SLLSEV0F November   2017  – November 2023 TCAN1043-Q1 , TCAN1043G-Q1 , TCAN1043H-Q1 , TCAN1043HG-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Dissipation Ratings
    7. 6.7 Electrical Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Internal and External Indicator Flags (nFAULT and RXD)
      2. 8.3.2 Power-Up Flag (PWRON)
      3. 8.3.3 Wake-Up Request Flag (WAKERQ)
      4. 8.3.4 Wake-Up Source Recognition Flag (WAKESR)
      5. 8.3.5 Undervoltage Fault Flags
        1. 8.3.5.1 Undervoltage on VCC Fault
        2. 8.3.5.2 Undervoltage on VIO Fault
        3. 8.3.5.3 Undervoltage on VSUP Fault
      6. 8.3.6 CAN Bus Failure Fault Flag
      7. 8.3.7 Local Faults
        1. 8.3.7.1 TXD Dominant Timeout (TXD DTO)
        2. 8.3.7.2 TXD Shorted to RXD Fault
        3. 8.3.7.3 CAN Bus Dominant Fault
        4. 8.3.7.4 Thermal Shutdown (TSD)
        5. 8.3.7.5 RXD Recessive Fault
        6. 8.3.7.6 Undervoltage Lockout (UVLO)
        7. 8.3.7.7 Unpowered Device
        8. 8.3.7.8 Floating Terminals
        9. 8.3.7.9 CAN Bus Short Circuit Current Limiting
    4. 8.4 Device Functional Modes
      1. 8.4.1 CAN Bus States
      2. 8.4.2 Normal Mode
      3. 8.4.3 Silent Mode
      4. 8.4.4 Standby Mode
      5. 8.4.5 Go-to-Sleep Mode
      6. 8.4.6 Sleep Mode with Remote Wake and Local Wake Up Requests
        1. 8.4.6.1 Remote Wake Request via Wake Up Pattern (WUP)
        2. 8.4.6.2 Local Wake Up (LWU) via WAKE Input Terminal
      7. 8.4.7 Driver and Receiver Function Tables
      8. 8.4.8 Digital Inputs and Outputs
      9. 8.4.9 INH (Inhibit) Output
  10. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Bus Loading, Length and Number of Nodes
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 CAN Termination
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout
        1. 9.4.1.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.4 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.