SLLSET0D March   2016  – April 2021 TCAN1051-Q1 , TCAN1051G-Q1 , TCAN1051GV-Q1 , TCAN1051H-Q1 , TCAN1051HG-Q1 , TCAN1051HGV-Q1 , TCAN1051HV-Q1 , TCAN1051V-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings, Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Power Rating
    7. 6.7 Electrical Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 TXD Dominant Timeout (DTO)
      2. 8.3.2 Thermal Shutdown (TSD)
      3. 8.3.3 Undervoltage Lockout
      4. 8.3.4 Unpowered Device
      5. 8.3.5 Floating Terminals
      6. 8.3.6 CAN Bus Short Circuit Current Limiting
      7. 8.3.7 Digital Inputs and Outputs
        1. 8.3.7.1 5-V VCC Only Devices (Devices without the "V" Suffix):
        2. 8.3.7.2 5 V VCC with VIO I/O Level Shifting (Devices with the "V" Suffix):
    4. 8.4 Device Functional Modes
      1. 8.4.1 CAN Bus States
      2. 8.4.2 Normal Mode
      3. 8.4.3 Silent Mode
      4. 8.4.4 Driver and Receiver Function Tables
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Bus Loading, Length and Number of Nodes
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 CAN Termination
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-74F7C3F1-3619-4CE8-8DED-7D798C020602-low.gifFigure 5-1 D Package for (H), (G) and (HG) Devices 8 PIN (SOIC)Top View
GUID-BA8DAE32-A562-4FA4-A797-AB176DE4C99E-low.gifFigure 5-3 D Package for (V), (GV), (HV), and (HGV) Devices8 PIN (SOIC)Top View
GUID-96D2F588-7EA1-4C60-953A-CE81607F1CCC-low.gifFigure 5-2 DRB Package for (H), (G), and (HG) Devices8 PIN (VSON)Top View
GUID-57DB66D7-C186-4EFC-8AE0-E1B23B339D22-low.gifFigure 5-4 DRB Package for (V), (GV), (HV) and (HGV) Devices8 PIN (VSON)Top View
Table 5-1 Pin Functions
PINS TYPE DESCRIPTION
NAME (H), (G), (HG) (V), (GV), (HV), (HGV)
TXD 1 1 DIGITAL INPUT CAN transmit data input (LOW for dominant and HIGH for recessive bus states)
GND(1) 2 2 GND Ground connection
VCC 3 3 POWER Transceiver 5-V supply voltage
RXD 4 4 DIGITAL OUTPUT CAN receive data output (LOW for dominant and HIGH for recessive bus states)
NC 5 — — No Connect
VIO — 5 POWER Transceiver I/O level shifting supply voltage (Devices with "V" suffix only)
CANL 6 6 BUS I/O Low level CAN bus input/output line
CANH 7 7 BUS I/O High level CAN bus lnput/output line
S 8 8 DIGITAL INPUT Silent Mode control input (active high)
(1) For DRB (VSON) package options, the thermal pad may be connected to GND in order to optimize the thermal characteristics of the package.