SLDS190B November   2012  – March 2022 TFP401A-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Digital I/O Electrical Characteristics
    6. 6.6  DC Electrical Characteristics
    7. 6.7  AC Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 TMDS Pixel Data and Control Signal Encoding
      2. 7.3.2 TFP401A-Q1 Clocking and Data Synchronization
      3. 7.3.3 TFP401A-Q1 TMDS Input Levels and Input Impedance Matching
      4. 7.3.4 TFP401A-Q1 Device Incorporates HSYNC Jitter Immunity
    4. 7.4 Device Functional Modes
      1. 7.4.1 TFP401A-Q1 Modes of Operation
      2. 7.4.2 TFP401A-Q1 Output Driver Configurations
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Typical Application
        1. 8.1.1.1 Design Requirements
        2. 8.1.1.2 Detailed Design Procedure
          1. 8.1.1.2.1 Data and Control Signals
          2. 8.1.1.2.2 Configuration Options
          3. 8.1.1.2.3 Power Supplies Decoupling
        3. 8.1.1.3 Application Curves
        4. 8.1.1.4 DVDD
        5. 8.1.1.5 OVDD
        6. 8.1.1.6 AVDD
        7. 8.1.1.7 PVDD
    2. 8.2 Power Supply Recommendations
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
        1. 8.3.1.1 Layer Stack
        2. 8.3.1.2 Routing High-Speed Differential Signal Traces (RxC-, RxC+, Rx0-, Rx0+, Rx1-, Rx1+, Rx2-, Rx2+)
      2. 8.3.2 Layout Example
      3. 8.3.3 TI PowerPAD 100-TQFP Package
  9. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

DC Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
VIDAnalog-input differential voltage(1)751200mV
VICAnalog-input common-mode voltage(1)AVDD – 300AVDD – 37mV
VI(OC)Open-circuit analog input voltageAVDD – 10AVDD + 10mV
IDD(2PIX)Normal 2-pixels-per-clock power-supply current(2)ODCK = 82.5 MHz, 2 pixels per clock370mA
IPDPower-down current(3)PD = low10mA
IPDOOutput-drive power-down current(3)PDO = low35mA
Specified as dc characteristic with no overshoot or undershoot.
Alternating 2-pixel black and 2-pixel white patterns. ST = high, STAG = high, QE[23:0] and QO[23:0] CL = 10 pF.
Analog inputs are open-circuit (transmitter disconnected from the TFP401A-Q1 device).