SLLSFW8 June   2024 TCAN1472-Q1

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configurations and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings, IEC Transients
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Characteristics
    6. 5.6 Supply Characteristics
    7. 5.7 Dissipation Ratings
    8. 5.8 Electrical Characteristics
    9. 5.9 Switching Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Signal Improvement
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pin Description
        1. 7.3.1.1 TXD
        2. 7.3.1.2 GND
        3. 7.3.1.3 VCC
        4. 7.3.1.4 RXD
        5. 7.3.1.5 VIO (TCAN1472V-Q1 only)
        6. 7.3.1.6 CANH and CANL
        7. 7.3.1.7 STB (Standby)
      2. 7.3.2 CAN Bus States
      3. 7.3.3 TXD Dominant Timeout (DTO)
      4. 7.3.4 CAN Bus Short-circuit Current Limiting
      5. 7.3.5 Thermal Shutdown (TSD)
      6. 7.3.6 Undervoltage Lockout
      7. 7.3.7 Unpowered Device
      8. 7.3.8 Floating pins
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Modes
      2. 7.4.2 Normal Mode
      3. 7.4.3 Standby Mode
        1. 7.4.3.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
      4. 7.4.4 Driver and Receiver Function
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 CAN Termination
      2. 8.2.2 Detailed Design Procedures
        1. 8.2.2.1 Bus Loading, Length and Number of Nodes
    3. 8.3 System Examples
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DDF|8
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Signal Improvement

Signal improvement is an additional capability added to CAN FD transceiver that enhances the maximum data rate achievable in complex star topologies by minimizing signal ringing. Signal ringing is the result of reflections caused by impedance mismatch at various points in a CAN network due to the nodes that act as stubs.

An example of a complex network is shown in Figure 7-1.

TCAN1472-Q1 CAN Network: Star topologyFigure 7-1 CAN Network: Star topology

Recessive-to-dominant signal edge is usually clean and driven by the transmitter. Transmitter output impedance of CAN transceiver is approximately 50Ω and matches to the network characteristic impedance. For a regular CAN FD transceiver, dominant-to-recessive edge is when the driver output impedance goes to approximately 60kΩ and signal reflected back experiences impedance mismatch which causes ringing. TCAN1472-Q1 resolves this issue by TX-based Signal improvement capability (SIC). The device continues to drive the bus recessive until tSIC_TX_base so that reflections die down and recessive bit is clean at sampling point. In the active recessive phase, transmitter output impedance is low (approximately 100Ω). After this phase is over and device goes to passive recessive phase, driver output impedance goes to high-Z. This phenomenon is explained with Figure 7-2.

For more information on the TI signal improvement technology, and how it compares with similar devices in market, please refer to the white paper How Signal Improvement Capability Unlocks the Real Potential of CAN-FD Transceivers.

TCAN1472-Q1 TX based
                                        SIC Figure 7-2 TX based SIC