SCPS277B November   2022  – November 2023 TCAL6408

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 I2C Bus Timing Requirements
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Voltage Translation
      2. 7.3.2 I/O Port
      3. 7.3.3 Adjustable Output Drive Strength
      4. 7.3.4 Interrupt Output (INT)
      5. 7.3.5 Reset Input (RESET)
      6. 7.3.6 Software Reset Call
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
    6. 7.6 Register Maps
      1. 7.6.1 Device Address
      2. 7.6.2 Control Register and Command Byte
      3. 7.6.3 Register Descriptions
      4. 7.6.4 Bus Transactions
        1. 7.6.4.1 Writes
        2. 7.6.4.2 Reads
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Minimizing ICC When I/Os Control LEDs
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-On Reset Requirements
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision A (December 2022) to Revision B (November 2023)

  • Changed the Device Information table to the Package Information table. Deleted the Product Preview note.Go

Changes from Revision * (November 2022) to Revision A (December 2022)

  • Changed the document status from: Advanced Information to: Production dataGo