SNAS662 July   2015 TDC1011

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Transmitter Signal Path
      2. 8.3.2 Receiver Signal Path
      3. 8.3.3 Low Noise Amplifier (LNA)
      4. 8.3.4 Programmable Gain Amplifier (PGA)
      5. 8.3.5 Receiver Filters
      6. 8.3.6 Comparators for STOP Pulse Generation
        1. 8.3.6.1 Threshold Detector and DAC
        2. 8.3.6.2 Zero-cross Detect Comparator
        3. 8.3.6.3 Event Manager
      7. 8.3.7 Common-mode Buffer (VCOM)
      8. 8.3.8 Temperature Sensor
        1. 8.3.8.1 Temperature Measurement with Multiple RTDs
        2. 8.3.8.2 Temperature Measurement with a Single RTD
    4. 8.4 Device Function Description
      1. 8.4.1 Time-of-Flight Measurement Mode
        1. 8.4.1.1 Liquid Level or Fluid Identification
      2. 8.4.2 State Machine
      3. 8.4.3 TRANSMIT Operation
        1. 8.4.3.1 Transmission Pulse Count
        2. 8.4.3.2 TX 180° Pulse Shift
        3. 8.4.3.3 Transmitter Damping
      4. 8.4.4 RECEIVE Operation
        1. 8.4.4.1 Single Echo Receive Mode
        2. 8.4.4.2 Multiple Echo Receive Mode
      5. 8.4.5 Timing
        1. 8.4.5.1 Timing Control and Frequency Scaling (CLKIN)
        2. 8.4.5.2 TX/RX Measurement Sequencing and Timing
      6. 8.4.6 Time-of-Flight (TOF) Control
        1. 8.4.6.1 Short TOF Measurement
        2. 8.4.6.2 Standard TOF Measurement
        3. 8.4.6.3 Standard TOF Measurement with Power Blanking
        4. 8.4.6.4 Common-mode Reference Settling Time
        5. 8.4.6.5 TOF Measurement Interval
      7. 8.4.7 Error Reporting
    5. 8.5 Programming
      1. 8.5.1 Serial Peripheral Interface (SPI)
        1. 8.5.1.1 Chip Select Bar (CSB)
        2. 8.5.1.2 Serial Clock (SCLK)
        3. 8.5.1.3 Serial Data Input (SDI)
        4. 8.5.1.4 Serial Data Output (SDO)
    6. 8.6 Register Maps
      1. 8.6.1 TDC1011 Registers
        1. 8.6.1.1  CONFIG_0 Register (address = 0h) [reset = 45h]
        2. 8.6.1.2  CONFIG_1 Register (address = 1h) [reset = 40h]
        3. 8.6.1.3  CONFIG_2 Register (address = 2h) [reset = 0h]
        4. 8.6.1.4  CONFIG_3 Register (address 3h) [reset = 3h]
        5. 8.6.1.5  CONFIG_4 Register (address = 4h) [reset = 1Fh]
        6. 8.6.1.6  TOF_1 Register (address = 5h) [reset = 0h]
        7. 8.6.1.7  TOF_0 Register (address = 6h) [reset = 0h]
        8. 8.6.1.8  ERROR_FLAGS Register (address = 7h) [reset = 0h]
        9. 8.6.1.9  TIMEOUT Register (address = 8h) [reset = 19h]
        10. 8.6.1.10 CLOCK_RATE Register (address = 9h) [reset = 0h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Level and Fluid Identification Measurements
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Level Measurements
          2. 9.2.1.2.2 Fluid Identification
        3. 9.2.1.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted) (1)(2)
MIN MAX UNIT
VDD Analog supply voltage, VDD pins –0.3 6.0 V
VIO I/O supply voltage (VIO must always be lower than or equal to VDD supply) –0.3 6.0 V
VI Voltage on any analog input pin(3) –0.3 VDD + 0.3 V
VI Voltage on any digital input pin(3) –0.3 VIO + 0.3 V
II Input current at any pin 5 mA
TJ Operating junction temperature –40 125 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) When the input voltage at a pin exceeds the power supplies, the current at that pin must not exceed 5 mA and the voltage (VI) at that pin must not exceed 6.0 V.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC A100-002(1) ±2000 V
Charged-device model (CDM), per AEC Q100-011 All pins ±500
Corner pins (1, 14, 15 and 28) ±750
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VDD Analog supply voltage, VDD pins 2.7 5.5 V
VIO Digital supply voltage, (VIO must always be lower than or equal to VDD supply) 1.8 VDD V
VI Voltage on any analog input pin GND VDD V
VI Voltage on any digital input pin GND VIO V
ƒCLKIN Operating frequency 0.06 16 MHz
TJ Operating junction temperature –40 125 °C

6.4 Thermal Information(1)

THERMAL METRIC TDC1011
TSSOP
PW (28 PINS) 		UNIT
RθJA Junction-to-ambient thermal resistance 83.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 29.9
RθJB Junction-to-board thermal resistance 40.8
ψJT Junction-to-top characterization parameter 2.4
ψJB Junction-to-board characterization parameter 40.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. These specifications are interpreted as conditions that do not degrade the device parametric or functional specifications for the life of the product containing it. TA = 25°C, VDD = VIO = 3.7 V, VCOM = VCM = VDD / 2, CVCOM = 10 nF (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TRANSMITTER SIGNAL PATH (TX)
VOUT(TX) Output voltage swing ƒout = 1 MHz, RL = 75 Ω to VCM HIGH VDD – 0.32 V
LOW 0.32 V
IOUT(TX) Output drive current ƒout = 1 MHz, RL = 75 Ω to VCM 22 mARMS
ƒOUT(TX) Output TX frequency ƒCLKIN = 8 MHz, divide-by-2 (programmable; see Transmitter Signal Path) 4 MHz
RECEIVER SIGNAL PATH (RX)
ΔtSTOP STOP cycle-to-cycle jitter LNA capacitive feedback, GPGA = 6 dB, ƒIN = 1 MHz, VIN = 100 mVPP, CVCOM = 1 µF and Figure 14 50 psRMS
LNA
GLNA LNA gain Capacitive feedback, CIN = 300 pF, ƒIN = 1 MHz, RL = 100 kΩ to VCM, CVCOM = 1 µF 20 dB
enLNA LNA input referred noise density Capacitive feedback, CIN = 300 pF, ƒ = 1 MHz, VDD = 3.1 V, VIN = VCM, RL = ∞, CVCOM = 1 µF 2 nV/√Hz
VIN(LNA) Input voltage range Resistive feedback, RL = 1 kΩ to VCM, CVCOM = 1 µF HIGH VCM + (VCM – 0.24) / (GLNA) V
LOW VCM – (VCM – 0.24) / (GLNA) V
VOUT(LNA) Output voltage range Resistive feedback, RL = 1 kΩ to VCM, CVCOM = 1 µF HIGH VDD – 0.24 V
LOW GND + 0.24 V
SRLNA Slew rate(6) Resistive feedback, RL = 1 kΩ to VCM, 100mV step, CVCOM = 1 µF 9 V/μs
BWLNA –3-dB bandwidth Capacitive feedback, CIN = 300 pF, RL= 100 kΩ to VCM, CVCOM = 1 µF 5 MHz
VOS(LNA) LNA input offset voltage Resistive mode, VIN = VCM, RL = ∞ ±320 µV
VCOM
VCOM VCOM output voltage CVCOM = 1 µF VCM V
VCOM output error 0.5%
PGA
VIN(PGA) PGA input range  RL = 100 kΩ to VCM, CL = 10 pF to GND HIGH VCM + (VCM – 0.06) / (GPGA) V
LOW VCM – (VCM – 0.06) / (GPGA) V
GPGAMIN PGA min gain DC, RL = ∞, CL = 10 pF 0 dB
GPGAMAX PGA max gain 21 dB
ΔGPGA PGA gain step size 3 dB
GE(PGA) PGA gain error DC, GPGA = 0 dB, RL = ∞, CL = 10 pF 5%
TCGPGA PGA gain temperature coefficient DC, GPGA = 0 dB, RL = ∞, CL = 10 pF 170 ppm/°C
enPGA PGA input referred noise density GPGA = 21 dB, ƒ = 1 MHz, VDD = 3.1V, VIN = VCM, RL = ∞, CVCOM = 1 µF 3.1 nV/√Hz
VOUT(PGA) Output range RL = 100 kΩ to VCM, CL = 10 pF to GND HIGH VDD – 0.06 V
LOW 60 mV
BWPGA –3-db bandwidth GPGA = 21 dB, RL = 100 kΩ to VCM, CL = 10 pF, CVCOM = 1 µF 5 MHz
SRPGA Slew rate(6) GPGA = 21 dB, RL = 100 kΩ to VCM, CL = 10 pF, CVCOM = 1 µF 12.5 V/µs
ZERO CROSS COMPARATOR
VOS(COMP) Input offset voltage(5) Referred to VCOM ±115 µV
enCOMP Zero crossing comparator input referred noise(5)  1 MHz 5 nV/√Hz
HYSTCOMP Hysteresis (5) Referred to VCOM -10 mV
THRESHOLD DETECTOR
VTHDET Threshold level ECHO_QUAL_THLD = 0h, VCOM referred –35 mV
ECHO_QUAL_THLD = 7h, VCOM referred –1.5 V
TEMPERATURE SENSOR INTERFACE(1)
TERROR Temperature measurement accuracy RREF = 1 kΩ, PT1000 range: –40 to 125°C(2) 1 °C
RREF = 1 kΩ, PT1000 range: –15°C to 85°C(2) 0.5 °C
Relative accuracy RREF = 1 kΩ, RRTD1 = RRTD2 = 1.1 kΩ 0.02  °CRMS
TGE Gain error 5.8 m°C/°C 
POWER SUPPLY
IDD VDD supply current Sleep (EN = CLKIN = TRIGGER = low) 0.61 µA
Continuous receive mode, LNA and PGA bypassed 2.8 3 mA
Continuous receive mode, LNA and PGA active 6.2 7.5 mA
Temp. measurement only (PT1000 mode)(3) 370 400 µA
Temp. measurement (PT500 mode)(4) 500 540 µA
IIO VIO supply sleep current(5) Sleep (EN = CLKIN = TRIGGER = low) 2 nA
DIGITAL INPUT/OUTPUT CHARACTERISTICS
VIL Input logic low threshold 0.2 × VIO V
VIH Input logic high threshold 0.8 × VIO V
VOL Output logic low threshold SDO pin, 100-μA current 0.2 V
SDO pin, 1.85-mA current 0.4 V
START and STOP pins, 100-μA current 0.5 V
START and STOP pins, 1.85-mA current 0.6 V
ERRB pin, 100-μA current 0.2 V
ERRB pin, 1.85-mA current 0.4 V
VOH Output logic high threshold SDO pin, 100-μA current VIO – 0.2 V
SDO pin, 1.85-mA current VIO – 0.6 V
START and STOP pins, 100-μA current VIO – 0.5 V
START and STOP pins, 1.85-mA current VIO – 0.6 V
ERRB pin, 0-µA current VIO – 0.2 V
IOMAX Maximum output current for SDO, START and STOP 1.85 mA
(1) With ideal external components. For more detail see Temp Sensor Measurement section.
(2) PT1000 RTD approximate resistance: 800 Ω ≡ –52°C, 931 Ω ≡ –18°C, 1.10 kΩ ≡ 26°C, 1.33 kΩ ≡ 86°C and 1.48 kΩ ≡ 125°C.
(3) Specified currents include 120μA which flows through the RTD sensor in PT1000 mode (TEMP_RTD_SEL = 0).
(4) Specified currents include 240μA which flows through the RTD sensor in PT500 mode (TEMP_RTD_SEL = 1).
(5) Specified by design.
(6) The slew rate is measured from 10% to 90% and is represented by the average of the rising and falling slew rates.

6.6 Timing Requirements

TA = 25°C, VDD = VIO = 3.7 V and ƒSCLK = 1 MHz (unless otherwise noted).
MIN NOM MAX UNIT
ƒSCLK Serial clock frequency 26 MHz
t1 High period, SCLK 16 ns
t2 Low period, SCLK 16 ns
t3 Set-up time, nCS to SCLK 10 ns
t4 Set-up time, SDI to SCLK 12 ns
t5 Hold time, SCLK to SDI 12 ns
t6 SCLK transition to SDO valid time 16 ns
t7 Hold time, SCLK transition to nCS rising edge 10 ns
t8 nCS inactive 17 ns
t9 Hold time, SCLK transition to nCS falling edge 10 ns
tr / tf Signal rise and fall times(1) 1.8 ns
(1) The slew rate is measured from 10% to 90% and is represented by the average of the rising and falling slew rates.
TDC1011 tim_SPI_NAS648.gifFigure 1. SPI Timing Diagram

6.7 Switching Characteristics

TA = 25°C, VDD = VIO = 3.7 V, ƒCLKIN = 8 MHz.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
START, STOP, ENABLE, RESET, CLOCKIN, TRIGGER, ERR
PWSTART Pulse width for START signal TX_FREQ_DIV = 2h, NUM_TX = 1 1 μs
TX_FREQ_DIV = 2h, NUM_TX = 2 2 μs
TX_FREQ_DIV = 2h, NUM_TX ≥ 3 3 μs
tr / tf START Rise/fall time for START signal 20% to 80%, 20-pF load 0.25 ns
tr / tf STOP Rise/fall time for STOP signal 20% to 80%, 20-pF load 0.25 ns
ƒCLKIN Maximum CLKIN input frequency 16 MHz
tr / tf CLKIN CLKIN input rise/fall time(1) 20% to 80% 10 ns
tr / tf TRIG TRIGGER input rise/fall time(1) 20% to 80% 10 ns
tEN_TRIG Enable to trigger wait time(1) 50 ns
tRES_TRIG Reset to trigger wait time(1) TX_FREQ_DIV = 2h (see TX/RX Measurement Sequencing and Timing) 3.05 μs
(1) Specified by design.

6.8 Typical Characteristics

At TA = 25°C, unless otherwise noted.
TDC1011 C001_SNAS648.png
VDD = VIO = 3.7V Capacitive Feedback Mode RL = 1kΩ
Figure 2. LNA ZOUT vs Frequency
TDC1011 C013_SNAS648.png
VDD = VIO = 3.1V Capacitive Feedback Mode RL = ∞
Figure 4. LNA Input-referred Noise vs Frequency
TDC1011 C005_SNAS648.png
VDD = VIO = 3.7V Resistive Feedback Mode RL = 1kΩ
VIN = 100mV fIN = 100kHz
Figure 6. LNA Response
TDC1011 C007_SNAS648.png
VDD = VIO = 3.7V Capacitive Feedback Mode RL = 100kΩ
CIN = 300 pF
Figure 8. LNA Gain vs Frequency
TDC1011 C009_SNAS648.png
VDD = VIO = 5V LNA Capacitive Feedback Mode PGA Gain of 6dB
VIN = 100mV fIN = 1MHz
(See Figure 14) Count >= 10000
Figure 10. RX Jitter Histogram
TDC1011 C011_SNAS648.png
VDD = VIO = 3.7V LNA Capacitive Feedback Mode PGA Gain of 6dB
VIN = 100mV fIN = 1MHz
TA = -40C° (See Figure 14) Count >= 10000
Figure 12. RX Jitter Histrogam
TDC1011 C002_SNAS648.png
VDD = VIO = 3.7V Gain of 21dB RL = 1kΩ
Figure 3. PGA ZOUT vs Frequency
TDC1011 C014_SNAS648.png
VDD = VIO = 3.7V Gain of 21dB RL = ∞
Figure 5. PGA Input-referred Noise vs Frequency
TDC1011 C006_SNAS648.png
VDD = VIO = 3.7V Gain of 21dB RL = 100kΩ
VIN = 100mV fIN = 100kHz
Figure 7. PGA Response
TDC1011 C008_SNAS648.png
VDD = VIO = 3.7V Gain of 21dB RL = 100kΩ
Figure 9. PGA Gain vs Frequency
TDC1011 C010_SNAS648.png
VDD = VIO = 3.7V LNA Capacitive Feedback Mode PGA Gain of 6dB
VIN = 100mV fIN = 1MHz
TA = 25C° (See Figure 14) Count >= 10000
Figure 11. RX Jitter Histogram
TDC1011 C012_SNAS648.png
VDD = VIO = 3.7V LNA Capacitive Feedback Mode PGA Gain of 6dB
VIN = 100mV fIN = 1MHz
TA = 125C° (See Figure 14) Count >= 10000
Figure 13. RX Jitter Histogram