SPRSP79B February   2023  – December 2023 TDA4AH-Q1 , TDA4AP-Q1 , TDA4VH-Q1 , TDA4VP-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      10
      2.      11
    3. 5.3 Signal Descriptions
      1.      13
      2. 5.3.1  ADC
        1. 5.3.1.1 MCU Domain
          1.        16
          2.        17
          3.        18
      3. 5.3.2  DDRSS
        1. 5.3.2.1 MAIN Domain
          1.        21
          2.        22
          3.        23
          4.        24
      4. 5.3.3  GPIO
        1. 5.3.3.1 MAIN Domain
          1.        27
        2. 5.3.3.2 WKUP Domain
          1.        29
      5. 5.3.4  I2C
        1. 5.3.4.1 MAIN Domain
          1.        32
          2.        33
          3.        34
          4.        35
          5.        36
          6.        37
          7.        38
        2. 5.3.4.2 MCU Domain
          1.        40
          2.        41
        3. 5.3.4.3 WKUP Domain
          1.        43
      6. 5.3.5  I3C
        1. 5.3.5.1 MCU Domain
          1.        46
      7. 5.3.6  MCAN
        1. 5.3.6.1 MAIN Domain
          1.        49
          2.        50
          3.        51
          4.        52
          5.        53
          6.        54
          7.        55
          8.        56
          9.        57
          10.        58
          11.        59
          12.        60
          13.        61
          14.        62
          15.        63
          16.        64
          17.        65
          18.        66
        2. 5.3.6.2 MCU Domain
          1.        68
          2.        69
      8. 5.3.7  MCSPI
        1. 5.3.7.1 MAIN Domain
          1.        72
          2.        73
          3.        74
          4.        75
          5.        76
          6.        77
          7.        78
        2. 5.3.7.2 MCU Domain
          1.        80
          2.        81
      9. 5.3.8  UART
        1. 5.3.8.1 MAIN Domain
          1.        84
          2.        85
          3.        86
          4.        87
          5.        88
          6.        89
          7.        90
          8.        91
          9.        92
          10.        93
        2. 5.3.8.2 MCU Domain
          1.        95
        3. 5.3.8.3 WKUP Domain
          1.        97
      10. 5.3.9  MDIO
        1. 5.3.9.1 MAIN Domain
          1.        100
          2.        101
        2. 5.3.9.2 MCU Domain
          1.        103
      11. 5.3.10 UFS
        1. 5.3.10.1 MAIN Domain
          1.        106
      12. 5.3.11 CPSW2G
        1. 5.3.11.1 MAIN Domain
          1.        109
        2. 5.3.11.2 MCU Domain
          1.        111
      13. 5.3.12 SGMII
        1. 5.3.12.1 MAIN Domain
          1.        114
      14. 5.3.13 ECAP
        1. 5.3.13.1 MAIN Domain
          1.        117
          2.        118
          3.        119
      15. 5.3.14 EQEP
        1. 5.3.14.1 MAIN Domain
          1.        122
          2.        123
          3.        124
      16. 5.3.15 EPWM
        1. 5.3.15.1 MAIN Domain
          1.        127
          2.        128
          3.        129
          4.        130
          5.        131
          6.        132
          7.        133
      17. 5.3.16 USB
        1. 5.3.16.1 MAIN Domain
          1.        136
      18. 5.3.17 Display Port
        1. 5.3.17.1 MAIN Domain
          1.        139
      19. 5.3.18 PCIE
        1. 5.3.18.1 MAIN Domain
          1.        142
      20. 5.3.19 SERDES
        1. 5.3.19.1 MAIN Domain
          1.        145
          2.        146
          3.        147
          4.        148
      21. 5.3.20 DSI
        1. 5.3.20.1 MAIN Domain
          1.        151
          2.        152
      22. 5.3.21 CSI
        1. 5.3.21.1 MAIN Domain
          1.        155
          2.        156
          3.        157
      23. 5.3.22 MCASP
        1. 5.3.22.1 MAIN Domain
          1.        160
          2.        161
          3.        162
          4.        163
          5.        164
      24. 5.3.23 DMTIMER
        1. 5.3.23.1 MAIN Domain
          1.        167
        2. 5.3.23.2 MCU Domain
          1.        169
      25. 5.3.24 CPTS
        1. 5.3.24.1 MAIN Domain
          1.        172
        2. 5.3.24.2 MCU Domain
          1.        174
      26. 5.3.25 DSS
        1. 5.3.25.1 MAIN Domain
          1.        177
      27. 5.3.26 GPMC
        1. 5.3.26.1 MAIN Domain
          1.        180
      28. 5.3.27 MMC
        1. 5.3.27.1 MAIN Domain
          1.        183
          2.        184
      29. 5.3.28 OSPI
        1. 5.3.28.1 MCU Domain
          1.        187
          2.        188
      30. 5.3.29 Hyperbus
        1. 5.3.29.1 MCU Domain
          1.        191
      31. 5.3.30 Emulation and Debug
        1. 5.3.30.1 MAIN Domain
          1.        194
          2.        195
      32. 5.3.31 System and Miscellaneous
        1. 5.3.31.1 Boot Mode configuration
          1.        198
        2. 5.3.31.2 Clock
          1.        200
          2.        201
        3. 5.3.31.3 System
          1.        203
          2.        204
        4. 5.3.31.4 EFUSE
          1.        206
        5. 5.3.31.5 VMON
          1.        208
      33. 5.3.32 Power
        1.       210
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Power-On-Hour (POH) Limits
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Operating Performance Points
    6. 6.6  Electrical Characteristics
      1. 6.6.1  I2C, Open-Drain, Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.6.2  Fail-Safe Reset (FS Reset) Electrical Characteristics
      3. 6.6.3  HFOSC/LFOSC Electrical Characteristics
      4. 6.6.4  eMMCPHY Electrical Characteristics
      5. 6.6.5  SDIO Electrical Characteristics
      6. 6.6.6  CSI2/DSI D-PHY Electrical Characteristics
      7. 6.6.7  ADC12B Electrical Characteristics
      8. 6.6.8  LVCMOS Electrical Characteristics
      9. 6.6.9  USB2PHY Electrical Characteristics
      10. 6.6.10 SerDes 2-L-PHY/4-L-PHY Electrical Characteristics
      11. 6.6.11 UFS M-PHY Electrical Characteristics
      12. 6.6.12 eDP/DP AUX-PHY Electrical Characteristics
      13. 6.6.13 DDR0 Electrical Characteristics
    7. 6.7  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.7.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.7.2 Hardware Requirements
      3. 6.7.3 Programming Sequence
      4. 6.7.4 Impact to Your Hardware Warranty
    8. 6.8  Thermal Resistance Characteristics
      1. 6.8.1 Thermal Resistance Characteristics for ALY Package
    9. 6.9  Temperature Sensor Characteristics
    10. 6.10 Timing and Switching Characteristics
      1. 6.10.1 Timing Parameters and Information
      2. 6.10.2 Power Supply Sequencing
        1. 6.10.2.1 Power Supply Slew Rate Requirement
        2. 6.10.2.2 Combined MCU and Main Domains Power- Up Sequencing
        3. 6.10.2.3 Combined MCU and Main Domains Power- Down Sequencing
        4. 6.10.2.4 Isolated MCU and Main Domains Power- Up Sequencing
        5. 6.10.2.5 Isolated MCU and Main Domains Power- Down Sequencing
        6. 6.10.2.6 Independent MCU and Main Domains, Entry and Exit of MCU Only Sequencing
        7. 6.10.2.7 Independent MCU and Main Domains, Entry and Exit of DDR Retention State
        8. 6.10.2.8 Independent MCU and Main Domains, Entry and Exit of GPIO Retention Sequencing
      3. 6.10.3 System Timing
        1. 6.10.3.1 Reset Timing
        2. 6.10.3.2 Safety Signal Timing
        3. 6.10.3.3 Clock Timing
      4. 6.10.4 Clock Specifications
        1. 6.10.4.1 Input and Output Clocks / Oscillators
          1. 6.10.4.1.1 WKUP_OSC0 Internal Oscillator Clock Source
            1. 6.10.4.1.1.1 Load Capacitance
            2. 6.10.4.1.1.2 Shunt Capacitance
          2. 6.10.4.1.2 WKUP_OSC0 LVCMOS Digital Clock Source
          3. 6.10.4.1.3 Auxiliary OSC1 Internal Oscillator Clock Source
            1. 6.10.4.1.3.1 Load Capacitance
            2. 6.10.4.1.3.2 Shunt Capacitance
          4. 6.10.4.1.4 Auxiliary OSC1 LVCMOS Digital Clock Source
          5. 6.10.4.1.5 Auxiliary OSC1 Not Used
        2. 6.10.4.2 Output Clocks
        3. 6.10.4.3 PLLs
        4. 6.10.4.4 Module and Peripheral Clocks Frequencies
      5. 6.10.5 Peripherals
        1. 6.10.5.1  ATL
          1. 6.10.5.1.1 ATL_PCLK Timing Requirements
          2. 6.10.5.1.2 ATL_AWS[x] Timing Requirements
          3. 6.10.5.1.3 ATL_BWS[x] Timing Requirements
          4. 6.10.5.1.4 ATCLK[x] Switching Characteristics
        2. 6.10.5.2  CPSW2G
          1. 6.10.5.2.1 CPSW2G MDIO Interface Timings
          2. 6.10.5.2.2 CPSW2G RMII Timings
            1. 6.10.5.2.2.1 CPSW2G RMII[x]_REF_CLK Timing Requirements – RMII Mode
            2. 6.10.5.2.2.2 CPSW2G RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
            3. 6.10.5.2.2.3 CPSW2G RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode
          3. 6.10.5.2.3 CPSW2G RGMII Timings
            1. 6.10.5.2.3.1 RGMII[x]_RXC Timing Requirements – RGMII Mode
            2. 6.10.5.2.3.2 CPSW2G Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
            3. 6.10.5.2.3.3 CPSW2G RGMII[x]_TXC Switching Characteristics – RGMII Mode
            4. 6.10.5.2.3.4 RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
        3. 6.10.5.3  CSI-2
        4. 6.10.5.4  DDRSS
        5. 6.10.5.5  DSS
        6. 6.10.5.6  eCAP
          1. 6.10.5.6.1 Timing Requirements for eCAP
          2. 6.10.5.6.2 Switching Characteristics for eCAP
        7. 6.10.5.7  EPWM
          1. 6.10.5.7.1 Timing Requirements for eHRPWM
          2. 6.10.5.7.2 Switching Characteristics for eHRPWM
        8. 6.10.5.8  eQEP
          1. 6.10.5.8.1 Timing Requirements for eQEP
          2. 6.10.5.8.2 Switching Characteristics for eQEP
        9. 6.10.5.9  GPIO
          1. 6.10.5.9.1 GPIO Timing Requirements
          2. 6.10.5.9.2 GPIO Switching Characteristics
        10. 6.10.5.10 GPMC
          1. 6.10.5.10.1 GPMC and NOR Flash — Synchronous Mode
            1. 6.10.5.10.1.1 GPMC and NOR Flash Timing Requirements — Synchronous Mode
            2. 6.10.5.10.1.2 GPMC and NOR Flash Switching Characteristics – Synchronous Mode
          2. 6.10.5.10.2 GPMC and NOR Flash — Asynchronous Mode
            1. 6.10.5.10.2.1 GPMC and NOR Flash Timing Requirements – Asynchronous Mode
            2. 6.10.5.10.2.2 GPMC and NOR Flash Switching Characteristics – Asynchronous Mode
          3. 6.10.5.10.3 GPMC and NAND Flash — Asynchronous Mode
            1. 6.10.5.10.3.1 GPMC and NAND Flash Timing Requirements – Asynchronous Mode
            2. 6.10.5.10.3.2 GPMC and NAND Flash Switching Characteristics – Asynchronous Mode
          4. 6.10.5.10.4 GPMC0 IOSET
        11. 6.10.5.11 HyperBus
          1. 6.10.5.11.1 Timing Requirements for HyperBus
          2. 6.10.5.11.2 HyperBus 166 MHz Switching Characteristics
          3. 6.10.5.11.3 HyperBus 100 MHz Switching Characteristics
        12. 6.10.5.12 I2C
        13. 6.10.5.13 I3C
        14. 6.10.5.14 MCAN
        15. 6.10.5.15 MCASP
        16. 6.10.5.16 MCSPI
          1. 6.10.5.16.1 MCSPI — Controller Mode
          2. 6.10.5.16.2 MCSPI — Peripheral Mode
        17. 6.10.5.17 MMCSD
          1. 6.10.5.17.1 MMC0 - eMMC Interface
            1. 6.10.5.17.1.1 Legacy SDR Mode
            2. 6.10.5.17.1.2 High Speed SDR Mode
            3. 6.10.5.17.1.3 High Speed DDR Mode
            4. 6.10.5.17.1.4 HS200 Mode
            5. 6.10.5.17.1.5 HS400 Mode
          2. 6.10.5.17.2 MMC1/2 - SD/SDIO Interface
            1. 6.10.5.17.2.1 Default Speed Mode
            2. 6.10.5.17.2.2 High Speed Mode
            3. 6.10.5.17.2.3 UHS–I SDR12 Mode
            4. 6.10.5.17.2.4 UHS–I SDR25 Mode
            5. 6.10.5.17.2.5 UHS–I SDR50 Mode
            6. 6.10.5.17.2.6 UHS–I DDR50 Mode
            7. 6.10.5.17.2.7 UHS–I SDR104 Mode
        18. 6.10.5.18 CPTS
          1. 6.10.5.18.1 CPTS Timing Requirements
          2. 6.10.5.18.2 CPTS Switching Characteristics
        19. 6.10.5.19 OSPI
          1. 6.10.5.19.1 OSPI0 PHY Mode
            1. 6.10.5.19.1.1 OSPI With Data Training
              1. 6.10.5.19.1.1.1 OSPI Switching Characteristics – Data Training
            2. 6.10.5.19.1.2 OSPI Without Data Training
              1. 6.10.5.19.1.2.1 OSPI Timing Requirements – SDR Mode
              2. 6.10.5.19.1.2.2 OSPI Switching Characteristics – SDR Mode
              3. 6.10.5.19.1.2.3 OSPI Timing Requirements – DDR Mode
              4. 6.10.5.19.1.2.4 OSPI Switching Characteristics – DDR Mode
          2. 6.10.5.19.2 OSPI0 Tap Mode
            1. 6.10.5.19.2.1 OSPI0 Tap SDR Timing
            2. 6.10.5.19.2.2 OSPI0 Tap DDR Timing
        20. 6.10.5.20 OLDI
          1. 6.10.5.20.1 OLDI Switching Characteristics
        21. 6.10.5.21 PCIE
        22. 6.10.5.22 Timers
          1. 6.10.5.22.1 Timing Requirements for Timers
          2. 6.10.5.22.2 Switching Characteristics for Timers
        23. 6.10.5.23 UART
          1. 6.10.5.23.1 Timing Requirements for UART
          2. 6.10.5.23.2 UART Switching Characteristics
        24. 6.10.5.24 USB
      6. 6.10.6 Emulation and Debug
        1. 6.10.6.1 Trace
        2. 6.10.6.2 JTAG
          1. 6.10.6.2.1 JTAG Electrical Data and Timing
            1. 6.10.6.2.1.1 JTAG Timing Requirements
            2. 6.10.6.2.1.2 JTAG Switching Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Processor Subsystems
      1. 7.2.1 Arm Cortex-A72
      2. 7.2.2 Arm Cortex-R5F
      3. 7.2.3 DSP C71x
    3. 7.3 Accelerators and Coprocessors
      1. 7.3.1 GPU
      2. 7.3.2 VPAC
      3. 7.3.3 DMPAC
    4. 7.4 Other Subsystems
      1. 7.4.1 MSMC
      2. 7.4.2 NAVSS
        1. 7.4.2.1 NAVSS0
        2. 7.4.2.2 MCU_NAVSS
      3. 7.4.3 PDMA Controller
      4. 7.4.4 Power Supply
      5. 7.4.5 Peripherals
        1. 7.4.5.1  ADC
        2. 7.4.5.2  ATL
        3. 7.4.5.3  CSI
          1. 7.4.5.3.1 Camera Streaming Interface Receiver (CSI_RX_IF) and MIPI DPHY Receiver (DPHY_RX)
          2. 7.4.5.3.2 Camera Streaming Interface Transmitter (CSI_TX_IF)
        4. 7.4.5.4  CPSW2G
        5. 7.4.5.5  CPSW9G
        6. 7.4.5.6  DCC
        7. 7.4.5.7  DDRSS
        8. 7.4.5.8  DSS
          1. 7.4.5.8.1 DSI
          2. 7.4.5.8.2 eDP
        9. 7.4.5.9  VPFE
        10. 7.4.5.10 eCAP
        11. 7.4.5.11 EPWM
        12. 7.4.5.12 ELM
        13. 7.4.5.13 ESM
        14. 7.4.5.14 eQEP
        15. 7.4.5.15 GPIO
        16. 7.4.5.16 GPMC
        17. 7.4.5.17 Hyperbus
        18. 7.4.5.18 I2C
        19. 7.4.5.19 I3C
        20. 7.4.5.20 MCAN
        21. 7.4.5.21 MCASP
        22. 7.4.5.22 MCRC Controller
        23. 7.4.5.23 MCSPI
        24. 7.4.5.24 MMC/SD
        25. 7.4.5.25 OSPI
        26. 7.4.5.26 PCIE
        27. 7.4.5.27 SerDes
        28. 7.4.5.28 WWDT
        29. 7.4.5.29 Timers
        30. 7.4.5.30 UART
        31. 7.4.5.31 USB
        32. 7.4.5.32 UFS
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply Decoupling and Bulk Capacitors
        1. 8.1.1.1 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG and EMU
      4. 8.1.4 Reset
      5. 8.1.5 Unused Pins
      6. 8.1.6 Hardware Design Guide for JacintoTM 7 Devices
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 LPDDR4 Board Design and Layout Guidelines
      2. 8.2.2 OSPI and QSPI Board Design and Layout Guidelines
        1. 8.2.2.1 No Loopback and Internal Pad Loopback
        2. 8.2.2.2 External Board Loopback
        3. 8.2.2.3 DQS (only available in Octal Flash devices)
      3. 8.2.3 USB VBUS Design Guidelines
      4. 8.2.4 System Power Supply Monitor Design Guidelines using VMON/POK
      5. 8.2.5 High Speed Differential Signal Routing Guidance
      6. 8.2.6 Thermal Solution Guidance
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALY|1414
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Pin Connectivity Requirements

This section describes connectivity requirements for package balls that have specific connectivity requirements and unused package balls.

Note:

All power balls must be supplied with the voltages specified in the Recommended Operating Conditions section, unless otherwise specified in Signal Descriptions.

Note:

For additional clarification, "leave unconnected" or "no connect" (NC) means no signal traces can be connected to these device ball number.

Table 5-121 shows the connectivity requirements for specific signals by ball name and ball number.

Table 5-121 Connectivity Requirements
BALL
NUMBER		 BALL NAME CONNECTION REQUIREMENT
P38 OSC1_XI Each of these balls must be connected to VSS through a separate external pull resistor to ensure these balls are held to a valid logic low-level, if unused.
T38 WKUP_OSC0_XI
G37 TRSTN
U1 DDR0_DQS0P
AA1 DDR0_DQS1P
AF1 DDR0_DQS2P
AJ1 DDR0_DQS3P
A16 DDR1_DQS0P
A13 DDR1_DQS1P
A8 DDR1_DQS2P
A3 DDR1_DQS3P
T1 DDR2_DQS0P
N1 DDR2_DQS1P
H1 DDR2_DQS2P
E1 DDR2_DQS3P
A18 DDR3_DQS0P
A21 DDR3_DQS1P
A26 DDR3_DQS2P
A29 DDR3_DQS3P
AC8 DDR0_RET
G8 DDR1_RET
L8 DDR2_RET
G27 DDR3_RET
K28 VMON1_ER_VSYS
N27 VMON2_IR_VCPU
J30 VMON3_IR_VEXT1P8
P28 VMON4_IR_VEXT1P8
R29 VMON5_IR_VEXT3P3
P36 MCU_ADC0_AIN0 Each of these balls can be connected to VSS through a separate external pull resistor or can be connected directly to VSS to ensure these balls are held to a valid logic low-level, if unused.
V36 MCU_ADC0_AIN1
T34 MCU_ADC0_AIN2
T36 MCU_ADC0_AIN3
P34 MCU_ADC0_AIN4
R37 MCU_ADC0_AIN5
R33 MCU_ADC0_AIN6
V38 MCU_ADC0_AIN7
Y38 MCU_ADC1_AIN0
Y34 MCU_ADC1_AIN1
V34 MCU_ADC1_AIN2
W37 MCU_ADC1_AIN3
AA37 MCU_ADC1_AIN4
W33 MCU_ADC1_AIN5
U33 MCU_ADC1_AIN6
Y36 MCU_ADC1_AIN7
AN11 SERDES0_REXT Each of these balls must be connected to VSS through appropriate external pull resistor to ensure these balls are held to a valid logic low level, if unused. Refer to Signal Descriptions footnote for appropriate value of pull-resistor for each signal.
AL9 SERDES1_REXT
AL20 SERDES2_REXT
AM19 SERDES4_REXT
AM28 CSI0_RXRCALIB
AL28 CSI1_RXRCALIB
AM31 CSI2_RXRCALIB
AE8 DDR0_CAL0
G14 DDR1_CAL0
U7 DDR2_CAL0
F18 DDR3_CAL0
AM24 DSI0_TXRCALIB
AL22 DSI1_TXRCALIB
AN18 USB0_RCALIB
G36 MCU_RESETZ Each of these balls must be connected to the corresponding power supply through a separate external pull resistor to ensure these balls are held to a valid logic high level, if unused.
K32 MCU_PORZ
P33 PORZ
F34 RESET_REQZ
G35 TCK
AL36 TMS
G34 MCU_I2C0_SDA
M35 MCU_I2C0_SCL
N33 WKUP_I2C0_SCL
N35 WKUP_I2C0_SDA
AN36 I2C0_SCL
AP37 I2C0_SDA
AN35 EXTINTN
AL37 TDI
AL35 TDO
F35 EMU0
H34 EMU1
V1 DDR0_DQS0N
Y1 DDR0_DQS1N
AE1 DDR0_DQS2N
AH1 DDR0_DQS3N
A17 DDR1_DQS0N
A14 DDR1_DQS1N
A9 DDR1_DQS2N
A4 DDR1_DQS3N
R1 DDR2_DQS0N
M1 DDR2_DQS1N
G1 DDR2_DQS2N
D1 DDR2_DQS3N
A19 DDR3_DQS0N
A22 DDR3_DQS1N
A27 DDR3_DQS2N
A30 DDR3_DQS3N
R35 MCU_ADC0_REFP If the MCU_ADCn interface is not used, these signals should be connected to the same power supply as the VDDA_ADCn supply input.
AA35 MCU_ADC1_REFP
U35 MCU_ADC0_REFN If the MCU_ADCn interface is not used, these signals should be connected to VSS.
W35 MCU_ADC1_REFN
L29 VPP_MCU Each of these balls must be left unconnected, if unused.
AA31 VPP_CORE
AJ7 MMC0_CALPAD
DDR0_* DDRSS0, DDRSS1, DDRSS2 and DDRSS3 must always be used in incremental order. For instance, when using a single LPDDR component, it must be connected to the DDR0_* interface. When using two LPDDR components, they must be connected to DDR0_* and DDR1_* interfaces, and so forth.
DDR1_*
DDR2_*
DDR3_*

Table 5-122 shows the specific connection requirements for the RESERVED ball numbers on the device.

Note:

For additional clarification, "left unconnected" or "no connect" (NC) means no signal traces can be connected to these device ball numbers.

Table 5-122 Reserved Balls Specific Connection Requirements (AHP)
BALL NUMBERS CONNECTION REQUIREMENTS
AF7 / AK2 / AK29 / AK31 / AL11 / AL23 / AL24 / AL25 / AL27 / AL30 / AM10 / AM12 / AM14 / AM16 / AM17 / AM21 / AM22 / AM26 / AM29 / AM33 / AM9 / AN13 / AN20 / AN21 / G17 / G22 / G30 / H12 / H14 / H32 / H33 / J31 / J33 / K30 / L30 / N7 / T7 / Y7 RESERVED.
These balls must be left unconnected.