SLLSF19 December   2017 TCAN4420

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Power Supply Characteristics
    7. 6.7 AC and DC Electrical Characteristics
    8. 6.8 Timing Requirements
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 TXD Dominant Time Out (DTO)
      2. 8.3.2 CAN Bus Short Circuit Current Limiting
      3. 8.3.3 Thermal Shutdown
      4. 8.3.4 Under Voltage Lockout (UVLO) and Unpowered Device
        1. 8.3.4.1 VIO Supply PIN
    4. 8.4 Device Functional Modes
      1. 8.4.1 Polarity Configuration
      2. 8.4.2 Normal Polarity Mode
      3. 8.4.3 Reverse Polarity Mode
      4. 8.4.4 Driver and Receiver Function
      5. 8.4.5 Floating Terminals
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Bus Loading, Length and Number of Nodes
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 CAN Termination
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Information

THERMAL METRIC(1)TCAN4420UNIT
SOIC
8 PINS
RθJA Junction-to-ambient thermal resistance 114 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 48.2 °C/W
RθJB Junction-to-board thermal resistance 59.2 °C/W
ΨJT Junction-to-top characterization parameter 9.5 °C/W
ΨJB Junction-to-board characterization parameter 58.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance – °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.