SLLSFM8C February   2021  – October 2024 TCAN1057A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings Table — IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Characteristics
    6. 5.6 Supply Characteristics
    7. 5.7 Dissipation Ratings
    8. 5.8 Electrical Characteristics
    9. 5.9 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pin Description
        1. 7.3.1.1 TXD
        2. 7.3.1.2 GND
        3. 7.3.1.3 VCC
        4. 7.3.1.4 RXD
        5. 7.3.1.5 VIO
        6. 7.3.1.6 CANH and CANL
        7. 7.3.1.7 S (Silent)
      2. 7.3.2 CAN Bus States
      3. 7.3.3 TXD Dominant Timeout (DTO)
      4. 7.3.4 CAN Bus short-circuit current limiting
      5. 7.3.5 Thermal Shutdown (TSD)
      6. 7.3.6 Undervoltage Lockout
      7. 7.3.7 Unpowered Device
      8. 7.3.8 Floating pins
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Modes
      2. 7.4.2 Normal Mode
      3. 7.4.3 Silent Mode
      4. 7.4.4 Driver and Receiver Function
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 CAN Termination
      2. 8.2.2 Detailed Design Procedures
        1. 8.2.2.1 Bus Loading, Length and Number of Nodes
      3. 8.2.3 Application Curves
      4. 8.2.4 System Examples
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.5 Thermal Shutdown (TSD)

If the junction temperature of the device exceeds the thermal shutdown threshold, TTSD, the device turns off the CAN driver circuitry and blocks the TXD to bus transmission path. The shutdown condition is cleared when the junction temperature of the device drops below TTSD. The CAN bus pins are biased to VCC/2 during a TSD fault and the receiver to RXD path remains operational. The device TSD circuit includes hysteresis which prevents the CAN driver output from oscillating during a TSD fault.