SLLSG10 November   2024 TDP142-Q1

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Power Supply Characteristics
    6. 5.6 Control I/O DC Electrical Characteristics
    7. 5.7 DP Electrical Characteristics
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7.   Parameter Measurement Information
  8. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 DisplayPort
      2. 6.3.2 Configuration Jumper Levels
      3. 6.3.3 Receiver Linear Equalization
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Configuration in GPIO Mode
      2. 6.4.2 Device Configuration in I2C Mode
      3. 6.4.3 Linear EQ Configuration
      4. 6.4.4 Operation Timing – Power Up
    5. 6.5 Programming
  9. Register Maps
    1. 7.1 TDP142-Q1 Registers
  10. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 ESD Protection
    2. 8.2 Typical Application
      1. 8.2.1 Source Application Implementation
        1. 8.2.1.1 Design Requirement
        2. 8.2.1.2 Detail Design Procedure
      2. 8.2.2 Sink Application Implementation
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  11. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  12. 10Revision History
  13. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Main power supply 3.0 3.3 3.6 V
Main supply ramp requirement 0.1 50 ms
V(I2C) Supply that external resistors are pulled up to on SDA and SCL 1.7 3.6 V
V(PSN) Supply noise on VCC pins (less than 4MHz) 100 mV
TA Operating free-air temperature –40 105 °C
TPCB PCB temperature (1mm away from the device) –40 112 °C