SLLSF31A May   2021  – December 2021 TCAN1162-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings IEC Specification
    4. 7.4 Recomended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Power Supply Characteristics
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  VSUP Pin
      2. 9.3.2  VFLT Pin
      3. 9.3.3  Digital Inputs and Outputs
        1. 9.3.3.1 TXD Pin
        2. 9.3.3.2 RXD Pin
        3. 9.3.3.3 TS Pin
      4. 9.3.4  Digital Control and Timing
      5. 9.3.5  VIO Pin
      6. 9.3.6  GND
      7. 9.3.7  INH Pin
      8. 9.3.8  WAKE Pin
      9. 9.3.9  CAN Bus Pins
      10. 9.3.10 Local Faults
        1. 9.3.10.1 TXD Dominant Timeout (TXD DTO)
        2. 9.3.10.2 Thermal Shutdown (TSD)
        3. 9.3.10.3 Under/Over Voltage Lockout
        4. 9.3.10.4 Unpowered Devices
        5. 9.3.10.5 Floating Terminals
        6. 9.3.10.6 CAN Bus Short Circuit Current Limiting
        7. 9.3.10.7 Sleep Wake Error Timer
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operating Mode Description
        1. 9.4.1.1 Normal Mode
        2. 9.4.1.2 Standby Mode
        3. 9.4.1.3 Sleep Mode
          1. 9.4.1.3.1 Remote Wake Request via Wake-Up Pattern (WUP)
          2. 9.4.1.3.2 Local Wake-Up (LWU) via WAKE Input Terminal
        4. 9.4.1.4 Fail-safe Mode
      2. 9.4.2 CAN Transceiver
        1. 9.4.2.1 CAN Transceiver Operation
        2. 9.4.2.2 CAN Transceiver Modes
          1. 9.4.2.2.1 CAN Off Mode
          2. 9.4.2.2.2 CAN Autonomous: Inactive and Active
          3. 9.4.2.2.3 CAN Active
        3. 9.4.2.3 Driver and Receiver Function Tables
        4. 9.4.2.4 CAN Bus States
  10. 10Application Information
    1. 10.1 Application Information Disclaimer
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Bus Loading, Length and Number of Nodes
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 CAN Termination
    3. 10.3 Application Curves
  11. 11Power Supply Requirements
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Thermal Information

THERMAL METRIC(1) DMT (VSON) UNIT
14 PINS
RΘJA Junction-to-ambient thermal resistance 37.7 °C/W
RΘJC(top) Junction-to-case (top) thermal resistance 37.9 °C/W
RΘJB Junction-to-board thermal resistance 14.2 °C/W
ΨJT Junction-to-top characterization parameter 0.7 °C/W
ΨJB Junction-to-board characterization parameter 14.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.