SLLSFF2B February   2022  – October 2024 TCAN1462-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configurations and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings, IEC Transients
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Characteristics
    6. 6.6  Supply Characteristics
    7. 6.7  Dissipation Ratings
    8. 6.8  Electrical Characteristics
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Signal Improvement
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pin Description
        1. 8.3.1.1 TXD
        2. 8.3.1.2 GND
        3. 8.3.1.3 VCC
        4. 8.3.1.4 RXD
        5. 8.3.1.5 VIO (only for TCAN1462V-Q1)
        6. 8.3.1.6 CANH and CANL
        7. 8.3.1.7 STB (Standby)
      2. 8.3.2 CAN Bus States
      3. 8.3.3 TXD Dominant Timeout (DTO)
      4. 8.3.4 CAN Bus Short-circuit Current Limiting
      5. 8.3.5 Thermal Shutdown (TSD)
      6. 8.3.6 Undervoltage Lockout
      7. 8.3.7 Unpowered Device
      8. 8.3.8 Floating pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes
      2. 8.4.2 Normal Mode
      3. 8.4.3 Standby Mode
        1. 8.4.3.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
      4. 8.4.4 Driver and Receiver Function
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 CAN Termination
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Bus Loading, Length and Number of Nodes
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configurations and Functions

TCAN1462-Q1 SOIC (D) and SOT-23 (DDF)Package, 8 Pin(Top View) Figure 5-1 SOIC (D) and SOT-23 (DDF)
Package, 8 Pin
(Top View)
TCAN1462-Q1 VSON (DRB) Package, 8 Pin(Top View) Figure 5-2 VSON (DRB) Package, 8 Pin
(Top View)
Table 5-1 Pin Functions
PINS TYPE DESCRIPTION
NAME NO.
TXD 1 Digital Input CAN transmit data input, integrated pull-up
GND 2 GND Ground connection
VCC 3 Supply 5 V supply voltage
RXD 4 Digital Output CAN receive data output, tristate when powered off
VIO 5 Supply Logic supply voltage
NC -- No Connect (not internally connected); Devices without VIO
CANL 6 Bus IO Low-level CAN bus input/output line
CANH 7 Bus IO High-level CAN bus input/output line
STB 8 Digital Input Standby mode control input, integrated pull-up
Thermal Pad (VSON only) — Electrically connected to GND, connect the thermal pad to the printed circuit board (PCB) ground plane for thermal relief