SNAS686
May
2016
TDC7201
PRODUCTION DATA.
1 Features
2 Applications
3 Description
4 Revision History
5 Pin Configuration and Functions
6 Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements
6.7
Switching Characteristics
6.8
Typical Characteristics
7 Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
LDO
7.3.2
CLOCK
7.3.3
Counters
7.3.3.1
Coarse and Clock Counters Description
7.3.3.2
Coarse and Clock Counters Overflow
7.3.3.3
Clock Counter STOP Mask
7.3.3.4
ENABLE
7.4
Device Functional Modes
7.4.1
Calibration
7.4.2
Measurement Modes
7.4.2.1
Measurement Mode 1
7.4.2.1.1
Calculating Time-of-Flight (Measurement Mode 1)
7.4.2.2
Measurement Mode 2
7.4.2.2.1
Calculating Time-of-Flight (TOF) (Measurement Mode 2)
7.4.3
Timeout
7.4.4
Multi-Cycle Averaging
7.4.5
START and STOP Edge Polarity
7.4.6
Measurement Sequence
7.4.7
Wait Times for TDC7201 Startup
7.5
Programming
7.5.1
Serial Peripheral Interface (SPI)
7.5.1.1
CSBx
7.5.1.2
SCLK
7.5.1.3
DIN
7.5.1.4
DOUTx
7.5.1.5
Register Read/Write
7.5.1.6
Auto Increment Mode
7.6
Register Maps
7.6.1
Register Initialization
7.6.2
TDCx_CONFIG1: TDCx Configuration Register 1 R/W (address = 00h, CSBx asserted) [reset = 0h]
7.6.3
TDCx_CONFIG2: TDCx Configuration Register 2 R/W (address = 01h, CSBx asserted) [reset = 40h]
7.6.4
TDCx_INT_STATUS: Interrupt Status Register (address = 02h, CSBx asserted) [reset = 00h]
7.6.5
TDCx_INT_MASK: TDCx Interrupt Mask Register R/W (address = 03h, CSBx asserted) [reset = 07h]
7.6.6
TDCx_COARSE_CNTR_OVF_H: Coarse Counter Overflow High Value Register (address = 04h, CSBx asserted) [reset = FFh]
7.6.7
TDCx_COARSE_CNTR_OVF_L: TDCx Coarse Counter Overflow Low Value Register (address = 05h, CSBx asserted) [reset = FFh ]
7.6.8
TDCx_CLOCK_CNTR_OVF_H: Clock Counter Overflow High Register (address = 06h, CSBx asserted) [reset = FFh]
7.6.9
TDCx_CLOCK_CNTR_OVF_L: Clock Counter Overflow Low Register (address = 07h, CSBx asserted) [reset = FFh]
7.6.10
TDCx_CLOCK_CNTR_STOP_MASK_H: CLOCK Counter STOP Mask High Value Register (address = 08h, CSBx asserted) [reset = 00h]
7.6.11
TDCx_CLOCK_CNTR_STOP_MASK_L: CLOCK Counter STOP Mask Low Value Register (address = 09h, CSBx asserted) [reset = 00h]
7.6.12
TDCx_TIME1: Time 1 Register (address: 10h, CSBx asserted) [reset = 00_0000h]
7.6.13
TDCx_CLOCK_COUNT1: Clock Count Register (address: 11h, CSBx asserted) [reset = 00_0000h]
7.6.14
TDCx_TIME2: Time 2 Register (address: 12h, CSBx asserted) [reset = 00_0000h]
7.6.15
TDCx_CLOCK_COUNT2: Clock Count Register (address: 13h, CSBx asserted) [reset = 00_0000h]
7.6.16
TDCx_TIME3: Time 3 Register (address: 14h, CSBx asserted) [reset = 00_0000h]
7.6.17
TDCx_CLOCK_COUNT3: Clock Count Registers (address: 15h, CSBx asserted) [reset = 00_0000h]
7.6.18
TDCx_TIME4: Time 4 Register (address: 16h, CSBx asserted) [reset = 00_0000h]
7.6.19
TDCx_CLOCK_COUNT4: Clock Count Register (address: 17h, CSBx asserted) [reset = 00_0000h]
7.6.20
TDCx_TIME5: Time 5 Register (address: 18h, CSBx asserted) [reset = 00_0000h]
7.6.21
TDCx_CLOCK_COUNT5: Clock Count Register (address: 19h, CSBx asserted) [reset = 00_0000h]
7.6.22
TDCx_TIME6: Time 6 Register (address: 1Ah, CSBx asserted) [reset = 00_0000h]
7.6.23
TDCx_CALIBRATION1: Calibration 1 Register (address: 1Bh, CSBx asserted) [reset = 00_0000h]
7.6.24
TDCx_CALIBRATION2: Calibration 2 Register (address: 1Ch, CSBx asserted) [reset = 00_0000h]
8 Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Measuring Time Periods Less Than 12 ns Using TDC7201
8.2.3
Application Curves
8.3
CLOCK Recommendations
8.3.1
CLOCK Accuracy
8.3.2
CLOCK Jitter
9 Power Supply Recommendations
10 Layout
10.1
Layout Guidelines
10.2
Layout Example
11 Device and Documentation Support
11.1
Documentation Support
11.1.1
Third-Party Products Disclaimer
11.1.2
Related Documentation
11.2
Community Resources
11.3
Trademarks
11.4
Electrostatic Discharge Caution
11.5
Glossary
12 Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
10 Layout
10.1 Layout Guidelines
In a 4-layer board design, the recommended layer stack order from top to bottom is: signal, ground, power and signal.
Bypass capacitors should be placed in close proximity to the VDD pins.
The length of the START and STOP traces from the TDC7201 to the AFE or MCU should be matched to prevent uneven signal delays. Also, avoid unnecessary via-holes on these traces and keep the routing as short and direct as possible to minimize parasitic capacitance on the PCB.
Route the SPI signal traces close together. Place a series resistor at the source of DOUT (close to the TDC7201) and series resistors at the sources of DIN, SCLK, and CSB (close to the master MCU).