Refere to following guidelines when designing the
layout of the system implementation:
- Place the
decoupling capacitors as close to the VCC pins as
possible. Placing the decoupling capacitors directly
underneath the device is recommended if the board
design permits.
- Make sure
the high-speed differential signals TXnP/TXnN and
RXnP/RXnN are tightly coupled, skew matched, and
impedance controlled.
- Avoid
vias when possible on the high-speed differential
signals. When vias must be used, take care to
minimize the via stub, either by transitioning
through most or all layers or by back drilling.
- GND
relief can be used (but is not required) beneath the
high-speed differential signal pads to improve
signal integrity by counteracting the pad
capacitance.
- Place GND
vias directly beneath the device connecting the GND
plane attached to the device to the GND planes on
other layers. This has the added benefit of
improving thermal conductivity from the device to
the board.
- Refer to
land pattern example in the mechanical drawing
section for the device thermal pad design
recommendation.