SLLSG00 April   2024 TCAN2450-Q1 , TCAN2451-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Device and Documentation Support
    1. 5.1 Documentation Support
      1. 5.1.1 CAN Transceiver Physical Layer Standards:
      2. 5.1.2 EMC Requirements:
      3. 5.1.3 Conformance Test Requirements:
      4. 5.1.4 Related Documentation
    2. 5.2 Receiving Notification of Documentation Updates
    3. 5.3 Support Resources
    4. 5.4 Trademarks
    5. 5.5 Electrostatic Discharge Caution
    6. 5.6 Glossary
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Tape and Reel Information
    2. 7.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHB|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.