SLLSFJ8A december   2021  – june 2023 TDP0604

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  4-Level Inputs
      2. 8.3.2  I/O Voltage Level Selection
      3. 8.3.3  HPD_OUT
      4. 8.3.4  Lane Control
      5. 8.3.5  Swap
      6. 8.3.6  Linear and Limited Redriver
      7. 8.3.7  Main Link Inputs
      8. 8.3.8  Receiver Equalizer
      9. 8.3.9  CTLE Bypass
      10. 8.3.10 Input Signal Detect
      11. 8.3.11 Main Link Outputs
        1. 8.3.11.1 Transmitter Bias
        2. 8.3.11.2 Transmitter Impedance Control
        3. 8.3.11.3 TX Slew Rate Control
        4. 8.3.11.4 TX Pre-Emphasis and De-Emphasis Control
        5. 8.3.11.5 TX Swing Control
      12. 8.3.12 DDC Buffer
      13. 8.3.13 HDMI DDC Capacitance
      14. 8.3.14 DisplayPort
    4. 8.4 Device Functional Modes
      1. 8.4.1 MODE Control
        1. 8.4.1.1 I2C Mode (MODE = "F")
        2. 8.4.1.2 Pin Strap Modes
          1. 8.4.1.2.1 Pin-Strap: HDMI 1.4 and HDMI 2.0 Functional Description
      2. 8.4.2 DDC Snoop Feature
        1. 8.4.2.1 HDMI Type
      3. 8.4.3 Low Power Modes
    5. 8.5 Programming
      1. 8.5.1 Pseudocode Examples
        1. 8.5.1.1 HDMI 2.0 Source Example with DDC Snoop and DDC Buffer Enabled
      2. 8.5.2 TDP0604 I2C Address Options
      3. 8.5.3 I2C Target Behavior
    6. 8.6 Register Maps
      1. 8.6.1 TDP0604 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Source-Side Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Pre-Channel (LAB)
        2. 9.2.2.2 Post-Channel (LCD)
        3. 9.2.2.3 Common Mode Choke
        4. 9.2.2.4 ESD Protection
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Supply Decoupling
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

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