SLLSG10
November 2024
TDP142-Q1
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Power Supply Characteristics
5.6
Control I/O DC Electrical Characteristics
5.7
DP Electrical Characteristics
5.8
Switching Characteristics
5.9
Typical Characteristics
Parameter Measurement Information
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
DisplayPort
6.3.2
Configuration Jumper Levels
6.3.3
Receiver Linear Equalization
6.4
Device Functional Modes
6.4.1
Device Configuration in GPIO Mode
6.4.2
Device Configuration in I2C Mode
6.4.3
Linear EQ Configuration
6.4.4
Operation Timing – Power Up
6.5
Programming
7
Register Maps
7.1
TDP142-Q1 Registers
8
Application and Implementation
8.1
Application Information
8.1.1
ESD Protection
8.2
Typical Application
8.2.1
Source Application Implementation
8.2.1.1
Design Requirement
8.2.1.2
Detail Design Procedure
8.2.2
Sink Application Implementation
8.2.2.1
Design Requirements
8.2.2.2
Detailed Design Procedure
8.2.3
Application Curve
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Receiving Notification of Documentation Updates
9.2
Support Resources
9.3
Trademarks
9.4
Electrostatic Discharge Caution
9.5
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
11.1
Tape and Reel Information
11.2
Mechanical Data
Package Options
Mechanical Data (Package|Pins)
RGF|40
MPQF173F
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sllsg10_oa
8.2.3
Application Curve
Figure 8-5
Insertion Loss of FR4 PCB Traces