SPRSP62A december   2022  – august 2023 TDA4AL-Q1 , TDA4VE-Q1 , TDA4VL-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      11
      2.      12
    3. 6.3 Signal Descriptions
      1.      14
      2. 6.3.1  ADC
        1. 6.3.1.1 MCU Domain
          1.        17
          2.        18
          3.        19
      3. 6.3.2  DDRSS
        1. 6.3.2.1 MAIN Domain
          1.        22
          2.        23
      4. 6.3.3  GPIO
        1. 6.3.3.1 MAIN Domain
          1.        26
        2. 6.3.3.2 WKUP Domain
          1.        28
      5. 6.3.4  I2C
        1. 6.3.4.1 MAIN Domain
          1.        31
          2.        32
          3.        33
          4.        34
          5.        35
          6.        36
          7.        37
        2. 6.3.4.2 MCU Domain
          1.        39
          2.        40
        3. 6.3.4.3 WKUP Domain
          1.        42
      6. 6.3.5  I3C
        1. 6.3.5.1 MCU Domain
          1.        45
      7. 6.3.6  MCAN
        1. 6.3.6.1 MAIN Domain
          1.        48
          2.        49
          3.        50
          4.        51
          5.        52
          6.        53
          7.        54
          8.        55
          9.        56
          10.        57
          11.        58
          12.        59
          13.        60
          14.        61
          15.        62
          16.        63
          17.        64
          18.        65
        2. 6.3.6.2 MCU Domain
          1.        67
          2.        68
      8. 6.3.7  MCSPI
        1. 6.3.7.1 MAIN Domain
          1.        71
          2.        72
          3.        73
          4.        74
          5.        75
          6.        76
          7.        77
        2. 6.3.7.2 MCU Domain
          1.        79
          2.        80
      9. 6.3.8  UART
        1. 6.3.8.1 MAIN Domain
          1.        83
          2.        84
          3.        85
          4.        86
          5.        87
          6.        88
          7.        89
          8.        90
          9.        91
          10.        92
        2. 6.3.8.2 MCU Domain
          1.        94
        3. 6.3.8.3 WKUP Domain
          1.        96
      10. 6.3.9  MDIO
        1. 6.3.9.1 MAIN Domain
          1.        99
        2. 6.3.9.2 MCU Domain
          1.        101
      11. 6.3.10 CPSW2G
        1. 6.3.10.1 MAIN Domain
          1.        104
        2. 6.3.10.2 MCU Domain
          1.        106
      12. 6.3.11 ECAP
        1. 6.3.11.1 MAIN Domain
          1.        109
          2.        110
          3.        111
      13. 6.3.12 EQEP
        1. 6.3.12.1 MAIN Domain
          1.        114
          2.        115
          3.        116
      14. 6.3.13 EPWM
        1. 6.3.13.1 MAIN Domain
          1.        119
          2.        120
          3.        121
          4.        122
          5.        123
          6.        124
          7.        125
      15. 6.3.14 USB
        1. 6.3.14.1 MAIN Domain
          1.        128
      16. 6.3.15 Display Port
        1. 6.3.15.1 MAIN Domain
          1.        131
      17. 6.3.16 Hyperlink
        1. 6.3.16.1 MAIN Domain
          1.        134
          2.        135
          3.        136
      18. 6.3.17 PCIE
        1. 6.3.17.1 MAIN Domain
          1.        139
      19. 6.3.18 SERDES
        1. 6.3.18.1 MAIN Domain
          1.        142
      20. 6.3.19 DSI
        1. 6.3.19.1 MAIN Domain
          1.        145
          2.        146
      21. 6.3.20 CSI
        1. 6.3.20.1 MAIN Domain
          1.        149
          2.        150
      22. 6.3.21 MCASP
        1. 6.3.21.1 MAIN Domain
          1.        153
          2.        154
          3.        155
          4.        156
          5.        157
      23. 6.3.22 DMTIMER
        1. 6.3.22.1 MAIN Domain
          1.        160
        2. 6.3.22.2 MCU Domain
          1.        162
      24. 6.3.23 CPTS
        1. 6.3.23.1 MAIN Domain
          1.        165
        2. 6.3.23.2 MCU Domain
          1.        167
      25. 6.3.24 DSS
        1. 6.3.24.1 MAIN Domain
          1.        170
      26. 6.3.25 GPMC
        1. 6.3.25.1 MAIN Domain
          1.        173
      27. 6.3.26 MMC
        1. 6.3.26.1 MAIN Domain
          1.        176
          2.        177
      28. 6.3.27 OSPI
        1. 6.3.27.1 MCU Domain
          1.        180
          2.        181
      29. 6.3.28 Hyperbus
        1. 6.3.28.1 MCU Domain
          1.        184
      30. 6.3.29 Emulation and Debug
        1. 6.3.29.1 MAIN Domain
          1.        187
          2.        188
      31. 6.3.30 System and Miscellaneous
        1. 6.3.30.1 Boot Mode configuration
          1.        191
        2. 6.3.30.2 Clock
          1.        193
          2.        194
        3. 6.3.30.3 System
          1.        196
          2.        197
        4. 6.3.30.4 EFUSE
          1.        199
        5. 6.3.30.5 VMON
          1.        201
      32. 6.3.31 Power
        1.       203
    4. 6.4 Connection for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power-On-Hour (POH) Limits
    5. 7.5  Operating Performance Points
    6. 7.6  Electrical Characteristics
      1. 7.6.1  I2C, Open-Drain, Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 7.6.2  Fail-Safe Reset (FS Reset) Electrical Characteristics
      3. 7.6.3  HFOSC/LFOSC Electrical Characteristics
      4. 7.6.4  eMMCPHY Electrical Characteristics
      5. 7.6.5  SDIO Electrical Characteristics
      6. 7.6.6  CSI2/DSI D-PHY Electrical Characteristics
      7. 7.6.7  ADC12B Electrical Characteristics
      8. 7.6.8  LVCMOS Electrical Characteristics
      9. 7.6.9  USB2PHY Electrical Characteristics
      10. 7.6.10 SerDes 2-L-PHY/4-L-PHY Electrical Characteristics
      11. 7.6.11 UFS M-PHY Electrical Characteristics
      12. 7.6.12 eDP/DP AUX-PHY Electrical Characteristics
      13. 7.6.13 DDR0 Electrical Characteristics
    7. 7.7  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.7.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.7.2 Hardware Requirements
      3. 7.7.3 Programming Sequence
      4. 7.7.4 Impact to Your Hardware Warranty
    8. 7.8  Thermal Resistance Characteristics
      1. 7.8.1 Thermal Resistance Characteristics for ALZ Package
    9. 7.9  Temperature Sensor Characteristics
    10. 7.10 Timing and Switching Characteristics
      1. 7.10.1 Timing Parameters and Information
      2. 7.10.2 Power Supply Sequencing
        1. 7.10.2.1 Power Supply Slew Rate Requirement
        2. 7.10.2.2 Combined MCU and Main Domains Power- Up Sequencing
        3. 7.10.2.3 Combined MCU and Main Domains Power- Down Sequencing
        4. 7.10.2.4 Isolated MCU and Main Domains Power- Up Sequencing
        5. 7.10.2.5 Isolated MCU and Main Domains Power- Down Sequencing
        6. 7.10.2.6 Independent MCU and Main Domains, Entry and Exit of MCU Only Sequencing
        7. 7.10.2.7 Independent MCU and Main Domains, Entry and Exit of DDR Retention State
        8. 7.10.2.8 Independent MCU and Main Domains, Entry and Exit of GPIO Retention Sequencing
      3. 7.10.3 System Timing
        1. 7.10.3.1 Reset Timing
        2. 7.10.3.2 Safety Signal Timing
        3. 7.10.3.3 Clock Timing
      4. 7.10.4 Clock Specifications
        1. 7.10.4.1 Input and Output Clocks / Oscillators
          1. 7.10.4.1.1 WKUP_OSC0 Internal Oscillator Clock Source
            1. 7.10.4.1.1.1 Load Capacitance
            2. 7.10.4.1.1.2 Shunt Capacitance
          2. 7.10.4.1.2 WKUP_OSC0 LVCMOS Digital Clock Source
          3. 7.10.4.1.3 Auxiliary OSC1 Internal Oscillator Clock Source
            1. 7.10.4.1.3.1 Load Capacitance
            2. 7.10.4.1.3.2 Shunt Capacitance
          4. 7.10.4.1.4 Auxiliary OSC1 LVCMOS Digital Clock Source
          5. 7.10.4.1.5 Auxiliary OSC1 Not Used
        2. 7.10.4.2 Output Clocks
        3. 7.10.4.3 PLLs
        4. 7.10.4.4 Module and Peripheral Clocks Frequencies
      5. 7.10.5 Peripherals
        1. 7.10.5.1  ATL
          1. 7.10.5.1.1 ATL_PCLK Timing Requirements
          2. 7.10.5.1.2 ATL_AWS[x] Timing Requirements
          3. 7.10.5.1.3 ATL_BWS[x] Timing Requirements
          4. 7.10.5.1.4 ATCLK[x] Switching Characteristics
        2. 7.10.5.2  CPSW2G
          1. 7.10.5.2.1 CPSW2G MDIO Interface Timings
          2. 7.10.5.2.2 CPSW2G RMII Timings
            1. 7.10.5.2.2.1 CPSW2G RMII[x]_REF_CLK Timing Requirements – RMII Mode
            2. 7.10.5.2.2.2 CPSW2G RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
            3. 7.10.5.2.2.3 CPSW2G RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode
          3. 7.10.5.2.3 CPSW2G RGMII Timings
            1. 7.10.5.2.3.1 RGMII[x]_RXC Timing Requirements – RGMII Mode
            2. 7.10.5.2.3.2 CPSW2G Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
            3. 7.10.5.2.3.3 CPSW2G RGMII[x]_TXC Switching Characteristics – RGMII Mode
            4. 7.10.5.2.3.4 RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
        3. 7.10.5.3  CSI-2
        4. 7.10.5.4  DDRSS
        5. 7.10.5.5  DSS
        6. 7.10.5.6  eCAP
          1. 7.10.5.6.1 Timing Requirements for eCAP
          2. 7.10.5.6.2 Switching Characteristics for eCAP
        7. 7.10.5.7  EPWM
          1. 7.10.5.7.1 Timing Requirements for eHRPWM
          2. 7.10.5.7.2 Switching Characteristics for eHRPWM
        8. 7.10.5.8  eQEP
          1. 7.10.5.8.1 Timing Requirements for eQEP
          2. 7.10.5.8.2 Switching Characteristics for eQEP
        9. 7.10.5.9  GPIO
          1. 7.10.5.9.1 GPIO Timing Requirements
          2. 7.10.5.9.2 GPIO Switching Characteristics
        10. 7.10.5.10 GPMC
          1. 7.10.5.10.1 GPMC and NOR Flash — Synchronous Mode
            1. 7.10.5.10.1.1 GPMC and NOR Flash Timing Requirements — Synchronous Mode
            2. 7.10.5.10.1.2 GPMC and NOR Flash Switching Characteristics – Synchronous Mode
          2. 7.10.5.10.2 GPMC and NOR Flash — Asynchronous Mode
            1. 7.10.5.10.2.1 GPMC and NOR Flash Timing Requirements – Asynchronous Mode
            2. 7.10.5.10.2.2 GPMC and NOR Flash Switching Characteristics – Asynchronous Mode
          3. 7.10.5.10.3 GPMC and NAND Flash — Asynchronous Mode
            1. 7.10.5.10.3.1 GPMC and NAND Flash Timing Requirements – Asynchronous Mode
            2. 7.10.5.10.3.2 GPMC and NAND Flash Switching Characteristics – Asynchronous Mode
          4. 7.10.5.10.4 GPMC0 IOSET
        11. 7.10.5.11 HyperBus
          1. 7.10.5.11.1 Timing Requirements for HyperBus
          2. 7.10.5.11.2 HyperBus 166 MHz Switching Characteristics
          3. 7.10.5.11.3 HyperBus 100 MHz Switching Characteristics
        12. 7.10.5.12 I2C
        13. 7.10.5.13 I3C
        14. 7.10.5.14 MCAN
        15. 7.10.5.15 MCASP
        16. 7.10.5.16 MCSPI
          1. 7.10.5.16.1 MCSPI — Controller Mode
          2. 7.10.5.16.2 MCSPI — Peripheral Mode
        17. 7.10.5.17 MMCSD
          1. 7.10.5.17.1 MMC0 - eMMC Interface
            1. 7.10.5.17.1.1 Legacy SDR Mode
            2. 7.10.5.17.1.2 High Speed SDR Mode
            3. 7.10.5.17.1.3 High Speed DDR Mode
            4. 7.10.5.17.1.4 HS200 Mode
            5. 7.10.5.17.1.5 HS400 Mode
          2. 7.10.5.17.2 MMC1/2 - SD/SDIO Interface
            1. 7.10.5.17.2.1 Default Speed Mode
            2. 7.10.5.17.2.2 High Speed Mode
            3. 7.10.5.17.2.3 UHS–I SDR12 Mode
            4. 7.10.5.17.2.4 UHS–I SDR25 Mode
            5. 7.10.5.17.2.5 UHS–I SDR50 Mode
            6. 7.10.5.17.2.6 UHS–I DDR50 Mode
            7. 7.10.5.17.2.7 UHS–I SDR104 Mode
        18. 7.10.5.18 CPTS
          1. 7.10.5.18.1 CPTS Timing Requirements
          2. 7.10.5.18.2 CPTS Switching Characteristics
        19. 7.10.5.19 OSPI
          1. 7.10.5.19.1 OSPI0 PHY Mode
            1. 7.10.5.19.1.1 OSPI With Data Training
              1. 7.10.5.19.1.1.1 OSPI Switching Characteristics – Data Training
            2. 7.10.5.19.1.2 OSPI Without Data Training
              1. 7.10.5.19.1.2.1 OSPI Timing Requirements – SDR Mode
              2. 7.10.5.19.1.2.2 OSPI Switching Characteristics – SDR Mode
              3. 7.10.5.19.1.2.3 OSPI Timing Requirements – DDR Mode
              4. 7.10.5.19.1.2.4 OSPI Switching Characteristics – DDR Mode
          2. 7.10.5.19.2 OSPI0 Tap Mode
            1. 7.10.5.19.2.1 OSPI0 Tap SDR Timing
            2. 7.10.5.19.2.2 OSPI0 Tap DDR Timing
        20. 7.10.5.20 PCIE
        21. 7.10.5.21 Timers
          1. 7.10.5.21.1 Timing Requirements for Timers
          2. 7.10.5.21.2 Switching Characteristics for Timers
        22. 7.10.5.22 UART
          1. 7.10.5.22.1 Timing Requirements for UART
          2. 7.10.5.22.2 UART Switching Characteristics
        23. 7.10.5.23 USB
      6. 7.10.6 Emulation and Debug
        1. 7.10.6.1 Trace
        2. 7.10.6.2 JTAG
          1. 7.10.6.2.1 JTAG Electrical Data and Timing
            1. 7.10.6.2.1.1 JTAG Timing Requirements
            2. 7.10.6.2.1.2 JTAG Switching Characteristics
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply Decoupling and Bulk Capacitors
        1. 8.1.1.1 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG and EMU
      4. 8.1.4 Reset
      5. 8.1.5 Unused Pins
      6. 8.1.6 Hardware Design Guide for JacintoTM 7 Devices
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 LPDDR4 Board Design and Layout Guidelines
      2. 8.2.2 OSPI and QSPI Board Design and Layout Guidelines
        1. 8.2.2.1 No Loopback and Internal Pad Loopback
        2. 8.2.2.2 External Board Loopback
        3. 8.2.2.3 DQS (only available in Octal Flash devices)
      3. 8.2.3 USB VBUS Design Guidelines
      4. 8.2.4 System Power Supply Monitor Design Guidelines using VMON/POK
      5. 8.2.5 High Speed Differential Signal Routing Guidance
      6. 8.2.6 Thermal Solution Guidance
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Trademarks
    5. 9.5 Support Resources
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALZ|770
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)(2)
PARAMETER MIN MAX UNIT
VDD_CORE MAIN domain core supply –0.3 1.05 V
VDD_MCU MCUSS core supply –0.3 1.05 V
VDD_CPU CPU core supply –0.3 1.05 V
VDD_MCU_WAKE1 Core supply for MCU WAKE function –0.3 1.05 V
VDD_WAKE0 Core supply for MAIN domain WAKE function –0.3 1.05 V
VDDA_0P8_DLL_MMC0 MMC0 DLL analog supply –0.3 1.05 V
VDDAR_CORE MAIN domain RAM supply –0.3 1.05 V
VDDAR_MCU MCUSS RAM supply –0.3 1.05 V
VDDAR_CPU CPU RAM supply –0.3 1.05 V
VDDA_0P8_DSITX DSITX clock supply –0.3 1.05 V
VDDA_0P8_DSITX_C DSITX clock supply –0.3 1.05 V
VDDA_0P8_CSIRX0_1 CSIRX analog supply low –0.3 1.05 V
VDDA_0P8_SERDES0_1 SERDES0-1 analog supply low –0.3 1.05 V
VDDA_0P8_SERDES_C0_1 SERDES0-1 clock supply –0.3 1.05 V
VDDA_0P8_USB USB0-1 0.8 V analog supply –0.3 1.05 V
VDDA_0P8_PLL_DDR0 DDR0 PLL analog supply –0.3 1.05 V
VDDA_0P8_PLL_DDR1 DDR1 PLL analog supply –0.3 1.05 V
VDDA_1P8_USB USB0-1 1.8 V analog supply –0.3 2.2 V
VDDA_1P8_DSITX DSITX analog supply high –0.3 2.2 V
VDDA_1P8_CSIRX0_1 CSIRX analog supply high –0.3 2.2 V
VDDA_1P8_SERDES0_1 SERDES0-1 analog supply high –0.3 2.2 V
VDDA_1P8_SERDES2_4 SERDES2-4 analog supply high –0.3 2.2 V
VDDA_3P3_USB USB0-1 3.3 V analog supply –0.3 3.8 V
VDDA_MCU_PLLGRP0 Analog supply for MCU PLL Group 0 –0.3 2.2 V
VDDA_PLLGRP0 Analog supply for Main PLL Group 0 –0.3 2.2 V
VDDA_PLLGRP1 Analog supply for Main PLL Group 1 –0.3 2.2 V
VDDA_PLLGRP2 Analog supply for Main PLL Group 2 –0.3 2.2 V
VDDA_PLLGRP5 Analog supply for MAIN PLL Group 5 (DDR) –0.3 2.2 V
VDDA_PLLGRP6 Analog supply for MAIN PLL Group 6 –0.3 2.2 V
VDDA_PLLGRP7 Analog supply for MAIN PLL Group 7 –0.3 2.2 V
VDDA_PLLGRP8 Analog supply for MAIN PLL Group 8 –0.3 2.2 V
VDDA_PLLGRP9 Analog supply for MAIN PLL Group 9 –0.3 2.2 V
VDDA_PLLGRP10 Analog supply for MAIN PLL Group 10 –0.3 2.2 V
VDDA_PLLGRP12 Analog supply for MAIN PLL Group 12 –0.3 2.2 V
VDDA_PLLGRP13 Analog supply for MAIN PLL Group 13 –0.3 2.2 V
VDDA_WKUP Oscillator supply for WKUP domain –0.3 2.2 V
VDDA_ADC0 ADC analog supply –0.3 2.2 V
VDDA_ADC1 ADC analog supply –0.3 2.2 V
VDDA_MCU_TEMP Analog supply for temperature sensor 0 in MCU domain –0.3 2.2 V
VDDA_POR_WKUP WKUP domain analog supply –0.3 2.2 V
VDDA_TEMP_0 Analog supply for temperature sensor 0 –0.3 2.2 V
VDDA_TEMP_1 Analog supply for temperature sensor 1 –0.3 2.2 V
VDDA_TEMP_2 Analog supply for temperature sensor 2 -0.3 2.2 V
VDDA_TEMP_3 Analog supply for temperature sensor 3 –0.3 2.2 V
VDDA_TEMP_4 Analog supply for temperature sensor 4 –0.3 2.2 V
VDDA_OSC1 HFOSC1 supply –0.3 2.2 V
VDDS_DDR DDR interface power supply –0.3 1.2 V
VDDS_DDR_C0 IO power for DDR0 Memory Clock Bit (MCB) macro –0.3 1.2 V
VDDS_DDR_C1 IO power for DDR1 Memory Clock Bit (MCB) macro –0.3 1.2 V
VDDS_MMC0 MMC0 IO supply –0.3 2.2 V
VDDSHV0_MCU IO supply MCUSS general IO group, and MCU and MAIN domain warm reset pins 1.8 V –0.3 2.2 V
3.3 V –0.3 3.8
VDDSHV0 IO supply for MAIN domain general 1.8 V –0.3 2.2 V
3.3 V –0.3 3.8
VDDSHV1_MCU IO supply for MCUSS IO group 1 1.8 V –0.3 2.2 V
3.3 V –0.3 3.8
VDDSHV2_MCU IO supply for MCUSS IO group 2 1.8 V –0.3 2.2 V
3.3 V –0.3 3.8
VDDSHV2 IO supply for MAIN domain IO group 2 1.8 V –0.3 2.2 V
3.3 V –0.3 3.8
VDDSHV5 IO supply for MAIN domain IO group 5 1.8 V –0.3 2.2 V
3.3 V –0.3 3.8
VPP_CORE Supply voltage range for CORE EFUSE domain –0.3 1.89 V
VPP_MCU Supply voltage range for MCU EFUSE domain –0.3 1.89 V
USB0_VBUS(8) Voltage range for USB VBUS comparator input –0.3 3.6 V
Steady State Max. Voltage at all fail-safe IO pins I2C0_SCL, I2C0_SDA, WKUP_I2C0_SCL, WKUP_I2C0_SDA, MCU_I2C0_SCL, MCU_I2C0_SDA, EXTINTn –0.3 3.8 V
MCU_PORz, PORz –0.3 3.8 V
Steady State Max. Voltage at all other IO pins(3) VMON1_ER_VSYS, VMON3_IR_VEXT1P8, VMON4_IR_VEXT1P8, –0.3 2.2 V
VMON2_IR_VCPU, VMON6_IR_VEXT0P8(7) –0.3 1.05
VMON5_IR_VEXT3P3(7) –0.3 3.8
All other IO pins –0.3 IO supply voltage + 0.3 V
Transient Overshoot and Undershoot specification at IO pin 20% of IO supply voltage for up to 20% of signal period
(see Figure 7-1, IO Transient Voltage Ranges)		 0.2 × VDD(6) V
Latch-up Performance, Class II (125°C)(4) I-Test –100 100 mA
Over-Voltage (OV) Test NA 1.5 × VDD(6) V
TSTG(5) Storage temperature –55 +150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) All voltage values are with respect to their associated VSS or VSSA_x, unless otherwise noted.
(3) This parameter applies to all IO pins which are not fail-safe and the requirement applies to all values of IO supply voltage. For example, if the voltage applied to a specific IO supply is 0 volts the valid input voltage range for any IO powered by that supply will be –0.3 to +0.3 volts. Special attention should be applied anytime peripheral devices are not powered from the same power sources used to power the respective IO supply. It is important the attached peripheral never sources a voltage outside the valid input voltage range, including power supply ramp-up and ramp-down sequences.
(4) For current pulse injection:
Pins stressed per JEDEC JESD78E (Class II) and passed with specified I/O pin injection current and clamp voltage of 1.5 times maximum recommended I/O voltage and negative 0.5 times maximum recommended I/O voltage.
For overvoltage performance:
Supplies stressed per JEDEC JESD78E (Class II) and passed specified voltage injection.
(5) For tape and reel the storage temperature range is [–10°C; +50°C] with a maximum relative humidity of 70%. TI recommends returning to ambient room temperature before usage.
(6) VDD is the voltage on the corresponding power-supply pin(s) for the IO.
(7) The VMON pins provides a way to monitor the system power supply. For more information, see System Power Supply Monitor Design Guidelines using VMON/POK.
(8) An external resistor divider is required to limit the voltage applied to this device pin. For more information, see USB VBUS Design Guidelines.

Fail-safe IO terminals are designed such they do not have dependencies on the respective IO power supply voltage. This allows external voltage sources to be connected to these IO terminals when the respective IO power supplies are turned off. The specific signals that are fail safe are highlighted in the parameter "Steady State Max. Voltage at all fail-safe IO pins". All other IO terminals are not fail-safe and the voltage applied to them should be limited to the value defined by the "Steady State Max. Voltage at all other IO pins" parameter in Absolute Maximum Ratings.

GUID-A52A1421-00B2-4FB0-82DD-FD9BBC2E1BA8-low.gif
A. Tovershoot + Tundershoot < 20% of Tperiod
Figure 7-1 IO Transient Voltage Ranges