SPRSP96A March   2024  – September 2024 TDA4AEN-Q1 , TDA4VEN-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      10
      2.      11
    3. 5.3 Signal Descriptions
      1.      13
      2. 5.3.1  CPSW3G
        1. 5.3.1.1 MAIN Domain
          1.        16
          2.        17
          3.        18
          4.        19
      3. 5.3.2  CPTS
        1. 5.3.2.1 MAIN Domain
          1.        22
      4. 5.3.3  CSI-2
        1. 5.3.3.1 MAIN Domain
          1.        25
          2.        26
          3.        27
          4.        28
      5. 5.3.4  DDRSS
        1. 5.3.4.1 MAIN Domain
          1.        31
      6. 5.3.5  DSI
        1. 5.3.5.1 MAIN Domain
          1.        34
      7. 5.3.6  DSS
        1. 5.3.6.1 MAIN Domain
          1.        37
      8. 5.3.7  ECAP
        1. 5.3.7.1 MAIN Domain
          1.        40
          2.        41
          3.        42
      9. 5.3.8  Emulation and Debug
        1. 5.3.8.1 MAIN Domain
          1.        45
        2. 5.3.8.2 MCU Domain
          1.        47
      10. 5.3.9  EPWM
        1. 5.3.9.1 MAIN Domain
          1.        50
          2.        51
          3.        52
          4.        53
      11. 5.3.10 EQEP
        1. 5.3.10.1 MAIN Domain
          1.        56
          2.        57
          3.        58
      12. 5.3.11 GPIO
        1. 5.3.11.1 MAIN Domain
          1.        61
          2.        62
        2. 5.3.11.2 MCU Domain
          1.        64
      13. 5.3.12 GPMC
        1. 5.3.12.1 MAIN Domain
          1.        67
      14. 5.3.13 I2C
        1. 5.3.13.1 MAIN Domain
          1.        70
          2.        71
          3.        72
          4.        73
          5.        74
        2. 5.3.13.2 MCU Domain
          1.        76
        3. 5.3.13.3 WKUP Domain
          1.        78
      15. 5.3.14 MCAN
        1. 5.3.14.1 MAIN Domain
          1.        81
          2.        82
        2. 5.3.14.2 MCU Domain
          1.        84
          2.        85
      16. 5.3.15 MCASP
        1. 5.3.15.1 MAIN Domain
          1.        88
          2.        89
          3.        90
          4.        91
          5.        92
      17. 5.3.16 MCSPI
        1. 5.3.16.1 MAIN Domain
          1.        95
          2.        96
          3.        97
        2. 5.3.16.2 MCU Domain
          1.        99
          2.        100
      18. 5.3.17 MDIO
        1. 5.3.17.1 MAIN Domain
          1.        103
      19. 5.3.18 MMC
        1. 5.3.18.1 MAIN Domain
          1.        106
          2.        107
          3.        108
      20. 5.3.19 OLDI
        1. 5.3.19.1 MAIN Domain
          1.        111
      21. 5.3.20 OSPI
        1. 5.3.20.1 MAIN Domain
          1.        114
      22. 5.3.21 Power Supply
        1.       116
      23. 5.3.22 Reserved
        1.       118
      24. 5.3.23 SERDES
        1. 5.3.23.1 MAIN Domain
          1.        121
          2.        122
          3.        123
      25. 5.3.24 System and Miscellaneous
        1. 5.3.24.1 Boot Mode Configuration
          1. 5.3.24.1.1 MAIN Domain
            1.         127
        2. 5.3.24.2 Clock
          1. 5.3.24.2.1 MCU Domain
            1.         130
          2. 5.3.24.2.2 WKUP Domain
            1.         132
        3. 5.3.24.3 System
          1. 5.3.24.3.1 MAIN Domain
            1.         135
          2. 5.3.24.3.2 MCU Domain
            1.         137
          3. 5.3.24.3.3 WKUP Domain
            1.         139
        4. 5.3.24.4 VMON
          1.        141
      26. 5.3.25 TIMER
        1. 5.3.25.1 MAIN Domain
          1.        144
        2. 5.3.25.2 MCU Domain
          1.        146
        3. 5.3.25.3 WKUP Domain
          1.        148
      27. 5.3.26 UART
        1. 5.3.26.1 MAIN Domain
          1.        151
          2.        152
          3.        153
          4.        154
          5.        155
          6.        156
          7.        157
        2. 5.3.26.2 MCU Domain
          1.        159
        3. 5.3.26.3 WKUP Domain
          1.        161
      28. 5.3.27 USB
        1. 5.3.27.1 MAIN Domain
          1.        164
          2.        165
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings for AEC - Q100 Qualified Devices in the AMW Package
    3. 6.3 Power-On Hours (POH)
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Operating Performance Points
    6. 6.6 Electrical Characteristics
      1. 6.6.1 I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.6.2 Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 6.6.3 High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 6.6.4 Low-Frequency Oscillator (LFXOSC) Electrical Characteristics
      5. 6.6.5 SDIO Electrical Characteristics
      6. 6.6.6 LVCMOS Electrical Characteristics
      7. 6.6.7 CSI-2 (D-PHY) Electrical Characteristics
      8. 6.6.8 USB2PHY Electrical Characteristics
      9. 6.6.9 DDR Electrical Characteristics
    7. 6.7 VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.7.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.7.2 Hardware Requirements
      3. 6.7.3 Programming Sequence
      4. 6.7.4 Impact to Your Hardware Warranty
    8. 6.8 Thermal Resistance Characteristics
      1. 6.8.1 Thermal Resistance Characteristics for AMW Package TBD
    9. 6.9 Timing and Switching Characteristics
      1. 6.9.1 Timing Parameters and Information
      2. 6.9.2 Power Supply Requirements
        1. 6.9.2.1 Power Supply Slew Rate Requirement
        2. 6.9.2.2 Power Supply Sequencing
          1. 6.9.2.2.1 Power-Up Sequencing
          2. 6.9.2.2.2 Power-Down Sequencing
          3. 6.9.2.2.3 Partial IO Power Sequencing
      3. 6.9.3 System Timing
        1. 6.9.3.1 Reset Timing
        2. 6.9.3.2 Error Signal Timing
        3. 6.9.3.3 Clock Timing
      4. 6.9.4 Clock Specifications
        1. 6.9.4.1 Input Clocks / Oscillators
          1. 6.9.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 6.9.4.1.1.1 Load Capacitance
            2. 6.9.4.1.1.2 Shunt Capacitance
          2. 6.9.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
          3. 6.9.4.1.3 WKUP_LFOSC0 Internal Oscillator Clock Source
          4. 6.9.4.1.4 WKUP_LFOSC0 LVCMOS Digital Clock Source
          5. 6.9.4.1.5 WKUP_LFOSC0 Not Used
        2. 6.9.4.2 Output Clocks
        3. 6.9.4.3 PLLs
        4. 6.9.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 6.9.5 Peripherals
        1. 6.9.5.1  ATL
          1. 6.9.5.1.1 ATL_PCLK Timing Requirements
          2. 6.9.5.1.2 ATL_AWS[x] Timing Requirements
          3. 6.9.5.1.3 ATL_BWS[x] Timing Requirements
          4. 6.9.5.1.4 ATCLK[x] Switching Characteristics
        2. 6.9.5.2  CPSW3G
          1. 6.9.5.2.1 CPSW3G MDIO Timing
          2. 6.9.5.2.2 CPSW3G RMII Timing
          3. 6.9.5.2.3 CPSW3G RGMII Timing
        3. 6.9.5.3  CPTS
        4. 6.9.5.4  CSI-2
        5. 6.9.5.5  CSI-2 TX
        6. 6.9.5.6  DDRSS
        7. 6.9.5.7  DSS
        8. 6.9.5.8  ECAP
        9. 6.9.5.9  Emulation and Debug
          1. 6.9.5.9.1 Trace
          2. 6.9.5.9.2 JTAG
        10. 6.9.5.10 EPWM
        11. 6.9.5.11 EQEP
        12. 6.9.5.12 GPIO
        13. 6.9.5.13 GPMC
          1. 6.9.5.13.1 GPMC and NOR Flash — Synchronous Mode
          2. 6.9.5.13.2 GPMC and NOR Flash — Asynchronous Mode
          3. 6.9.5.13.3 GPMC and NAND Flash — Asynchronous Mode
        14. 6.9.5.14 I2C
        15. 6.9.5.15 MCAN
        16. 6.9.5.16 MCASP
        17. 6.9.5.17 MCSPI
          1. 6.9.5.17.1 MCSPI — Controller Mode
          2. 6.9.5.17.2 MCSPI — Peripheral Mode
        18. 6.9.5.18 MMCSD
          1. 6.9.5.18.1 MMC0 - eMMC Interface
            1. 6.9.5.18.1.1  Legacy SDR Mode
            2. 6.9.5.18.1.2  High Speed SDR Mode
            3. 6.9.5.18.1.3  High Speed DDR Mode
            4. 6.9.5.18.1.4  HS200 Mode
            5. 6.9.5.18.1.5  HS400 Mode
            6. 6.9.5.18.1.6  UHS–I SDR12 Mode
            7. 6.9.5.18.1.7  UHS–I SDR25 Mode
            8. 6.9.5.18.1.8  UHS–I SDR50 Mode
            9. 6.9.5.18.1.9  UHS–I DDR50 Mode
            10. 6.9.5.18.1.10 UHS–I SDR104 Mode
          2. 6.9.5.18.2 MMC1/MMC2 - SD/SDIO Interface
            1. 6.9.5.18.2.1 Default Speed Mode
            2. 6.9.5.18.2.2 High Speed Mode
            3. 6.9.5.18.2.3 UHS–I SDR12 Mode
            4. 6.9.5.18.2.4 UHS–I SDR25 Mode
            5. 6.9.5.18.2.5 UHS–I SDR50 Mode
            6. 6.9.5.18.2.6 UHS–I DDR50 Mode
            7. 6.9.5.18.2.7 UHS–I SDR104 Mode
        19. 6.9.5.19 OSPI
          1. 6.9.5.19.1 OSPI0 PHY Mode
            1. 6.9.5.19.1.1 OSPI0 With PHY Data Training
            2. 6.9.5.19.1.2 OSPI0 Without Data Training
              1. 6.9.5.19.1.2.1 OSPI0 PHY SDR Timing
              2. 6.9.5.19.1.2.2 OSPI0 PHY DDR Timing
          2. 6.9.5.19.2 OSPI0 Tap Mode
            1. 6.9.5.19.2.1 OSPI0 Tap SDR Timing
            2. 6.9.5.19.2.2 OSPI0 Tap DDR Timing
        20. 6.9.5.20 PCIe
        21. 6.9.5.21 Timers
        22. 6.9.5.22 UART
        23. 6.9.5.23 USB
  8. 7 Detailed Description
    1. 7.1 Overview
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply
        1. 8.1.1.1 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG, EMU, and TRACE
      4. 8.1.4 Unused Pins
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 LPDDR4 Board Design and Layout Guidelines
      2. 8.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 8.2.2.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 8.2.2.2 External Board Loopback
        3. 8.2.2.3 DQS (only available in Octal SPI devices)
      3. 8.2.3 USB VBUS Design Guidelines
      4. 8.2.4 System Power Supply Monitor Design Guidelines
      5. 8.2.5 High Speed Differential Signal Routing Guidance
      6. 8.2.6 Thermal Solution Guidance
    3. 8.3 Clock Routing Guidelines
      1. 8.3.1 Oscillator Routing
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • AMW|594
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.9.5.22 UART

For more details about features and additional description information on the device Universal Asynchronous Receiver Transmitter, see the corresponding subsections within Signal Descriptions and Detailed Description sections.

Table 6-129 UART Timing Conditions
PARAMETER MIN MAX UNIT
INPUT CONDITIONS
SRI Input slew rate 0.5 5 V/ns
OUTPUT CONDITIONS
CL Output load capacitance 1 30(1) pF
(1) This value represents an absolute maximum load capacitance. As the UART baud rate increases, it may be necessary to reduce the load capacitance to a value less than this maximum limit to provide enough timing margin for the attached device. The output rise/fall times increase as capacitive load increases, which decreases the time data is valid for the receiver of the attached devices. Therefore, it is important to understand the minimum data valid time required by the attached device at the operating baud rate. Then use the device IBIS models to verify the actual load capacitance on the UART signals does not increase the rise/fall times beyond the point where the minimum data valid time of the attached device is violated.
Table 6-130 UART Timing Requirements see Figure 6-109
NO. PARAMETER DESCRIPTION MIN MAX UNIT
1 tw(RXD) Pulse width, receive data bit high or low 0.95U(1)(2) 1.05U(1)(2) ns
2 tw(RXDS) Pulse width, receive start bit low 0.95U(1)(2) ns
(1) U = UART baud time in ns = 1/programmed baud rate.
(2) This value defines the data valid time, where the input voltage is required to be above VIH or below VIL.
Table 6-131 UART Switching Characteristics see Figure 6-109
NO. PARAMETER DESCRIPTION MIN MAX UNIT
f(baud) Programmable baud rate for Main Domain UARTs 12 Mbps
Programmable baud rate for MCU and WKUP Domain UARTs 3.7 Mbps
3 tw(TXD) Pulse width, transmit data bit high or low U(1) - 2 U(1) + 2 ns
4 tw(TXDS) Pulse width, transmit start bit low U(1) - 2 ns
TDA4VEN-Q1 TDA4AEN-Q1 UART Timing Requirements and Switching Characteristics Figure 6-109 UART Timing Requirements and Switching Characteristics

For more information, see Universal Asynchronous Receiver/Transmitter (UART) section in Peripherals chapter in the device TRM.