SLLSFE3 December   2021 TCAN1164-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configurations and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 ESD Ratings IEC Specification
    4. 8.4 Recomended Operating Conditions
    5. 8.5 Thermal Information
    6. 8.6 Power Supply Characteristics
    7. 8.7 Electrical Characteristics
    8. 8.8 Switching Characteristics
    9. 8.9 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  VSUP Pin
      2. 10.3.2  VCCOUT Pin
      3. 10.3.3  Digital Inputs and Outputs
        1. 10.3.3.1 TXD Pin
        2. 10.3.3.2 RXD Pin
      4. 10.3.4  GND
      5. 10.3.5  nRST Pin
      6. 10.3.6  SDO
      7. 10.3.7  nCS Pin
      8. 10.3.8  SCLK
      9. 10.3.9  SDI
      10. 10.3.10 CAN Bus Pins
      11. 10.3.11 Local Faults
        1. 10.3.11.1 TXD Dominant Timeout (TXD DTO)
        2. 10.3.11.2 Thermal Shutdown (TSD)
        3. 10.3.11.3 Under/Over Voltage Lockout
        4. 10.3.11.4 Unpowered Devices
        5. 10.3.11.5 Floating Terminals
        6. 10.3.11.6 CAN Bus Short Circuit Current Limiting
        7. 10.3.11.7 Sleep Wake Error Timer
      12. 10.3.12 Watchdog
        1. 10.3.12.1 Watchdog Error Counter
        2. 10.3.12.2 Watchdog SPI Control Programming
        3. 10.3.12.3 Watchdog Timing
        4. 10.3.12.4 Question and Answer Watchdog
          1. 10.3.12.4.1 WD Question and Answer Basic information
          2. 10.3.12.4.2 Question and Answer Register and Settings
          3. 10.3.12.4.3 WD Question and Answer Value Generation
        5. 10.3.12.5 Question and Answer WD Example
          1. 10.3.12.5.1 Example configuration for desired behavior
          2. 10.3.12.5.2 Example of performing a question and answer sequence
      13. 10.3.13 Bus Fault Detection and Communication
    4. 10.4 Device Functional Modes
      1. 10.4.1 Operating Mode Description
        1. 10.4.1.1 Normal Mode
        2. 10.4.1.2 Silent Mode
        3. 10.4.1.3 Standby Mode
          1. 10.4.1.3.1 Wake-Up Pattern (WUP) Detection in Standby Mode
        4. 10.4.1.4 Reset Mode
        5. 10.4.1.5 Fail-safe Mode
      2. 10.4.2 CAN Transceiver
        1. 10.4.2.1 CAN Transceiver Operation
        2. 10.4.2.2 CAN Transceiver Modes
          1. 10.4.2.2.1 CAN Off Mode
          2. 10.4.2.2.2 CAN Autonomous: Inactive and Active
          3. 10.4.2.2.3 CAN Active
        3. 10.4.2.3 Driver and Receiver Function Tables
        4. 10.4.2.4 CAN Bus States
    5. 10.5 Programming
      1. 10.5.1 Serial Peripheral Interface (SPI) Communication
      2. 10.5.2 Serial Clock Input (SCLK)
      3. 10.5.3 Serial Data Input (SDI)
      4. 10.5.4 Serial Data Output (SDO)
      5. 10.5.5 Chip Select Not (nCS)
      6. 10.5.6 Registers
        1. 10.5.6.1  DEVICE_ID_y Register (Address = 0h + formula) [reset = xxh]
        2. 10.5.6.2  REV_ID_MAJOR Register (Address = 8h) [reset = 00h]
        3. 10.5.6.3  REV_ID_MINOR Register (Address = 9h) [reset = 00h]
        4. 10.5.6.4  SPI_RSVD_x Register (Address = Ah + formula) [reset = 00h]
        5. 10.5.6.5  Scratch_Pad_SPI Register (Address = Fh) [reset = 00h]
        6. 10.5.6.6  MODE_CNTRL Register (Address = 10h) [reset = 04h]
        7. 10.5.6.7  WD_CONFIG_1 Register (Address = 13h) [reset = 54h]
        8. 10.5.6.8  WD_CONFIG_2 Register (Address = 14h) [reset = 02h]
        9. 10.5.6.9  WD_INPUT_TRIG Register (Address = 15h) [reset = 00h]
        10. 10.5.6.10 WD_QA_CONFIG Register (Address = 2Dh) [reset = 0h]
        11. 10.5.6.11 WD_QA_ANSWER Register (Address = 2Eh) [reset = 0h]
        12. 10.5.6.12 WD_QA_QUESTION Register (Address = 2Fh) [reset = 0h]
        13. 10.5.6.13 STATUS (address = 40h) [reset = 00h]
        14. 10.5.6.14 INT_GLOBAL Register (Address = 50h) [reset = 0h]
        15. 10.5.6.15 INT_1 Register (Address = 51h) [reset = 0h]
        16. 10.5.6.16 INT_2 Register (Address = 52h) [reset = 40h]
        17. 10.5.6.17 INT_3 Register (Address 53h) [reset = 0h]
        18. 10.5.6.18 INT_CANBUS Register (Address = 54h) [reset = 0h]
        19. 10.5.6.19 INT_ENABLE_1 Register (Address = 56h) [reset = F3h]
        20. 10.5.6.20 INT_ENABLE_2 Register (Address = 57h) [reset = 3Fh]
        21. 10.5.6.21 INT_ENABLE_3 Register (Address =58h) [reset = 80h]
        22. 10.5.6.22 INT_ENABLE_CANBUS Register (Address = 59h) [reset = 7Fh]
        23. 10.5.6.23 INT_RSVD_y Register (Address = 5Ah + formula) [reset = 00h]
  11. 11Application Information Disclaimer
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
        1. 11.2.1.1 Bus Loading, Length and Number of Nodes
      2. 11.2.2 Detailed Design Procedures
        1. 11.2.2.1 CAN Termination
    3. 11.3 Application Curves
  12. 12Power Supply Requirements
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Receiving Notification of Documentation Updates
    3. 14.3 Support Resources
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13.1 Layout Guidelines

Place the protection and filtering circuitry as close to the bus connector to prevent transients, ESD and noise from propagating onto the board. The layout example provides information on components around the device itself. Transient voltage suppression (TVS) device can be added for extra protection. The production solution can be either bi-directional TVS diode or varistor with ratings matching the application requirements. This example also shows optional bus filter capacitors.

Design the bus protection components in the direction of the signal path. Do not force the transient current to divert from the signal path to reach the protection device. Use supply and ground planes to provide low inductance.

Note:

A high-frequency current follows the path of least impedance and not the path of least resistance.

Use at least two vias for supply and ground connections of bypass capacitors and protection devices to minimize trace and via inductance.

  • Bypass and bulk capacitors should be placed as close as possible to the supply terminals of transceiver.
  • Bus termination: this layout example shows split termination. This is where the termination is split into two resistors with the center or split tap of the termination connected to ground via capacitor. Split termination provides common mode filtering for the bus. When bus termination is placed on the board instead of directly on the bus, additional care must be taken to ensure the terminating node is not removed from the bus thus also removing the termination.