SPRSP62B December   2022  – December 2024 TDA4AL-Q1 , TDA4VE-Q1 , TDA4VL-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
    1. 3.1 Functional Block Diagram
  5. Device Comparison
  6. Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      10
      2.      11
    3. 5.3 Signal Descriptions
      1.      13
      2. 5.3.1  ADC
        1. 5.3.1.1 MCU Domain
          1.        16
          2.        17
          3.        18
      3. 5.3.2  DDRSS
        1. 5.3.2.1 MAIN Domain
          1.        21
          2.        22
      4. 5.3.3  GPIO
        1. 5.3.3.1 MAIN Domain
          1.        25
        2. 5.3.3.2 WKUP Domain
          1.        27
      5. 5.3.4  I2C
        1. 5.3.4.1 MAIN Domain
          1.        30
          2.        31
          3.        32
          4.        33
          5.        34
          6.        35
          7.        36
        2. 5.3.4.2 MCU Domain
          1.        38
          2.        39
        3. 5.3.4.3 WKUP Domain
          1.        41
      6. 5.3.5  I3C
        1. 5.3.5.1 MCU Domain
          1.        44
      7. 5.3.6  MCAN
        1. 5.3.6.1 MAIN Domain
          1.        47
          2.        48
          3.        49
          4.        50
          5.        51
          6.        52
          7.        53
          8.        54
          9.        55
          10.        56
          11.        57
          12.        58
          13.        59
          14.        60
          15.        61
          16.        62
          17.        63
          18.        64
        2. 5.3.6.2 MCU Domain
          1.        66
          2.        67
      8. 5.3.7  MCSPI
        1. 5.3.7.1 MAIN Domain
          1.        70
          2.        71
          3.        72
          4.        73
          5.        74
          6.        75
          7.        76
        2. 5.3.7.2 MCU Domain
          1.        78
          2.        79
      9. 5.3.8  UART
        1. 5.3.8.1 MAIN Domain
          1.        82
          2.        83
          3.        84
          4.        85
          5.        86
          6.        87
          7.        88
          8.        89
          9.        90
          10.        91
        2. 5.3.8.2 MCU Domain
          1.        93
        3. 5.3.8.3 WKUP Domain
          1.        95
      10. 5.3.9  MDIO
        1. 5.3.9.1 MAIN Domain
          1.        98
        2. 5.3.9.2 MCU Domain
          1.        100
      11. 5.3.10 CPSW2G
        1. 5.3.10.1 MAIN Domain
          1.        103
        2. 5.3.10.2 MCU Domain
          1.        105
      12. 5.3.11 ECAP
        1. 5.3.11.1 MAIN Domain
          1.        108
          2.        109
          3.        110
      13. 5.3.12 EQEP
        1. 5.3.12.1 MAIN Domain
          1.        113
          2.        114
          3.        115
      14. 5.3.13 EPWM
        1. 5.3.13.1 MAIN Domain
          1.        118
          2.        119
          3.        120
          4.        121
          5.        122
          6.        123
          7.        124
      15. 5.3.14 USB
        1. 5.3.14.1 MAIN Domain
          1.        127
      16. 5.3.15 Display Port
        1. 5.3.15.1 MAIN Domain
          1.        130
      17. 5.3.16 Hyperlink
        1. 5.3.16.1 MAIN Domain
          1.        133
          2.        134
          3.        135
      18. 5.3.17 PCIE
        1. 5.3.17.1 MAIN Domain
          1.        138
      19. 5.3.18 SERDES
        1. 5.3.18.1 MAIN Domain
          1.        141
      20. 5.3.19 DSI
        1. 5.3.19.1 MAIN Domain
          1.        144
          2.        145
      21. 5.3.20 CSI
        1. 5.3.20.1 MAIN Domain
          1.        148
          2.        149
      22. 5.3.21 MCASP
        1. 5.3.21.1 MAIN Domain
          1.        152
          2.        153
          3.        154
          4.        155
          5.        156
      23. 5.3.22 DMTIMER
        1. 5.3.22.1 MAIN Domain
          1.        159
        2. 5.3.22.2 MCU Domain
          1.        161
      24. 5.3.23 CPTS
        1. 5.3.23.1 MAIN Domain
          1.        164
        2. 5.3.23.2 MCU Domain
          1.        166
      25. 5.3.24 DSS
        1. 5.3.24.1 MAIN Domain
          1.        169
      26. 5.3.25 GPMC
        1. 5.3.25.1 MAIN Domain
          1.        172
      27. 5.3.26 MMC
        1. 5.3.26.1 MAIN Domain
          1.        175
          2.        176
      28. 5.3.27 OSPI
        1. 5.3.27.1 MCU Domain
          1.        179
          2.        180
      29. 5.3.28 Hyperbus
        1. 5.3.28.1 MCU Domain
          1.        183
      30. 5.3.29 Emulation and Debug
        1. 5.3.29.1 MAIN Domain
          1.        186
          2.        187
      31. 5.3.30 System and Miscellaneous
        1. 5.3.30.1 Boot Mode configuration
          1.        190
        2. 5.3.30.2 Clock
          1.        192
          2.        193
        3. 5.3.30.3 System
          1.        195
          2.        196
        4. 5.3.30.4 EFUSE
          1.        198
        5. 5.3.30.5 VMON
          1.        200
      32. 5.3.31 Power
        1.       202
    4. 5.4 Connection for Unused Pins
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Power-On-Hour (POH) Limits
    5. 6.5  Operating Performance Points
    6. 6.6  Electrical Characteristics
      1. 6.6.1  I2C, Open-Drain, Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.6.2  Fail-Safe Reset (FS Reset) Electrical Characteristics
      3. 6.6.3  HFOSC/LFOSC Electrical Characteristics
      4. 6.6.4  eMMCPHY Electrical Characteristics
      5. 6.6.5  SDIO Electrical Characteristics
      6. 6.6.6  CSI2/DSI D-PHY Electrical Characteristics
      7. 6.6.7  ADC12B Electrical Characteristics
      8. 6.6.8  LVCMOS Electrical Characteristics
      9. 6.6.9  USB2PHY Electrical Characteristics
      10. 6.6.10 SerDes 2-L-PHY/4-L-PHY Electrical Characteristics
      11. 6.6.11 UFS M-PHY Electrical Characteristics
      12. 6.6.12 eDP/DP AUX-PHY Electrical Characteristics
      13. 6.6.13 DDR0 Electrical Characteristics
    7. 6.7  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.7.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.7.2 Hardware Requirements
      3. 6.7.3 Programming Sequence
      4. 6.7.4 Impact to Your Hardware Warranty
    8. 6.8  Thermal Resistance Characteristics
      1. 6.8.1 Thermal Resistance Characteristics for ALZ Package
    9. 6.9  Temperature Sensor Characteristics
    10. 6.10 Timing and Switching Characteristics
      1. 6.10.1 Timing Parameters and Information
      2. 6.10.2 Power Supply Sequencing
        1. 6.10.2.1 Power Supply Slew Rate Requirement
        2. 6.10.2.2 Combined MCU and Main Domains Power- Up Sequencing
        3. 6.10.2.3 Combined MCU and Main Domains Power- Down Sequencing
        4. 6.10.2.4 Isolated MCU and Main Domains Power- Up Sequencing
        5. 6.10.2.5 Isolated MCU and Main Domains Power- Down Sequencing
        6. 6.10.2.6 Independent MCU and Main Domains, Entry and Exit of MCU Only Sequencing
        7. 6.10.2.7 Independent MCU and Main Domains, Entry and Exit of DDR Retention State
        8. 6.10.2.8 Independent MCU and Main Domains, Entry and Exit of GPIO Retention Sequencing
      3. 6.10.3 System Timing
        1. 6.10.3.1 Reset Timing
        2. 6.10.3.2 Safety Signal Timing
        3. 6.10.3.3 Clock Timing
      4. 6.10.4 Clock Specifications
        1. 6.10.4.1 Input and Output Clocks / Oscillators
          1. 6.10.4.1.1 WKUP_OSC0 Internal Oscillator Clock Source
            1. 6.10.4.1.1.1 Load Capacitance
            2. 6.10.4.1.1.2 Shunt Capacitance
          2. 6.10.4.1.2 WKUP_OSC0 LVCMOS Digital Clock Source
          3. 6.10.4.1.3 Auxiliary OSC1 Internal Oscillator Clock Source
            1. 6.10.4.1.3.1 Load Capacitance
            2. 6.10.4.1.3.2 Shunt Capacitance
          4. 6.10.4.1.4 Auxiliary OSC1 LVCMOS Digital Clock Source
          5. 6.10.4.1.5 Auxiliary OSC1 Not Used
        2. 6.10.4.2 Output Clocks
        3. 6.10.4.3 PLLs
        4. 6.10.4.4 Module and Peripheral Clocks Frequencies
      5. 6.10.5 Peripherals
        1. 6.10.5.1  ATL
          1. 6.10.5.1.1 ATL_PCLK Timing Requirements
          2. 6.10.5.1.2 ATL_AWS[x] Timing Requirements
          3. 6.10.5.1.3 ATL_BWS[x] Timing Requirements
          4. 6.10.5.1.4 ATCLK[x] Switching Characteristics
        2. 6.10.5.2  CPSW2G
          1. 6.10.5.2.1 CPSW2G MDIO Interface Timings
          2. 6.10.5.2.2 CPSW2G RMII Timings
            1. 6.10.5.2.2.1 CPSW2G RMII[x]_REF_CLK Timing Requirements – RMII Mode
            2. 6.10.5.2.2.2 CPSW2G RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
            3. 6.10.5.2.2.3 CPSW2G RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode
          3. 6.10.5.2.3 CPSW2G RGMII Timings
            1. 6.10.5.2.3.1 RGMII[x]_RXC Timing Requirements – RGMII Mode
            2. 6.10.5.2.3.2 CPSW2G Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
            3. 6.10.5.2.3.3 CPSW2G RGMII[x]_TXC Switching Characteristics – RGMII Mode
            4. 6.10.5.2.3.4 RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
        3. 6.10.5.3  CSI-2
        4. 6.10.5.4  DDRSS
        5. 6.10.5.5  DSS
        6. 6.10.5.6  eCAP
          1. 6.10.5.6.1 Timing Requirements for eCAP
          2. 6.10.5.6.2 Switching Characteristics for eCAP
        7. 6.10.5.7  EPWM
          1. 6.10.5.7.1 Timing Requirements for eHRPWM
          2. 6.10.5.7.2 Switching Characteristics for eHRPWM
        8. 6.10.5.8  eQEP
          1. 6.10.5.8.1 Timing Requirements for eQEP
          2. 6.10.5.8.2 Switching Characteristics for eQEP
        9. 6.10.5.9  GPIO
          1. 6.10.5.9.1 GPIO Timing Requirements
          2. 6.10.5.9.2 GPIO Switching Characteristics
        10. 6.10.5.10 GPMC
          1. 6.10.5.10.1 GPMC and NOR Flash — Synchronous Mode
            1. 6.10.5.10.1.1 GPMC and NOR Flash Timing Requirements — Synchronous Mode
            2. 6.10.5.10.1.2 GPMC and NOR Flash Switching Characteristics – Synchronous Mode
          2. 6.10.5.10.2 GPMC and NOR Flash — Asynchronous Mode
            1. 6.10.5.10.2.1 GPMC and NOR Flash Timing Requirements – Asynchronous Mode
            2. 6.10.5.10.2.2 GPMC and NOR Flash Switching Characteristics – Asynchronous Mode
          3. 6.10.5.10.3 GPMC and NAND Flash — Asynchronous Mode
            1. 6.10.5.10.3.1 GPMC and NAND Flash Timing Requirements – Asynchronous Mode
            2. 6.10.5.10.3.2 GPMC and NAND Flash Switching Characteristics – Asynchronous Mode
          4. 6.10.5.10.4 GPMC0 IOSET
        11. 6.10.5.11 HyperBus
          1. 6.10.5.11.1 Timing Requirements for HyperBus
          2. 6.10.5.11.2 HyperBus 166 MHz Switching Characteristics
          3. 6.10.5.11.3 HyperBus 100 MHz Switching Characteristics
        12. 6.10.5.12 I2C
        13. 6.10.5.13 I3C
        14. 6.10.5.14 MCAN
        15. 6.10.5.15 MCASP
        16. 6.10.5.16 MCSPI
          1. 6.10.5.16.1 MCSPI — Controller Mode
          2. 6.10.5.16.2 MCSPI — Peripheral Mode
        17. 6.10.5.17 MMCSD
          1. 6.10.5.17.1 MMC0 - eMMC Interface
            1. 6.10.5.17.1.1 Legacy SDR Mode
            2. 6.10.5.17.1.2 High Speed SDR Mode
            3. 6.10.5.17.1.3 High Speed DDR Mode
            4. 6.10.5.17.1.4 HS200 Mode
            5. 6.10.5.17.1.5 HS400 Mode
          2. 6.10.5.17.2 MMC1/2 - SD/SDIO Interface
            1. 6.10.5.17.2.1 Default Speed Mode
            2. 6.10.5.17.2.2 High Speed Mode
            3. 6.10.5.17.2.3 UHS–I SDR12 Mode
            4. 6.10.5.17.2.4 UHS–I SDR25 Mode
            5. 6.10.5.17.2.5 UHS–I SDR50 Mode
            6. 6.10.5.17.2.6 UHS–I DDR50 Mode
            7. 6.10.5.17.2.7 UHS–I SDR104 Mode
        18. 6.10.5.18 CPTS
          1. 6.10.5.18.1 CPTS Timing Requirements
          2. 6.10.5.18.2 CPTS Switching Characteristics
        19. 6.10.5.19 OSPI
          1. 6.10.5.19.1 OSPI0/1 PHY Mode
            1. 6.10.5.19.1.1 OSPI0/1 With PHY Data Training
            2. 6.10.5.19.1.2 OSPI Without Data Training
              1. 6.10.5.19.1.2.1 OSPI Timing Requirements – SDR Mode
              2. 6.10.5.19.1.2.2 OSPI Switching Characteristics – SDR Mode
              3. 6.10.5.19.1.2.3 OSPI Timing Requirements – DDR Mode
              4. 6.10.5.19.1.2.4 OSPI Switching Characteristics – PHY DDR Mode
          2. 6.10.5.19.2 OSPI0/1 Tap Mode
            1. 6.10.5.19.2.1 OSPI0 Tap SDR Timing
            2. 6.10.5.19.2.2 OSPI0 Tap DDR Timing
        20. 6.10.5.20 PCIE
        21. 6.10.5.21 Timers
          1. 6.10.5.21.1 Timing Requirements for Timers
          2. 6.10.5.21.2 Switching Characteristics for Timers
        22. 6.10.5.22 UART
          1. 6.10.5.22.1 Timing Requirements for UART
          2. 6.10.5.22.2 UART Switching Characteristics
        23. 6.10.5.23 USB
      6. 6.10.6 Emulation and Debug
        1. 6.10.6.1 Trace
        2. 6.10.6.2 JTAG
          1. 6.10.6.2.1 JTAG Electrical Data and Timing
            1. 6.10.6.2.1.1 JTAG Timing Requirements
            2. 6.10.6.2.1.2 JTAG Switching Characteristics
  8. Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
        1. 7.1.1.1 Power Distribution Network Implementation Guidance
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG and EMU
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 Hardware Design Guide for JacintoTM 7 Devices
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 LPDDR4 Board Design and Layout Guidelines
      2. 7.2.2 OSPI and QSPI Board Design and Layout Guidelines
        1. 7.2.2.1 No Loopback and Internal Pad Loopback
        2. 7.2.2.2 External Board Loopback
        3. 7.2.2.3 DQS (only available in Octal Flash devices)
      3. 7.2.3 USB VBUS Design Guidelines
      4. 7.2.4 System Power Supply Monitor Design Guidelines using VMON/POK
      5. 7.2.5 High Speed Differential Signal Routing Guidance
      6. 7.2.6 Thermal Solution Guidance
  9. Device and Documentation Support
    1. 8.1 Device Nomenclature
      1. 8.1.1 Standard Package Symbolization
      2. 8.1.2 Device Naming Convention
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Trademarks
    5. 8.5 Support Resources
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALZ|770
Thermal pad, mechanical data (Package|Pins)
Orderable Information

GPMC and NOR Flash Switching Characteristics – Asynchronous Mode

NO.PARAMETERDESCRIPTIONMODE(15)MINMAXUNIT
133 MHz(16)
FA0tw(be[x]nV)Pulse duration, output lower-byte enable and command latch enable GPMC_BE0n_CLE, output upper-byte enable GPMC_BE1n valid timeReadN(12)ns
WriteN(12)
FA1tw(csnV)Pulse duration, output chip select GPMC_CSn[i](13) lowReadA(1)ns
WriteA(1)
FA3td(csnV-advnIV)Delay time, output chip select GPMC_CSn[i](13) valid to output address valid and address latch enable GPMC_ADVn_ALE invalidReadB(2)- 2.55B(2)+ 2.65ns
WriteB(2)- 2.55B(2)+ 2.65
FA4td(csnV-oenIV)Delay time, output chip select GPMC_CSn[i](13) valid to output enable GPMC_OEn_REn invalid (Single read)div_by_1_mode;
GPMC_FCLK_MUX;
TIMEPARAGRANULARITY_X1
C(3)- 2.55C(3)+ 2.65ns
FA9td(aV-csnV)Delay time, output address GPMC_A[27:1] valid to output chip select GPMC_CSn[i](13) validdiv_by_1_mode;
GPMC_FCLK_MUX;
TIMEPARAGRANULARITY_X1
J(9)- 2.55J(9)+ 2.65ns
FA10td(be[x]nV-csnV)Delay time, output lower-byte enable and command latch enable GPMC_BE0n_CLE, output upper-byte enable GPMC_BE1n valid to output chip select GPMC_CSn[i](13) validdiv_by_1_mode;
GPMC_FCLK_MUX;
TIMEPARAGRANULARITY_X1
J(9)- 2.55J(9)+ 2.65ns
FA12td(csnV-advnV)Delay time, output chip select GPMC_CSn[i](13) valid to output address valid and address latch enable GPMC_ADVn_ALE validdiv_by_1_mode;
GPMC_FCLK_MUX;
TIMEPARAGRANULARITY_X1
K(10)- 2.55K(10)+ 2.65ns
FA13td(csnV-oenV)Delay time, output chip select GPMC_CSn[i](13) valid to output enable GPMC_OEn_REn validdiv_by_1_mode;
GPMC_FCLK_MUX;
TIMEPARAGRANULARITY_X1
L(11)- 2.55L(11)+ 2.65ns
FA16tw(aIV)Pulse duration output address GPMC_A[26:1] invalid between 2 successive read and write accessesdiv_by_1_mode;
GPMC_FCLK_MUX;
TIMEPARAGRANULARITY_X1
G(7)ns
FA18td(csnV-oenIV)Delay time, output chip select GPMC_CSn[i](13) valid to output enable GPMC_OEn_REn invalid (Burst read)div_by_1_mode;
GPMC_FCLK_MUX;
TIMEPARAGRANULARITY_X1
I(8)- 2.55I(8)+ 2.65ns
FA20tw(aV)Pulse duration, output address GPMC_A[27:1] valid - 2nd, 3rd, and 4th accessesdiv_by_1_mode;
GPMC_FCLK_MUX;
TIMEPARAGRANULARITY_X1
D(4)ns
FA25td(csnV-wenV)Delay time, output chip select GPMC_CSn[i](13) valid to output write enable GPMC_WEn validdiv_by_1_mode;
GPMC_FCLK_MUX;
TIMEPARAGRANULARITY_X1
E(5)- 2.55E(5)+ 2.65ns
FA27td(csnV-wenIV)Delay time, output chip select GPMC_CSn[i](13) valid to output write enable GPMC_WEn invaliddiv_by_1_mode;
GPMC_FCLK_MUX;
TIMEPARAGRANULARITY_X1
F(6)- 2.55F(6)+ 2.65ns
FA28td(wenV-dV)Delay time, output write enable GPMC_WEn valid to output data GPMC_AD[15:0] validdiv_by_1_mode;
GPMC_FCLK_MUX;
TIMEPARAGRANULARITY_X1
2.65ns
FA29td(dV-csnV)Delay time, output data GPMC_AD[15:0] valid to output chip select GPMC_CSn[i](13) validdiv_by_1_mode;
GPMC_FCLK_MUX;
TIMEPARAGRANULARITY_X1
J(9)- 2.55J(9)+ 2.65ns
FA37td(oenV-aIV)Delay time, output enable GPMC_OEn_REn valid to output address GPMC_AD[15:0] phase enddiv_by_1_mode;
GPMC_FCLK_MUX;
TIMEPARAGRANULARITY_X1
2.65ns
For single read: A = (CSRdOffTime - CSOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)
For single write: A = (CSWrOffTime - CSOnTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)
For burst read: A = (CSRdOffTime - CSOnTime + (n - 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)
For burst write: A = (CSWrOffTime - CSOnTime + (n - 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)
with n being the page burst access number
For reading: B = ((ADVRdOffTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (ADVExtraDelay - CSExtraDelay)) × GPMC_FCLK(14)
For writing: B = ((ADVWrOffTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (ADVExtraDelay - CSExtraDelay)) × GPMC_FCLK(14)
C = ((OEOffTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (OEExtraDelay - CSExtraDelay)) × GPMC_FCLK(14)
D = PageBurstAccessTime × (TimeParaGranularity + 1) × GPMC_FCLK(14)
E = ((WEOnTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (WEExtraDelay - CSExtraDelay)) × GPMC_FCLK(14)
F = ((WEOffTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (WEExtraDelay - CSExtraDelay)) × GPMC_FCLK(14)
G = Cycle2CycleDelay × GPMC_FCLK(14)
I = ((OEOffTime + (n - 1) × PageBurstAccessTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (OEExtraDelay - CSExtraDelay)) × GPMC_FCLK(14)
J = (CSOnTime × (TimeParaGranularity + 1) + 0.5 × CSExtraDelay) × GPMC_FCLK(14)
K = ((ADVOnTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (ADVExtraDelay - CSExtraDelay)) × GPMC_FCLK(14)
L = ((OEOnTime - CSOnTime) × (TimeParaGranularity + 1) + 0.5 × (OEExtraDelay - CSExtraDelay)) × GPMC_FCLK(14)
For single read: N = RdCycleTime × (TimeParaGranularity + 1) × GPMC_FCLK(14)
For single write: N = WrCycleTime × (TimeParaGranularity + 1) × GPMC_FCLK(14)
For burst read: N = (RdCycleTime + (n - 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)
For burst write: N = (WrCycleTime + (n - 1) × PageBurstAccessTime) × (TimeParaGranularity + 1) × GPMC_FCLK(14)
In GPMC_CSn[i], i is equal to 0, 1, 2 or 3.
GPMC_FCLK is general-purpose memory controller internal functional clock period in ns.
For div_by_1_mode:
  • GPMC_CONFIG1_i Register: GPMCFCLKDIVIDER = 0h:
    • GPMC_CLK frequency = GPMC_FCLK frequency

  • CTRLMMR_GPMC_CLKSEL[1-0] CLK_SEL = 00 = CPSWHSDIV_CLKOUT3 = 2000/15 = 133.33 MHz

  • GPMC_CONFIG1_i Register: TIMEPARAGRANULARITY = 0h = x1 latencies (affecting RD/WRCYCLETIME, RD/WRACCESSTIME, PAGEBURSTACCESSTIME, CSONTIME, CSRD/WROFFTIME, ADVONTIME, ADVRD/WROFFTIME, OEONTIME, OEOFFTIME, WEONTIME, WEOFFTIME, CYCLE2CYCLEDELAY, BUSTURNAROUND, TIMEOUTSTARTVALUE, WRDATAONADMUXBUS)
For 133 MHz:
  • CTRLMMR_GPMC_CLKSEL[1-0] CLK_SEL = 00 = MAIN_PLL0_HSDIV3_CLKOUT
TDA4VE-Q1 TDA4AL-Q1 TDA4VL-Q1 GPMC
          and NOR Flash — Asynchronous Read — Single Word
In GPMC_CSn[i], i is equal to 0, 1, 2 or 3. In GPMC_WAIT[j], j is equal to 0, 1, 2, or 3.
FA5 parameter illustrates amount of time required to internally sample input data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after FA5 functional clock cycles, input data will be internally sampled by active functional clock edge. FA5 value must be stored inside AccessTime register bits field.
GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally.
Figure 6-56 GPMC and NOR Flash — Asynchronous Read — Single Word
TDA4VE-Q1 TDA4AL-Q1 TDA4VL-Q1 GPMC and NOR
          Flash — Asynchronous Read — 32–Bit
In GPMC_CSn[i], i is equal to 0, 1, 2 or 3. In GPMC_WAIT[j], j is equal to 0, 1, 2, or 3.
FA5 parameter illustrates amount of time required to internally sample input data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after FA5 functional clock cycles, input data will be internally sampled by active functional clock edge. FA5 value must be stored inside AccessTime register bits field.
GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally.
Figure 6-57 GPMC and NOR Flash — Asynchronous Read — 32–Bit
TDA4VE-Q1 TDA4AL-Q1 TDA4VL-Q1 GPMC and NOR
          Flash — Asynchronous Read — Page Mode 4x16–Bit
In GPMC_CSn[i], i is equal to 0, 1, 2 or 3. In GPMC_WAIT[j], j is equal to 0, 1, 2, or 3.
FA21 parameter illustrates amount of time required to internally sample first input page data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after FA21 functional clock cycles, first input page data will be internally sampled by active functional clock edge. FA21 calculation must be stored inside AccessTime register bits field.
FA20 parameter illustrates amount of time required to internally sample successive input page data. It is expressed in number of GPMC functional clock cycles. After each access to input page data, next input page data will be internally sampled by active functional clock edge after FA20 functional clock cycles. FA20 is also the duration of address phases for successive input page data (excluding first input page data). FA20 value must be stored in PageBurstAccessTime register bits field.
GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally.
Figure 6-58 GPMC and NOR Flash — Asynchronous Read — Page Mode 4x16–Bit
TDA4VE-Q1 TDA4AL-Q1 TDA4VL-Q1 GPMC and NOR
          Flash — Asynchronous Write — Single Word
In GPMC_CSn[i], i is equal to 0, 1, 2 or 3. In GPMC_WAIT[j], j is equal to 0, 1, 2, or 3.
Figure 6-59 GPMC and NOR Flash — Asynchronous Write — Single Word
TDA4VE-Q1 TDA4AL-Q1 TDA4VL-Q1 GPMC and
          Multiplexed NOR Flash — Asynchronous Read — Single Word
In GPMC_CSn[i], i is equal to 0, 1, 2 or 3. In GPMC_WAIT[j], j is equal to 0, 1, 2, or 3.
FA5 parameter illustrates amount of time required to internally sample input data. It is expressed in number of GPMC functional clock cycles. From start of read cycle and after FA5 functional clock cycles, input data will be internally sampled by active functional clock edge. FA5 value must be stored inside AccessTime register bits field.
GPMC_FCLK is an internal clock (GPMC functional clock) not provided externally.
Figure 6-60 GPMC and Multiplexed NOR Flash — Asynchronous Read — Single Word
TDA4VE-Q1 TDA4AL-Q1 TDA4VL-Q1 GPMC and
          Multiplexed NOR Flash — Asynchronous Write — Single Word
In GPMC_CSn[i], i is equal to 0, 1, 2 or 3. In GPMC_WAIT[j], j is equal to 0, 1, 2, or 3.
Figure 6-61 GPMC and Multiplexed NOR Flash — Asynchronous Write — Single Word