SCPS290A April 2024 – June 2024 TCAL6416R
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC (1) | Package | UNIT | |
---|---|---|---|
DTO (X2QFN) | |||
PINS | |||
RθJA | Junction-to-ambient thermal resistance | 150.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 48.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 89.4 | °C/W |
ΨJT | Junction-to-top characterization parameter | 1.0 | °C/W |
ΨJB | Junction-to-board characterization parameter | 89.2 | °C/W |