SLLSG00 April   2024 TCAN2450-Q1 , TCAN2451-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Device and Documentation Support
    1. 5.1 Documentation Support
      1. 5.1.1 CAN Transceiver Physical Layer Standards:
      2. 5.1.2 EMC Requirements:
      3. 5.1.3 Conformance Test Requirements:
      4. 5.1.4 Related Documentation
    2. 5.2 Receiving Notification of Documentation Updates
    3. 5.3 Support Resources
    4. 5.4 Trademarks
    5. 5.5 Electrostatic Discharge Caution
    6. 5.6 Glossary
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Tape and Reel Information
    2. 7.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHB|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.