Refer to the PDF data sheet for device specific package drawings
TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.
The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture.
The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.
The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.
Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.
The TDA3x ADAS processor is qualified according to AEC-Q100 standard.
PART NUMBER | PACKAGE | BODY SIZE |
---|---|---|
TDA3LAxABFQ1 | FCBGA (367) | 15.0 mm × 15.0 mm |
TDA3MVxABFQ1 | FCBGA (367) | 15.0 mm × 15.0 mm |
TDA3MAxABFQ1 | FCBGA (367) | 15.0 mm × 15.0 mm |
TDA3MDxABFQ1 | FCBGA (367) | 15.0 mm × 15.0 mm |
TDA3LXxABFQ1 | FCBGA (367) | 15.0 mm × 15.0 mm |
Figure 1-1 is functional block diagram of the superset.
Changes from April 1, 2019 to February 29, 2020 (from G Revision (March 2019) to H Revision)
Table 3-1 shows a comparison between devices, highlighting the differences.
FEATURES | DEVICE | ||||||||
---|---|---|---|---|---|---|---|---|---|
TDA3MVx | TDA3MAx | TDA3MDx | TDA3LXx | TDA3LAx | |||||
Features | |||||||||
CTRL_WKUP_STD_FUSE_DIE_ID_2 [31:24] Base PN register bit field value(4)(5) | TDA3MV: 147 (0x93) | TDA3MA:
149 (0x95) |
TDA3MD:
157 (0x9D) |
TDA3LX: 154 (0x9A) | TDA3LA:
151 (0x97) |
||||
TDA3MV-FD: 148 (0x94) | TDA3LX–FD: 150 (0x96) | ||||||||
Processors/ Accelerators | |||||||||
Speed Grades | R, S | D, R, S | D, R, S | D, S | D, R, S | B, D, R, S | B, D, R, S | ||
C66x VLIW DSP | DSP1 | Yes | Yes | Yes | Yes | Yes | |||
DSP2 | Yes | Yes | Yes | No | No | ||||
Display Subsystem | VOUT1 | Yes | No | No | Yes | No | |||
SD_DAC | Yes | No | No | Yes | No | ||||
Embedded Vision Engine (EVE) | EVE1 | Yes | Yes | No | Yes | Yes | |||
Dual Arm Cortex-M4 Image Processing Unit (IPU) | IPU1 | Yes | Yes | Yes | Yes | Yes | |||
Imaging Subsystem Processor (ISS) with MIPI CSI-2 and CPI ports | ISP | Yes | No | No | Yes | No | |||
WDR & Mesh LDC(1) | Yes | No | No | Yes | No | ||||
CAL_A | Yes | Yes | Yes | Yes | Yes | ||||
CAL_B | Yes | Yes | Yes | Yes | Yes | ||||
LVDS-RX | Yes | Yes | Yes | Yes | Yes | ||||
CPI | Yes | Yes | Yes | Yes | Yes | ||||
Video Input Port (VIP) | VIP1 | vin1a | Yes | Yes | Yes | Yes | Yes | ||
vin1b | Yes | Yes | Yes | Yes | Yes | ||||
vin2a | Yes | Yes | Yes | Yes | Yes | ||||
vin2b | Yes | Yes | Yes | Yes | Yes | ||||
Program/Data Storage | |||||||||
On-Chip Shared Memory (RAM) | OCMC_RAM1 | 512kB | 512kB | 512kB | 256kB | 256kB | |||
General-Purpose Memory Controller (GPMC) | GPMC | Yes | Yes | Yes | Yes | Yes | |||
LPDDR2/DDR2/DDR3/DDR3L Memory Controller | EMIF1
(optional with SECDED) |
up to 2GB | up to 2GB | up to 2GB | up to 2GB | up to 2GB | |||
Peripherals | |||||||||
Controller Area Network Interface (CAN) | DCAN1 | Yes | Yes | Yes | Yes | Yes | |||
MCAN | Yes(3) | Yes | Yes | Yes | Yes(3) | Yes | Yes | ||
Enhanced DMA (EDMA) | EDMA | Yes | Yes | Yes | Yes | Yes | |||
Embedded 8 channel ADC | ADC | Yes | Yes | Yes | Yes | Yes | |||
Ethernet Subsystem (Ethernet SS) | GMAC_SW[0] | RGMII Only | RGMII Only | RGMII Only | RGMII Only | RGMII Only | |||
GMAC_SW[1] | RGMII Only | RGMII Only | RGMII Only | RGMII Only | RGMII Only | ||||
General-Purpose IO (GPIO) | GPIO | Up to 126 | Up to 126 | Up to 126 | Up to 126 | Up to 126 | |||
Inter-Integrated Circuit Interface (I2C) | I2C | 2 | 2 | 2 | 2 | 2 | |||
System Mailbox Module | MAILBOX | 2 | 2 | 2 | 2 | 2 | |||
Multichannel Audio Serial Port (McASP) | McASP1 | 16 serializers | 16 serializers | 16 serializers | 16 serializers | 16 serializers | |||
McASP2 | 6 serializers | 6 serializers | 6 serializers | 6 serializers | 6 serializers | ||||
McASP3 | 6 serializers | 6 serializers | 6 serializers | 6 serializers | 6 serializers | ||||
MultiMedia Card/Secure Digital/Secure Digital Input Output Interface (MMC/SD/SDIO) | MMC | 1x SDIO 4b | 1x SDIO 4b | 1x SDIO 4b | 1x SDIO 4b | 1x SDIO 4b | |||
Multichannel Serial Peripheral Interface (McSPI) | McSPI | 4 | 4 | 4 | 4 | 4 | |||
Quad SPI (QSPI) | QSPI | Yes | Yes | Yes | Yes | Yes | |||
Spinlock Module | SPINLOCK | Yes | Yes | Yes | Yes | Yes | |||
Timers, General-Purpose | TIMER | 8 | 8 | 8 | 8 | 8 | |||
Dual Clock Comparators (DCC) | DCC | 7 | 7 | 7 | 7 | 7 | |||
Pulse-Width Modulation Subsystem (PWMSS) | PWMSS1 | Yes | Yes | Yes | Yes | Yes | |||
Universal Asynchronous Receiver/Transmitter (UART) | UART | 3 | 3 | 3 | 3 | 3 | |||
Memory Cyclic Redundancy Check (CRC) | CRC | Yes | Yes | Yes | Yes | Yes | |||
TESOC (LBIST/PBIST) | LBIST/PBIST | Yes | Yes | Yes | Yes | Yes | |||
Error Signaling Module (ESM) | ESM | Yes | Yes | Yes | Yes | Yes | |||
Real Time Interrupt (RTI) | RTI | 5 | 5 | 5 | 5 | 5 |
Companion Products for TDA3 Review products that are frequently purchased or used in conjunction with this product.
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