300 ns 5.5 V 22 40 µA
3.6 V 11 20
2.7 V 8 10
1.95 V 5 8
ICC Quiescent current Operating mode VI  = VCC , I/O = inputs, fSCL = 1 MHz, tr = tf = 120 ns 5.5 V 100 µA
3.6 V 40
2.7 V 25
1.95 V 15
ICC Quiescent current Standby mode VI = VCC, IO = 0, I/0 = inputs, fSCL = 0 kHz 5.5 V 1.5 3.9 µA
3.6 V 0.9 2.2
2.7 V 0.6 1.8
1.95 V 0.6 1.5
CI Input pin capacitance SCL VI = VCC or GND 1.65 V to 5.5 V 4 5 pF
CIO Input-output pin capacitance SDA VIO = VCC or GND 1.65 V to 5.5 V 7 10 pF
P port VIO = VCC or GND 1.65 V to 5.5 V 7 10
(1) Each I/O must be externally limited to a maximum of 25 mA