SLLSFE5C March   2020  – December 2022 TCAN1463-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  ESD Ratings - IEC Specifications
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Power Dissipation Ratings
    7. 7.7  Power Supply Characteristics
    8. 7.8  Electrical Characteristics
    9. 7.9  Timing Requirements
    10. 7.10 Switching Characteristics
    11. 7.11 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
      1. 9.1.1 Signal Improvement
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Supply Pins
        1. 9.3.1.1 VSUP Pin
        2. 9.3.1.2 VCC Pin
        3. 9.3.1.3 VIO Pin
      2. 9.3.2 Digital Inputs and Outputs
        1. 9.3.2.1 TXD Pin
        2. 9.3.2.2 RXD Pin
        3. 9.3.2.3 nFAULT Pin
        4. 9.3.2.4 EN Pin
        5. 9.3.2.5 nSTB Pin
        6. 9.3.2.6 INH_MASK Pin
      3. 9.3.3 GND
      4. 9.3.4 INH Pin
      5. 9.3.5 WAKE Pin
      6. 9.3.6 CAN Bus Pins
      7. 9.3.7 Faults
        1. 9.3.7.1 Internal and External Fault Indicators
          1. 9.3.7.1.1 Power-Up (PWRON Flag)
          2. 9.3.7.1.2 Wake-Up Request (WAKERQ Flag)
          3. 9.3.7.1.3 Undervoltage Faults
            1. 9.3.7.1.3.1 Undervoltage on VSUP
            2. 9.3.7.1.3.2 Undervoltage on VCC
            3. 9.3.7.1.3.3 Undervoltage on VIO
          4. 9.3.7.1.4 CAN Bus Fault (CBF Flag)
          5. 9.3.7.1.5 TXD Clamped Low (TXDCLP Flag)
          6. 9.3.7.1.6 TXD Dominant State Timeout (TXDDTO Flag)
          7. 9.3.7.1.7 TXD Shorted to RXD Fault (TXDRXD Flag)
          8. 9.3.7.1.8 CAN Bus Dominant Fault (CANDOM Flag)
      8. 9.3.8 Local Faults
        1. 9.3.8.1 TXD Clamped Low (TXDCLP)
        2. 9.3.8.2 TXD Dominant Timeout (TXD DTO)
        3. 9.3.8.3 Thermal Shutdown (TSD)
        4. 9.3.8.4 Undervoltage Lockout (UVLO)
        5. 9.3.8.5 Unpowered Devices
        6. 9.3.8.6 Floating Terminals
        7. 9.3.8.7 CAN Bus Short-Circuit Current Limiting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operating Mode Description
        1. 9.4.1.1 Normal Mode
        2. 9.4.1.2 Silent Mode
        3. 9.4.1.3 Standby Mode
        4. 9.4.1.4 Go-To-Sleep Mode
        5. 9.4.1.5 Sleep Mode
          1. 9.4.1.5.1 Remote Wake Request via Wake-Up Pattern (WUP)
          2. 9.4.1.5.2 Local Wake-Up (LWU) via WAKE Input Terminal
      2. 9.4.2 CAN Transceiver
        1. 9.4.2.1 CAN Transceiver Operation
          1. 9.4.2.1.1 CAN Transceiver Modes
            1. 9.4.2.1.1.1 CAN Off Mode
            2. 9.4.2.1.1.2 CAN Autonomous: Inactive and Active
            3. 9.4.2.1.1.3 CAN Active
          2. 9.4.2.1.2 Driver and Receiver Function Tables
          3. 9.4.2.1.3 CAN Bus States
  10. 10Application Information Disclaimer
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
      2. 10.1.2 Design Requirements
        1. 10.1.2.1 Bus Loading, Length and Number of Nodes
      3. 10.1.3 Detailed Design Procedure
        1. 10.1.3.1 CAN Termination
      4. 10.1.4 Application Curves
      5. 10.1.5 Power Supply Recommendations
      6. 10.1.6 Layout
        1. 10.1.6.1 Layout Guidelines
        2. 10.1.6.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1.6.1 Layout Guidelines

The layout example provides information on components around the device. Place the protection and filtering circuitry as close to the bus connector, J1, to prevent transients, ESD and noise from propagating onto the board. Transient voltage suppression (TVS) device can be added for extra protection, shown as D1. The production solution can be either a bi-directional TVS diode or varistor with ratings matching the application requirements. This example also shows optional bus filter capacitors C6 and C7. A series common-mode choke (CMC) is placed on the CANH and CANL lines between the device and connector J1.

Design the bus protection components in the direction of the signal path. Do not force the transient current to divert from the signal path to reach the protection device. Use supply and ground planes to provide low inductance. Note that high-frequency currents follow the path of least impedance and not the path of least resistance. Use at least two vias for supply and ground connections of bypass capacitors and protection devices to minimize trace and via inductance.

  • Bypass and bulk capacitors should be placed as close as possible to the supply terminals of transceiver, examples are C1 on VCC, C2 on VIO, and C3 and C4 on the VSUP supply.
  • VIO pin of the transceiver is connected to the microcontroller IO supply voltage 'µC V'.
  • Bus termination: this layout example shows split termination. This is where the termination is split into two resistors, R3 and R4, with the center or split tap of the termination connected to ground via capacitor C5. Split termination provides common-mode filtering for the bus. When bus termination is placed on the board instead of directly on the bus, additional care must be taken to make sure the terminating node is not removed from the bus thus also removing the termination.
  • INH, pin 7, can have a 100 kΩ resistor (R1) to ground.
  • WAKE, pin 9, can recognize either a rising or a falling edge of a wake signal and is usually connected to an external switch. It should be configured as shown with C8 which is a 22 nF capacitor to GND where R5 is 33 kΩ and R6 is 3 kΩ.