SLLSFV7 July   2024 TCAN1473A-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings - IEC Specifications
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Dissipation Ratings
    7. 5.7  Power Supply Characteristics
    8. 5.8  Electrical Characteristics
    9. 5.9  Timing Requirements
    10. 5.10 Switching Characteristics
    11. 5.11 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Supply Pins
        1. 7.3.1.1 VSUP Pin
        2. 7.3.1.2 VCC Pin
        3. 7.3.1.3 VIO Pin
      2. 7.3.2 Digital Inputs and Outputs
        1. 7.3.2.1 TXD Pin
        2. 7.3.2.2 RXD Pin
        3. 7.3.2.3 nFAULT Pin
        4. 7.3.2.4 EN Pin
        5. 7.3.2.5 nSTB Pin
        6. 7.3.2.6 INH_MASK Pin
      3. 7.3.3 GND
      4. 7.3.4 INH Pin
      5. 7.3.5 WAKE Pin
      6. 7.3.6 CAN Bus Pins
      7. 7.3.7 Faults
        1. 7.3.7.1 Internal and External Fault Indicators
          1. 7.3.7.1.1 Power-Up (PWRON Flag)
          2. 7.3.7.1.2 Wake-Up Request (WAKERQ Flag)
          3. 7.3.7.1.3 Undervoltage Faults
            1. 7.3.7.1.3.1 Undervoltage on VSUP
            2. 7.3.7.1.3.2 Undervoltage on VCC
            3. 7.3.7.1.3.3 Undervoltage on VIO
          4. 7.3.7.1.4 CAN Bus Fault (CBF Flag)
          5. 7.3.7.1.5 TXD Clamped Low (TXDCLP Flag)
          6. 7.3.7.1.6 TXD Dominant State Timeout (TXDDTO Flag)
          7. 7.3.7.1.7 TXD Shorted to RXD Fault (TXDRXD Flag)
          8. 7.3.7.1.8 CAN Bus Dominant Fault (CANDOM Flag)
      8. 7.3.8 Local Faults
        1. 7.3.8.1 TXD Clamped Low (TXDCLP)
        2. 7.3.8.2 TXD Dominant Timeout (TXD DTO)
        3. 7.3.8.3 Thermal Shutdown (TSD)
        4. 7.3.8.4 Undervoltage Lockout (UVLO)
        5. 7.3.8.5 Unpowered Devices
        6. 7.3.8.6 Floating Terminals
        7. 7.3.8.7 CAN Bus Short-Circuit Current Limiting
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Mode Description
        1. 7.4.1.1 Normal Mode
        2. 7.4.1.2 Silent Mode
        3. 7.4.1.3 Standby Mode
        4. 7.4.1.4 Go-To-Sleep Mode
        5. 7.4.1.5 Sleep Mode
          1. 7.4.1.5.1 Remote Wake Request via Wake-Up Pattern (WUP)
          2. 7.4.1.5.2 Local Wake-Up (LWU) via WAKE Input Terminal
      2. 7.4.2 CAN Transceiver
        1. 7.4.2.1 CAN Transceiver Operation
          1. 7.4.2.1.1 CAN Transceiver Modes
            1. 7.4.2.1.1.1 CAN Off Mode
            2. 7.4.2.1.1.2 CAN Autonomous: Inactive and Active
            3. 7.4.2.1.1.3 CAN Active
          2. 7.4.2.1.2 Driver and Receiver Function Tables
          3. 7.4.2.1.3 CAN Bus States
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
      1. 8.1.1 Typical Application
      2. 8.1.2 Design Requirements
        1. 8.1.2.1 Bus Loading, Length and Number of Nodes
      3. 8.1.3 Detailed Design Procedure
        1. 8.1.3.1 CAN Termination
      4. 8.1.4 Application Curves
      5. 8.1.5 Power Supply Recommendations
      6. 8.1.6 Layout
        1. 8.1.6.1 Layout Guidelines
        2. 8.1.6.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • DYY|14
  • DMT|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

Figure 4-1 D and DYY Packages, 14 Pin (SOIC)
and (SOT) (Top View)
Figure 4-2 DMT Package, 14 Pin (VSON)
(Top View)
PINS TYPE (1) DESCRIPTION
NAME NO.
TXD 1 I CAN transmit data input, integrated pull-up
GND 2 GND Ground connection
VCC 3 P 5V transceiver supply
RXD 4 O CAN receive data output, tri-state when VIO < UVIO
VIO 5 P I/O supply voltage
EN 6 I Enable input for mode control, integrated pull-down
INH 7 O Inhibit pin to control system voltage regulators and supplies, high-voltage
nFAULT 8 O Fault output, inverted logic
WAKE 9 I Local WAKE input terminal, high voltage
VSUP 10 P High-voltage supply from battery
INH_MASK 11 I INH_MASK pin used to activate/deactivate INH functionality. Internal pull-down to GND. Can be left floating or connected to GND if INH_MASK functionality is not needed. Do not connect to power supply.
CANL 12 I/O Low-level CAN bus input/output line
CANH 13 I/O High-level CAN bus input/output line
nSTB 14 I Standby mode control input, integrated pull-down
Thermal Pad — Connect the thermal pad to the printed circuit board (PCB) ground plane for thermal relief
(1) I = input, O = output, P = power, GND = ground