SLLSFW8A June   2024  – December 2024 TCAN1472-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings, IEC Transients
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Characteristics
    6. 5.6  Supply Characteristics
    7. 5.7  Dissipation Ratings
    8. 5.8  Electrical Characteristics
    9. 5.9  Switching Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Signal Improvement
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pin Description
        1. 7.3.1.1 TXD
        2. 7.3.1.2 GND
        3. 7.3.1.3 VCC
        4. 7.3.1.4 RXD
        5. 7.3.1.5 VIO (TCAN1472V-Q1 only)
        6. 7.3.1.6 CANH and CANL
        7. 7.3.1.7 STB (Standby)
      2. 7.3.2 CAN Bus States
      3. 7.3.3 TXD Dominant Timeout (DTO)
      4. 7.3.4 CAN Bus Short-circuit Current Limiting
      5. 7.3.5 Thermal Shutdown (TSD)
      6. 7.3.6 Undervoltage Lockout
      7. 7.3.7 Unpowered Device
      8. 7.3.8 Floating pins
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Modes
      2. 7.4.2 Normal Mode
      3. 7.4.3 Standby Mode
        1. 7.4.3.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
      4. 7.4.4 Driver and Receiver Function
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 CAN Termination
      2. 8.2.2 Detailed Design Procedures
        1. 8.2.2.1 Bus Loading, Length and Number of Nodes
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Characteristics

THERMAL METRIC(1) TCAN1472(V)-Q1 UNIT
D (SOIC) DDF (SOT) DRB (VSON)
RΘJA Junction-to-ambient thermal resistance 113.6 129.2 52.3 ℃/W
RΘJC(top) Junction-to-case (top) thermal resistance 52.5 55.0 58.4 ℃/W
RΘJB Junction-to-board thermal resistance 61.1 48.1 24.7 ℃/W
ΨJT Junction-to-top characterization parameter 7.4 1.7 1.7 ℃/W
ΨJB Junction-to-board characterization parameter 60.2 47.9 24.6 ℃/W
RΘJC(bot) Junction-to-case (bottom) thermal resistance - – 8.9 ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.