SLLSF83A May   2021  – November 2021 TCAN11623-Q1 , TCAN11625-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configurations and Functions (TCAN11625)
  7. 7 Pin Configurations and Functions (TCAN11623)
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 ESD Ratings IEC Specification
    4. 8.4 Recomended Operating Conditions
    5. 8.5 Thermal Information
    6. 8.6 Power Supply Characteristics
    7. 8.7 Electrical Characteristics
    8. 8.8 Switching Characteristics
    9. 8.9 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  VSUP Pin
      2. 10.3.2  VCCOUT Pin
      3. 10.3.3  VFLT Pin
      4. 10.3.4  VLDO3 Pin
      5. 10.3.5  Digital Inputs and Outputs
        1. 10.3.5.1 TXD Pin
        2. 10.3.5.2 RXD Pin
        3. 10.3.5.3 TS Pin
      6. 10.3.6  Digital Control and Timing
      7. 10.3.7  VIO Pin
      8. 10.3.8  GND
      9. 10.3.9  INH Pin
      10. 10.3.10 WAKE Pin
      11. 10.3.11 nRST Pin
      12. 10.3.12 CAN Bus Pins
      13. 10.3.13 Local Faults
        1. 10.3.13.1 TXD Dominant Timeout (TXD DTO)
        2. 10.3.13.2 Thermal Shutdown (TSD)
        3. 10.3.13.3 Under/Over Voltage Lockout
        4. 10.3.13.4 Unpowered Devices
        5. 10.3.13.5 Floating Terminals
        6. 10.3.13.6 CAN Bus Short Circuit Current Limiting
        7. 10.3.13.7 Sleep Wake Error Timer
    4. 10.4 Device Functional Modes
      1. 10.4.1 Operating Mode Description
        1. 10.4.1.1 Normal Mode
        2. 10.4.1.2 Standby Mode
        3. 10.4.1.3 Sleep Mode
          1. 10.4.1.3.1 Remote Wake Request via Wake-Up Pattern (WUP)
          2. 10.4.1.3.2 Local Wake-Up (LWU) via WAKE Input Terminal
        4. 10.4.1.4 Reset Mode
        5. 10.4.1.5 Fail-safe Mode
      2. 10.4.2 CAN Transceiver
        1. 10.4.2.1 CAN Transceiver Operation
        2. 10.4.2.2 CAN Transceiver Modes
          1. 10.4.2.2.1 CAN Off Mode
          2. 10.4.2.2.2 CAN Autonomous: Inactive and Active
          3. 10.4.2.2.3 CAN Active
        3. 10.4.2.3 Driver and Receiver Function Tables
        4. 10.4.2.4 CAN Bus States
  11. 11Application Information
    1. 11.1 Application Information Disclaimer
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
        1. 11.2.1.1 Bus Loading, Length and Number of Nodes
      2. 11.2.2 Detailed Design Procedures
        1. 11.2.2.1 CAN Termination
    3. 11.3 Application Curves
  12. 12Power Supply Requirements
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Receiving Notification of Documentation Updates
    3. 14.3 Support Resources
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13.1 Layout Guidelines

Place the protection and filtering circuitry as close to the bus connector to prevent transients, ESD and noise from propagating onto the board. The layout example provides information on components around the device itself. Transient voltage suppression (TVS) device can be added for extra protection. The production solution can be either bi-directional TVS diode or varistor with ratings matching the application requirements. This example also shows optional bus filter capacitors.

Design the bus protection components in the direction of the signal path. Do not force the transient current to divert from the signal path to reach the protection device. Use supply and ground planes to provide low inductance.

Note:

A high-frequency current follows the path of least impedance and not the path of least resistance.

Use at least two vias for supply and ground connections of bypass capacitors and protection devices to minimize trace and via inductance.

  • Bypass and bulk capacitors should be placed as close as possible to the supply terminals of transceiver.
  • Bus termination: this layout example shows split termination. This is where the termination is split into two resistors with the center or split tap of the termination connected to ground via capacitor. Split termination provides common mode filtering for the bus. When bus termination is placed on the board instead of directly on the bus, additional care must be taken to ensure the terminating node is not removed from the bus thus also removing the termination.