SLLSFM8C February   2021  – October 2024 TCAN1057A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings Table — IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Characteristics
    6. 5.6 Supply Characteristics
    7. 5.7 Dissipation Ratings
    8. 5.8 Electrical Characteristics
    9. 5.9 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pin Description
        1. 7.3.1.1 TXD
        2. 7.3.1.2 GND
        3. 7.3.1.3 VCC
        4. 7.3.1.4 RXD
        5. 7.3.1.5 VIO
        6. 7.3.1.6 CANH and CANL
        7. 7.3.1.7 S (Silent)
      2. 7.3.2 CAN Bus States
      3. 7.3.3 TXD Dominant Timeout (DTO)
      4. 7.3.4 CAN Bus short-circuit current limiting
      5. 7.3.5 Thermal Shutdown (TSD)
      6. 7.3.6 Undervoltage Lockout
      7. 7.3.7 Unpowered Device
      8. 7.3.8 Floating pins
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Modes
      2. 7.4.2 Normal Mode
      3. 7.4.3 Silent Mode
      4. 7.4.4 Driver and Receiver Function
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 CAN Termination
      2. 8.2.2 Detailed Design Procedures
        1. 8.2.2.1 Bus Loading, Length and Number of Nodes
      3. 8.2.3 Application Curves
      4. 8.2.4 System Examples
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

  • Place the protection and filtering circuitry close to the bus connector, J1, to prevent transients, ESD, and noise from propagating onto the board. This layout example shows a optional transient voltage suppression (TVS) diode, D1, which may be implemented if the system-level requirements exceed the specified rating of the transceiver. This example also shows optional bus filter 0.1μF capacitors C4 and C5.
  • Design the bus protection components in the direction of the signal path. Do not force the transient current to divert from the signal path to reach the protection device.
  • Decoupling 0.1μF capacitors should be placed as close as possible to the supply pins VCC and VIO of transceiver.
  • Use at least two vias for supply and ground connections of bypass capacitors and protection devices to minimize trace and via inductance.
    Note:

    High frequency current follows the path of least impedance and not the path of least resistance.

  • This layout example shows how split termination could be implemented on the CAN node. The termination is split into two 60Ω resistors, R4 and R5, with the center or split tap of the termination connected to ground via a 1-100nF capacitor C3. Split termination provides common-mode filtering for the bus. See CAN Termination, CAN Bus Short Circuit Current Limiting, and 2 for information on termination concepts and power ratings needed for the termination resistor(s).