SLLSFL8A July   2021  – December 2021 TCAN1046AV-Q1 , TCAN1048AV-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description Continued
  6. 6 Device Comparison
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  ESD Ratings — IEC Specifications
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Thermal Characteristics
    6. 8.6  Supply Characteristics
    7. 8.7  Dissipation Ratings
    8. 8.8  Electrical Characteristics
    9. 8.9  Switching Characteristics
    10. 8.10 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Pin Description
        1. 10.3.1.1 TXD1 and TXD2
        2. 10.3.1.2 GND1 and GND2
        3. 10.3.1.3 VCC
        4. 10.3.1.4 RXD1 and RXD2
        5. 10.3.1.5 VIO
        6. 10.3.1.6 CANH and CANL
        7. 10.3.1.7 STB1, STB2, nSTB1, and nSTB2 (Standby)
      2. 10.3.2 CAN Bus States
      3. 10.3.3 TXD Dominant Timeout (DTO)
      4. 10.3.4 CAN Bus Short Circuit Current Limiting
      5. 10.3.5 Thermal Shutdown (TSD)
      6. 10.3.6 Undervoltage Lockout
      7. 10.3.7 Unpowered Device
      8. 10.3.8 Floating pins
    4. 10.4 Device Functional Modes
      1. 10.4.1 Operating Modes
      2. 10.4.2 Normal Mode
      3. 10.4.3 Standby Mode
        1. 10.4.3.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
      4. 10.4.4 Driver and Receiver Function
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
        1. 11.2.1.1 CAN Termination
      2. 11.2.2 Detailed Design Procedures
        1. 11.2.2.1 Bus Loading, Length and Number of Nodes
      3. 11.2.3 Application Curves
    3. 11.3 System Examples
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Receiving Notification of Documentation Updates
    2. 14.2 Support Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5 Thermal Characteristics

THERMAL METRIC(1) TCAN1046AV-Q1 / TCAN1048AV-Q1 UNIT
D (SOIC) DYY (SOT) DMT (VSON)
RθJA Junction-to-ambient thermal resistance 75.8 87.2 38.1 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 35.8 35.2 38.7 ℃/W
RθJB Junction-to-board thermal resistance 37.4 31.6 15.0 ℃/W
ΨJT Junction-to-top characterization parameter 6.6 11.2 2.0 ℃/W
ΨJB Junction-to-board characterization parameter 37.0 31.5 15.0 ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance – – 5.9 ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.