SLLSES7D March   2016  – October 2021 TCAN1042H , TCAN1042HG , TCAN1042HGV , TCAN1042HV

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings, Specifications
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Power Rating
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TXD Dominant Timeout (DTO)
      2. 9.3.2 Thermal Shutdown (TSD)
      3. 9.3.3 Undervoltage Lockout
      4. 9.3.4 Unpowered Device
      5. 9.3.5 Floating Terminals
      6. 9.3.6 CAN Bus Short Circuit Current Limiting
      7. 9.3.7 Digital Inputs and Outputs
        1. 9.3.7.1 Devices with VCC Only (Devices without the "V" Suffix):
        2. 9.3.7.2 Devices with VIO I/O Level Shifting (Devices with "V" Suffix):
    4. 9.4 Device Functional Modes
      1. 9.4.1 CAN Bus States
      2. 9.4.2 Normal Mode
      3. 9.4.3 Standby Mode
        1. 9.4.3.1 Remote Wake Request via Wake Up Pattern (WUP) in Standby Mode
      4. 9.4.4 Driver and Receiver Function Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Bus Loading, Length and Number of Nodes
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 CAN Termination
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configurations and Functions

GUID-7F3130E9-9EB7-433A-A0AA-A788969E6981-low.gifFigure 6-1 D Package for Base, (H), (G) and (HG) Devices8 PIN (SOIC)Top View
GUID-D0274CA3-E38E-45A4-897C-945F35E5172A-low.gifFigure 6-3 D Package for (V), (HV), (GV), and (HGV) Devices8 PIN (SOIC)Top View
GUID-8D6E136E-4B64-4196-A51C-E85C53A91B57-low.gifFigure 6-2 DRB Package for Base, (H), (G) and (HG) Devices8 PIN (VSON)Top View
GUID-5801EAC3-B3C1-44EE-949E-071915C33518-low.gifFigure 6-4 DRB Package for (V), (HV), (GV), and (HGV) Devices8 PIN (VSON)Top View
Table 6-1 Pin Functions
PINSTYPEDESCRIPTION
NAME (H), (G), (HG)(V), (GV), (HV), (HGV)
TXD11DIGITAL INPUTCAN transmit data input (LOW for dominant and HIGH for recessive bus states)
GND(1)22GNDGround connection
VCC33POWERTransceiver 5-V supply voltage
RXD44DIGITAL OUTPUTCAN receive data output (LOW for dominant and HIGH for recessive bus states)
NC5——No Connect
VIO—5POWERTransceiver I/O level shifting supply voltage (Devices with "V" suffix only)
CANL66BUS I/OLow level CAN bus input/output line
CANH77BUS I/OHigh level CAN bus input/output line
STB88DIGITAL INPUTStandby Mode control input (active high)
(1) For DRB (VSON) package options, the thermal pad may be connected to GND in order to optimize the thermal characteristics of the package.