SLDS190B November   2012  – March 2022 TFP401A-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Digital I/O Electrical Characteristics
    6. 6.6  DC Electrical Characteristics
    7. 6.7  AC Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 TMDS Pixel Data and Control Signal Encoding
      2. 7.3.2 TFP401A-Q1 Clocking and Data Synchronization
      3. 7.3.3 TFP401A-Q1 TMDS Input Levels and Input Impedance Matching
      4. 7.3.4 TFP401A-Q1 Device Incorporates HSYNC Jitter Immunity
    4. 7.4 Device Functional Modes
      1. 7.4.1 TFP401A-Q1 Modes of Operation
      2. 7.4.2 TFP401A-Q1 Output Driver Configurations
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Typical Application
        1. 8.1.1.1 Design Requirements
        2. 8.1.1.2 Detailed Design Procedure
          1. 8.1.1.2.1 Data and Control Signals
          2. 8.1.1.2.2 Configuration Options
          3. 8.1.1.2.3 Power Supplies Decoupling
        3. 8.1.1.3 Application Curves
        4. 8.1.1.4 DVDD
        5. 8.1.1.5 OVDD
        6. 8.1.1.6 AVDD
        7. 8.1.1.7 PVDD
    2. 8.2 Power Supply Recommendations
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
        1. 8.3.1.1 Layer Stack
        2. 8.3.1.2 Routing High-Speed Differential Signal Traces (RxC-, RxC+, Rx0-, Rx0+, Rx1-, Rx1+, Rx2-, Rx2+)
      2. 8.3.2 Layout Example
      3. 8.3.3 TI PowerPAD 100-TQFP Package
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.3 TI PowerPAD 100-TQFP Package

The TFP401A-Q1 device comes in TI's thermally enhanced PowerPAD 100-TQFP package. The PowerPAD package is a 14-mm × 14-mm × 1-mm TQFP outline with 0.5-mm lead pitch. The PowerPAD package has a specially designed die mount pad that offers improved thermal capability over typical TQFP packages of the same outline. The TI 100-TQFP PowerPAD package offers a back-side solder plane that connects directly to the die mount pad for enhanced thermal conduction. There is no thermal requirement for soldering the back side of the TFP401A-Q1 device to the application board, because the device power dissipation is well within the package capability when not soldered. However, to minimize stress on peripheral pins, it is highly recommended to solder the thermal pad to PCB.

Soldering the back side of the device to the PCB ground plane is recommended for electrical considerations. Because the die pad is electrically connected to the chip substrate and hence to chip ground, connection of the PowerPAD's back side to a PCB ground plane helps to improve EMI, ground bounce, and power-supply noise performance.

Table 8-2 outlines the thermal properties of the TI 100-TQFP PowerPAD package. The 100-TQFP non-PowerPAD package is included only for reference.

Table 8-2 TI 100-TQFP (14 mm × 14 mm × 1 mm) With 0.5-mm Lead Pitch
PARAMETERWITHOUT
PowerPAD™ PACKAGE		PowerPAD™ PACKAGE,
NOT CONNECTED TO PCB
THERMAL PLANE		PowerPAD™ PACKAGE,
CONNECTED TO PCB
THERMAL PLANE(1)
Theta-JA(1) (2)45°C/W27.3°C/W17.3°C/W
Theta-JC(1)(2)3.11°C/W0.12°C/W0.12°C/W
Maximum power dissipation(1)(2)(3)1.6 W2.7 W4.3 W
(1) Specified with 2-oz. (0.071 mm thick) Cu PCB plating.
(2) Airflow is at 0 LFM (0 m/s) (no airflow).
(3) Measured at ambient temperature, TA = 70°C.