SLLSEX2F December   2016  – April 2024 TDP158

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics, Power Supply
    6. 5.6  Electrical Characteristics, Differential Input
    7. 5.7  Electrical Characteristics, TMDS Differential Output
    8. 5.8  Electrical Characteristics, DDC, I2C, HPD, and ARC
    9. 5.9  Electrical Characteristics, TMDS Differential Output in DP-Mode
    10. 5.10 Switching Characteristics, TMDS
    11. 5.11 Switching Characteristics, HPD
    12. 5.12 Switching Characteristics, DDC and I2C
    13. 5.13 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Reset Implementation
      2. 7.3.2  Operation Timing
      3. 7.3.3  Lane Control
      4. 7.3.4  Swap
      5. 7.3.5  Main Link Inputs
      6. 7.3.6  Receiver Equalizer
      7. 7.3.7  Input Signal Detect Block
      8. 7.3.8  Transmitter Impedance Control
      9. 7.3.9  TMDS Outputs
      10. 7.3.10 Slew Rate Control
      11. 7.3.11 Pre-Emphasis
      12. 7.3.12 DP-Mode Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 DDC Training for HDMI 2.0 Data Rate Monitor
      2. 7.4.2 DDC Functional Description
    5. 7.5 Register Maps
      1. 7.5.1  Local I2C Control BIT Access TAG Convention
      2. 7.5.2  BIT Access Tag Conventions
      3. 7.5.3  CSR Bit Field Definitions, DEVICE_ID (address = 00h≅07h)
      4. 7.5.4  CSR Bit Field Definitions, REV_ID (address = 08h )
      5. 7.5.5  CSR Bit Field Definitions – MISC CONTROL 09h (address = 09h)
      6. 7.5.6  CSR Bit Field Definitions – MISC CONTROL 0Ah (address = 0Ah)
      7. 7.5.7  CSR Bit Field Definitions – MISC CONTROL 0Bh (address = 0Bh)
      8. 7.5.8  CSR Bit Field Definitions – MISC CONTROL 0Ch (address = 0Ch)
      9. 7.5.9  CSR Bit Field Definitions, Equalization Control Register (address = 0Dh)
      10. 7.5.10 CSR Bit Field Definitions, POWER MODE STATUS (address = 20h)
      11. 7.5.11 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 30h)
      12. 7.5.12 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 31h)
      13. 7.5.13 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 32h)
      14. 7.5.14 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 33h)
      15. 7.5.15 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 34h)
      16. 7.5.16 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 35h)
      17. 7.5.17 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 4Dh)
      18. 7.5.18 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 4Eh)
      19. 7.5.19 CSR Bit Field Definitions, DP-Mode and INDIVIDUAL LANE CONTROL (address = 4Fh)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Source Side
        2. 8.2.2.2 DDC Pull Up Resistors
      3. 8.2.3 Application Curves
      4. 8.2.4 Application with DDC Snoop
        1. 8.2.4.1 Source Side HDMI Application
      5. 8.2.5 9.1.2 Source Side HDMI /DP Application Using DP-Mode
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Management
      2. 8.3.2 Standby Power
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.2 DDC Functional Description

The TDP158 solves sink/source level issues by implementing a controller/target control mode for the DDC bus. When the TDP158 detects the start condition on the DDC bus from the SDA_SRC/SCL_SRC it transfers the data or clock signal to the SDA_SNK/SCL_SNK with little propagation delay. When SDA_SNK detects the feedback from the downstream device, the TDP158 pulls up or pulls down the SDA_SRC bus and delivers the signal to the source.

The DDC link defaults to 100Kbps but can be set to various values including 400Kbps by setting the correct value to address 22h through the I2C interface. The HPD goes to high impedance when VCC is under low power conditions, < 1.5V.

Note:

The TDP158 uses clock stretching for DDC transactions. As there are sources and sinks that do not perform this function correctly, a system may not work correctly as DDC transactions are incorrectly transmitted/received. To overcome this, a snoop configuration can be implemented where the SDA/SCL from the source is connected directly to the SDA/SCL pins. The TDP158 needs the SDA_SNK and SCL_SNK pins connected to the sink DDC pins so that the TMDS_CLOCK_RATIO_STATUS bit can be automatically set; otherwise, it will have to be set through I2C. For best noise immunity, the SDA_SRC and SCL_SRC pins should be connected to GND. Care must be taken when this configuration is being implemented as the voltage level for DDC between the source and sink may be different, 3.3V versus 5V.