SNAS854 February   2023 TDC1000-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information (1)
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Transmitter Signal Path
      2. 8.3.2 Receiver Signal Path
      3. 8.3.3 Low Noise Amplifier (LNA)
      4. 8.3.4 Programmable Gain Amplifier (PGA)
      5. 8.3.5 Receiver Filters
      6. 8.3.6 Comparators for STOP Pulse Generation
        1. 8.3.6.1 Threshold Detector and DAC
        2. 8.3.6.2 Zero-Cross Detect Comparator
        3. 8.3.6.3 Event Manager
      7. 8.3.7 Common-Mode Buffer (VCOM)
      8. 8.3.8 Temperature Sensor
        1. 8.3.8.1 Temperature Measurement With Multiple RTDs
        2. 8.3.8.2 Temperature Measurement With a Single RTD
    4. 8.4 Device Functional Modes
      1. 8.4.1 Time-of-Flight Measurement Mode
        1. 8.4.1.1 Mode 0
        2. 8.4.1.2 Mode 1
        3. 8.4.1.3 Mode 2
      2. 8.4.2 State Machine
      3. 8.4.3 TRANSMIT Operation
        1. 8.4.3.1 Transmission Pulse Count
        2. 8.4.3.2 TX 180° Pulse Shift
        3. 8.4.3.3 Transmitter Damping
      4. 8.4.4 RECEIVE Operation
        1. 8.4.4.1 Single Echo Receive Mode
        2. 8.4.4.2 Multiple Echo Receive Mode
      5. 8.4.5 Timing
        1. 8.4.5.1 Timing Control and Frequency Scaling (CLKIN)
        2. 8.4.5.2 TX/RX Measurement Sequencing and Timing
      6. 8.4.6 Time-of-Flight (TOF) Control
        1. 8.4.6.1 Short TOF Measurement
        2. 8.4.6.2 Standard TOF Measurement
        3. 8.4.6.3 Standard TOF Measurement With Power Blanking
        4. 8.4.6.4 Common-Mode Reference Settling Time
        5. 8.4.6.5 TOF Measurement Interval
      7. 8.4.7 Averaging and Channel Selection
      8. 8.4.8 Error Reporting
    5. 8.5 Programming
      1. 8.5.1 Serial Peripheral Interface (SPI)
        1. 8.5.1.1 Chip Select Bar (CSB)
        2. 8.5.1.2 Serial Clock (SCLK)
        3. 8.5.1.3 Serial Data Input (SDI)
        4. 8.5.1.4 Serial Data Output (SDO)
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Level and Fluid Identification Measurements
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Level Measurements
          2. 9.2.1.2.2 Fluid Identification
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Water Flow Metering
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Regulations and Accuracy
          2. 9.2.2.2.2 Transit-Time in Ultrasonic Flow Meters
          3. 9.2.2.2.3 ΔTOF Accuracy Requirement Calculation
          4. 9.2.2.2.4 Operation
        3. 9.2.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Timing Requirements

TA = 25°C, VDD = VIO = 3.7 V and ƒSCLK = 1 MHz (unless otherwise noted).
MIN TYP MAX UNIT
ƒSCLK Serial clock frequency 26 MHz
t1 High period, SCLK 16 ns
t2 Low period, SCLK 16 ns
t3 Set-up time, nCS to SCLK 10 ns
t4 Set-up time, SDI to SCLK 12 ns
t5 Hold time, SCLK to SDI 12 ns
t6 SCLK transition to SDO valid time 16 ns
t7 Hold time, SCLK transition to nCS rising edge 10 ns
t8 nCS inactive 17 ns
t9 Hold time, SCLK transition to nCS falling edge 10 ns
tr / tf Signal rise and fall times(1) 1.8 ns
(1) The slew rate is measured from 10% to 90% and is represented by the average of the rising and falling slew rates.
GUID-D5709F3F-04FD-444F-9399-1D31E6DD08B3-low.gif Figure 6-1 SPI Timing Diagram