SLLSFI6A july   2022  – july 2023 TDP1204

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Feature Description
      1. 8.2.1  4-Level Inputs
      2. 8.2.2  I/O Voltage Level Selection
      3. 8.2.3  HPD_OUT
      4. 8.2.4  Lane Control
      5. 8.2.5  Swap
      6. 8.2.6  Linear and Limited Redriver
      7. 8.2.7  Main Link Inputs
      8. 8.2.8  Receiver Equalizer
      9. 8.2.9  CTLE Bypass
      10. 8.2.10 Adaptive Equalization in HDMI 2.1 FRL
        1. 8.2.10.1 HDMI 2.1 TX Compliance Testing with AEQ Enabled
      11. 8.2.11 HDMI 2.1 Link Training Compatible Rx EQ
      12. 8.2.12 Input Signal Detect
      13. 8.2.13 Main Link Outputs
        1. 8.2.13.1 Transmitter Bias
        2. 8.2.13.2 Transmitter Impedance Control
        3. 8.2.13.3 TX Slew Rate Control
        4. 8.2.13.4 TX Pre-Emphasis and De-Emphasis Control
        5. 8.2.13.5 TX Swing Control
      14. 8.2.14 DDC Buffer
      15. 8.2.15 HDMI DDC Capacitance
      16. 8.2.16 DisplayPort
    3. 8.3 Device Functional Modes
      1. 8.3.1 MODE Control
        1. 8.3.1.1 I2C Mode (MODE = "F")
        2. 8.3.1.2 Pin Strap Modes
          1. 8.3.1.2.1 Pin-Strap: HDMI 1.4 and HDMI 2.0 Functional Description
          2. 8.3.1.2.2 Pin-Strap HDMI 2.1 Function (MODE = "0"): Fixed Rx EQ and DDC Buffer Enabled
          3. 8.3.1.2.3 Pin-Strap HDMI 2.1 Function (MODE = "1"): Flexible RX EQ and DDC Buffer Enabled
          4. 8.3.1.2.4 Pin-Strap HDMI 2.1 Function (MODE = "R"): Flexible Rx EQ and DDC Buffer Disabled
      2. 8.3.2 DDC Snoop Feature
        1. 8.3.2.1 HDMI Type
        2. 8.3.2.2 HDMI 2.1 FRL Snoop
      3. 8.3.3 Low Power States
    4. 8.4 Programming
      1. 8.4.1 Pseudocode Examples
        1. 8.4.1.1 HDMI 2.1 Source Example with DDC Snoop and DDC Buffer Enabled
        2. 8.4.1.2 HDMI 2.1 Source Example with DDC Snoop Disabled and DDC Buffer Disabled
      2. 8.4.2 TDP1204 I2C Address Options
      3. 8.4.3 I2C Target Behavior
    5. 8.5 Register Maps
      1. 8.5.1 TDP1204 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Source-Side Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Pre-Channel (LAB)
        2. 9.2.2.2 Post-Channel (LCD)
        3. 9.2.2.3 Common Mode Choke
        4. 9.2.2.4 ESD Protection
      3. 9.2.3 Application Curves
    3. 9.3 Typical Sink-Side Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedures
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Supply Decoupling
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Timing Requirements

MIN NOM MAX UNIT
Local I2C (SCL/CFG0, SDA/CFG1). Refer to Figure 7-9.
fSCL I2C clock frequency 1 MHz
tBUF Bus free time between START and STOP conditions 0.5 µs
tHD_STA Hold time after repeated START condition. After this period, the first clock pulse is generated 0.26 µs
tLOW Low period of the I2C clock 0.5 µs
tHIGH High period of the I2C clock 0.26 µs
tSU_STA Setup time for a repeated START condition 0.26 µs
tHD_DAT Data hold time 0 μs
tSU_DAT Data setup time 50 ns
tR Rise time of both SDA and SCL signals 120 ns
tF Fall time of both SDA and SCL signals 4 120 ns
tSU_STO Setup time for STOP condition 0.26 μs
DDC Snoop I2C Timings. Refer to Figure 7-9.
fSCL I2C DDC clock frequency 100 kHz
tBUF Bus free time between START and STOP conditions 4.7 µs
tHD_STA Hold time after repeated START condition. After this period, the first clock pulse is generated 4 µs
tLOW Low period of the I2C clock 4.7 µs
tHIGH High period of the I2C clock 4 µs
tSU_STA Setup time for a repeated START condition 4.7 µs
tHD_DAT Data hold time 0 μs
tSUDAT Data setup time 250 ns
tR Rise time of both SDA and SCL signals. Measured from 30% to 70%. 1000 ns
tF Fall time of both SDA and SCL signals  Measured from 70% to 30%. 300 ns
tSU_STO Setup time for STOP condition 4 μs
Cb_LV Capacitive load for each bus line on LV side 50 pF
Power-On. Refer to Figure 7-1.
tVCC_RAMP VCC supply ramp. Measured from 10% to 90%. 0.10 50 ms
tD_PG Internal POR de-assertion delay 5 ms
tVIO_SU VIO supply stable before reset(2) high. 100 µs
tCFG_SU Configuration pins(1) setup before reset(2) high. 0 µs
tCFG_HD Configuration pins(1) hold after reset(2)high. 500 µs
(1) Follow comprise the configuration pins:  MODE,  ADDR/EQ0, EQ1, TXSWG, TXSLEW, TXPRE, AC_EN, HPDOUT_SEL, DCGAIN
(2) Reset is the logical AND of internal POR and EN pin.