SLLSES7D March   2016  – October 2021 TCAN1042H , TCAN1042HG , TCAN1042HGV , TCAN1042HV

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings, Specifications
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Power Rating
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TXD Dominant Timeout (DTO)
      2. 9.3.2 Thermal Shutdown (TSD)
      3. 9.3.3 Undervoltage Lockout
      4. 9.3.4 Unpowered Device
      5. 9.3.5 Floating Terminals
      6. 9.3.6 CAN Bus Short Circuit Current Limiting
      7. 9.3.7 Digital Inputs and Outputs
        1. 9.3.7.1 Devices with VCC Only (Devices without the "V" Suffix):
        2. 9.3.7.2 Devices with VIO I/O Level Shifting (Devices with "V" Suffix):
    4. 9.4 Device Functional Modes
      1. 9.4.1 CAN Bus States
      2. 9.4.2 Normal Mode
      3. 9.4.3 Standby Mode
        1. 9.4.3.1 Remote Wake Request via Wake Up Pattern (WUP) in Standby Mode
      4. 9.4.4 Driver and Receiver Function Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Bus Loading, Length and Number of Nodes
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 CAN Termination
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (April 2017) to Revision D (October 2021)

Changes from Revision B (August 2016) to Revision C (April 2017)

  • Deleted Feature "Meets the December 17th, 2015 Draft of ISO 11898-2 Physical Layer Update"Go
  • Changed Feature From: "Meets the Released ISO 11898-2:2007 and ISO 11898-2:2003 Physical Layer Standards" To: "Meets the ISO 11898-2:2016 and ISO 11898-5:2007 Physical Layer Standards"Go
  • Changed Feature From: "All devices support 2 Mbps CAN FD.." To: "All Devices Support Classic CAN and 2 Mbps CAN FD.."Go
  • Changed Charged Device Model (CDM) From: ±750 To: ±1500 in the ESD Ratings tableGo
  • Changed TBD to values for the DRB (VSON) Package in the ESD Ratings tableGo
  • Added the Power Rating table Go
  • Changed VSYM in the Driver Electrical Characteristics tableGo
  • Changed VSYM_DC in the Driver Electrical Characteristics tableGo
  • Deleted "VI = 0.4 sin (4E6 π t) + 2.5 V" from the Test Condition of CI in the Receiver Electrical Characteristics tableGo
  • Deleted "VI = 0.4 sin (4E6 π t)" in the Test Condition of CID in the Receiver Electrical Characteristics tableGo
  • Added "-30 V ≤ VCM ≤ +30" to the Test Condition of RID and RIN in the Receiver Electrical Characteristics tableGo
  • Added Note 2 and Changed Table 9-2, BUS OUTPUT columnGo

Changes from Revision A (May 2016) to Revision B (August 2016)

  • Added devices: TCAN1042, TCAN1042G, TCAN1042GV, and TCAN1042V Go
  • Changed Feature From: Added Bus Fault Protection: ±70 V To: Bus Fault Protection: ±58 V (non-H variants) and ±70 V (H variants)Go
  • Added Feature "Available in SOIC(8) package and leadless VSON(8) package..."Go
  • Added new devices to the Device Comparison Table Go
  • Added the DRB package to the Thermal Information table Go
  • Changed the tMODE TYP value From: 1 µs To: 9 µS in the Switching Characteristics tableGo
  • Changed Section 9.4.3 section Go

Changes from Revision * (March 2016) to Revision A (May 2016)