SLLSFI6A july   2022  – july 2023 TDP1204

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Feature Description
      1. 8.2.1  4-Level Inputs
      2. 8.2.2  I/O Voltage Level Selection
      3. 8.2.3  HPD_OUT
      4. 8.2.4  Lane Control
      5. 8.2.5  Swap
      6. 8.2.6  Linear and Limited Redriver
      7. 8.2.7  Main Link Inputs
      8. 8.2.8  Receiver Equalizer
      9. 8.2.9  CTLE Bypass
      10. 8.2.10 Adaptive Equalization in HDMI 2.1 FRL
        1. 8.2.10.1 HDMI 2.1 TX Compliance Testing with AEQ Enabled
      11. 8.2.11 HDMI 2.1 Link Training Compatible Rx EQ
      12. 8.2.12 Input Signal Detect
      13. 8.2.13 Main Link Outputs
        1. 8.2.13.1 Transmitter Bias
        2. 8.2.13.2 Transmitter Impedance Control
        3. 8.2.13.3 TX Slew Rate Control
        4. 8.2.13.4 TX Pre-Emphasis and De-Emphasis Control
        5. 8.2.13.5 TX Swing Control
      14. 8.2.14 DDC Buffer
      15. 8.2.15 HDMI DDC Capacitance
      16. 8.2.16 DisplayPort
    3. 8.3 Device Functional Modes
      1. 8.3.1 MODE Control
        1. 8.3.1.1 I2C Mode (MODE = "F")
        2. 8.3.1.2 Pin Strap Modes
          1. 8.3.1.2.1 Pin-Strap: HDMI 1.4 and HDMI 2.0 Functional Description
          2. 8.3.1.2.2 Pin-Strap HDMI 2.1 Function (MODE = "0"): Fixed Rx EQ and DDC Buffer Enabled
          3. 8.3.1.2.3 Pin-Strap HDMI 2.1 Function (MODE = "1"): Flexible RX EQ and DDC Buffer Enabled
          4. 8.3.1.2.4 Pin-Strap HDMI 2.1 Function (MODE = "R"): Flexible Rx EQ and DDC Buffer Disabled
      2. 8.3.2 DDC Snoop Feature
        1. 8.3.2.1 HDMI Type
        2. 8.3.2.2 HDMI 2.1 FRL Snoop
      3. 8.3.3 Low Power States
    4. 8.4 Programming
      1. 8.4.1 Pseudocode Examples
        1. 8.4.1.1 HDMI 2.1 Source Example with DDC Snoop and DDC Buffer Enabled
        2. 8.4.1.2 HDMI 2.1 Source Example with DDC Snoop Disabled and DDC Buffer Disabled
      2. 8.4.2 TDP1204 I2C Address Options
      3. 8.4.3 I2C Target Behavior
    5. 8.5 Register Maps
      1. 8.5.1 TDP1204 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Source-Side Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Pre-Channel (LAB)
        2. 9.2.2.2 Post-Channel (LCD)
        3. 9.2.2.3 Common Mode Choke
        4. 9.2.2.4 ESD Protection
      3. 9.2.3 Application Curves
    3. 9.3 Typical Sink-Side Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedures
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Supply Decoupling
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.5.1 Layout Guidelines

For the TDP1204 on a high-K board, it is required to solder the PowerPAD™ onto the thermal land to ground. A thermal land is the area of solder-tinned-copper underneath the PowerPAD package. On a high-K board, the TDP1204 can operate over the full temperature range by soldering the PowerPAD onto the thermal land. For the device to operate across the temperature range on a low-K board, a 1-oz Cu trace connecting the GND pins to the thermal land must be used. A simulation shows RθJA = 30.9°C/W allowing 950-mW power dissipation at 70°C ambient temperature. For information about a general PCB design guide for PowerPAD packages, refer to the PowerPAD Thermally Enhanced Package application report. TI recommends using a four layer stack up at a minimum to accomplish a low-EMI PCB design. TI recommends four layers as the TDP1204 is a single voltage rail device.

  • Routing the high-speed TMDS traces on the top layer avoids the use of vias (and the introduction of their inductances) and allows for clean interconnects from the HDMI connectors to the Redriver inputs and outputs. It is important to match the electrical length of these high speed traces to minimize both inter-pair and intra-pair skew.
  • Placing a solid ground plane next to the high-speed single layer establishes controlled impedance for transmission link interconnects and provides an excellent low-inductance path for the return current flow.
  • Placing a power plane next to the ground plane creates an additional high-frequency bypass capacitance.
  • Routing slower seed control signals on the bottom layer allows for greater flexibility as these signal links usually have margin to tolerate discontinuities such as vias.
  • If an additional supply voltage plane or signal layer is needed, add a second power or ground plane system to the stack to keep symmetry. This makes the stack mechanically stable and prevents it from warping. Also the power and ground plane of each power system can be placed closer together, thus increasing the high frequency bypass capacitance significantly.
  • To minimize crosstalk between adjacent differential pairs, the distance between the differential pairs should be at least five times longer than the trace width (5W rule). For the clock differential pair, the distance should be increased to 8W or 10W.
GUID-A510D756-3EB1-45E0-8239-F4015415CA44-low.gifFigure 9-11 Recommended 4 or 6-Layer PCB Stack