SLLSFI6A
july 2022 – july 2023
TDP1204
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements
6.7
Switching Characteristics
6.8
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Functional Block Diagram
8.2
Feature Description
8.2.1
4-Level Inputs
8.2.2
I/O Voltage Level Selection
8.2.3
HPD_OUT
8.2.4
Lane Control
8.2.5
Swap
8.2.6
Linear and Limited Redriver
8.2.7
Main Link Inputs
8.2.8
Receiver Equalizer
8.2.9
CTLE Bypass
8.2.10
Adaptive Equalization in HDMI 2.1 FRL
8.2.10.1
HDMI 2.1 TX Compliance Testing with AEQ Enabled
8.2.11
HDMI 2.1 Link Training Compatible Rx EQ
8.2.12
Input Signal Detect
8.2.13
Main Link Outputs
8.2.13.1
Transmitter Bias
8.2.13.2
Transmitter Impedance Control
8.2.13.3
TX Slew Rate Control
8.2.13.4
TX Pre-Emphasis and De-Emphasis Control
8.2.13.5
TX Swing Control
8.2.14
DDC Buffer
8.2.15
HDMI DDC Capacitance
8.2.16
DisplayPort
8.3
Device Functional Modes
8.3.1
MODE Control
8.3.1.1
I2C Mode (MODE = "F")
8.3.1.2
Pin Strap Modes
8.3.1.2.1
Pin-Strap: HDMI 1.4 and HDMI 2.0 Functional Description
8.3.1.2.2
Pin-Strap HDMI 2.1 Function (MODE = "0"): Fixed Rx EQ and DDC Buffer Enabled
8.3.1.2.3
Pin-Strap HDMI 2.1 Function (MODE = "1"): Flexible RX EQ and DDC Buffer Enabled
8.3.1.2.4
Pin-Strap HDMI 2.1 Function (MODE = "R"): Flexible Rx EQ and DDC Buffer Disabled
8.3.2
DDC Snoop Feature
8.3.2.1
HDMI Type
8.3.2.2
HDMI 2.1 FRL Snoop
8.3.3
Low Power States
8.4
Programming
8.4.1
Pseudocode Examples
8.4.1.1
HDMI 2.1 Source Example with DDC Snoop and DDC Buffer Enabled
8.4.1.2
HDMI 2.1 Source Example with DDC Snoop Disabled and DDC Buffer Disabled
8.4.2
TDP1204 I2C Address Options
8.4.3
I2C Target Behavior
8.5
Register Maps
8.5.1
TDP1204 Registers
9
Application and Implementation
9.1
Application Information
9.2
Typical Source-Side Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Pre-Channel (LAB)
9.2.2.2
Post-Channel (LCD)
9.2.2.3
Common Mode Choke
9.2.2.4
ESD Protection
9.2.3
Application Curves
9.3
Typical Sink-Side Application
9.3.1
Design Requirements
9.3.2
Detailed Design Procedures
9.4
Power Supply Recommendations
9.4.1
Supply Decoupling
9.5
Layout
9.5.1
Layout Guidelines
9.5.2
Layout Example
10
Device and Documentation Support
10.1
Documentation Support
10.1.1
Related Documentation
10.2
Receiving Notification of Documentation Updates
10.3
Support Resources
10.4
Trademarks
10.5
Electrostatic Discharge Caution
10.6
Glossary
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RNQ|40
MPQF457A
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sllsfi6a_oa
sllsfi6a_pm
9.2.3
Application Curves
Figure 9-3
FR4 Trace Insertion Loss at 6 GHz
Figure 9-5
Post-Channel Insertion Loss at TTP4
Figure 9-7
12 Gbps Output Eye at TTP4 After Pre and Post Channels
Figure 9-4
Pre-Channel Insertion Loss at TTP2
Figure 9-6
12 Gbps Input Eye at TTP2 After Pre-channel
Figure 9-8
12 Gbps Output Eye at TTP4_EQ After Pre and Post Channels