SCPS259C December   2014  – January 2024 TCA9617B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7.   Parameter Measurement Information
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Bidirectional Level Translation
      2. 6.3.2 Low to High Transition Characteristics
      3. 6.3.3 High-to-Low Transition Characteristics
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Standard Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Pullup Resistor Sizing
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Star Application
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
      3. 7.2.3 Series Application
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
        3. 7.2.3.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision B (December 2018) to Revision C (January 2024)

  • Changed all instances of legacy terminology to controller and target where mentionedGo
  • Added weak pull-up resistor information on pin EN Go
  • Changed abs max voltages from 7V to 6.5VGo
  • Changed the Thermal Information for 8 DGKGo
  • Changed VIK MAX value of -1.2V to a MIN valueGo
  • Changed TPLH (B to A) by removing typical value.Go
  • Changed TPLH (A to B) for VCCB ≤ 3V by changing min value from 59ns to 50ns and removing typical valueGo
  • Changed TPLH (A to B) for VCCB > 3V by removing typical valueGo
  • Changed TPHL (B to A) by changing min value from 69ns to 32ns and removing typical valueGo
  • Changed TPHL (A to B) by changing min value from 68ns to 28ns and removing typical valueGo
  • Changed TTHL (B side) by changing max value from 13.8ns to 32ns and removing typical valueGo
  • Changed TTHL (B side) by changing max value from 11.3ns to 40ns and removing typical valueGo
  • Changed 0.3VCCA to: 30% of VCCA in the Overview Go
  • Changed A side falling below 0.7VCCA to: A side falling below 30% of VCCA Go
  • Changed goes below 0.7VCCB to: goes below 0.4V Go
  • Changed 0.3VCCA to: 30% of VCCA in the Low to High Transition Characteristics Go
  • Deleted Since the A-side does not have a static offset low voltage, no pedestal is seen on the A-side as shown in Figure 6-1 Go
  • Changed 0.7VCCA to 30% of VCCA in the High-to-Low Transition Characteristics Go
  • Changed isolate a badly behaved to separate a misbehaving in the Device Functional Modes Go
  • Changed 0.7VCCA to 30% of VCCA in the Application Information Go
  • Changed falls below 0.45V to: falls below 0.4VtGo
  • Changed (0.45V) to: (0.4V) in the Pullup Resistor Sizing Go

Changes from Revision A (December 2014) to Revision B (December 2018)

  • Changed the appearance of the DGK pin out image Go
  • Changed VCCA < VCCB To: VCCA ≤ VCCB in the Design Requirements listGo

Changes from Revision * (December 2014) to Revision A (December 2014)

  • Initial release of full version. Go