SLDS145D October   2001  – February 2024 TFP410

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 T.M.D.S. Pixel Data and Control Signal Encoding
      2. 6.3.2 Universal Graphics Controller Interface Voltage Signal Levels
      3. 6.3.3 Universal Graphics Controller Interface Clock Inputs
    4. 6.4 Device Functional Modes
      1. 6.4.1 Universal Graphics Controller Interface Modes
      2. 6.4.2 Data De-skew Feature
      3. 6.4.3 Hot Plug/Unplug (Auto Connect/Disconnect Detection)
      4. 6.4.4 Device Configuration and I2C RESET Description
      5. 6.4.5 DE Generator
    5. 6.5 Programming
      1. 6.5.1 I2C Interface
    6. 6.6 Register Maps
      1. 6.6.1  VEN_ID Register (Sub-Address = 01−00 ) [reset = 0x014C]
      2. 6.6.2  DEV_ID Register (Sub-Address = 03–02) [reset = 0x0410]
      3. 6.6.3  REV_ID Register (Sub-Address = 04) [reset = 0x00]
      4. 6.6.4  Reserved Register (Sub-Address = 07–05) [reset = 0x641400]
      5. 6.6.5  CTL_1_MODE (Sub-Address = 08) [reset = 0xBE]
      6. 6.6.6  CTL_2_MODE Register (Sub-Address = 09) [reset = 0x00]
      7. 6.6.7  CTL_3_MODE Register (Sub-Address = 0A) [reset = 0x80]
      8. 6.6.8  CFG Register (Sub-Address = 0B)
      9. 6.6.9  RESERVED Register (Sub-Address = 0E–0C) [reset = 0x97D0A9]
      10. 6.6.10 DE_DLY Register (Sub-Address = 32) [reset = 0x00]
      11. 6.6.11 DE_CTL Register (Sub-Address = 33) [reset = 0x00]
      12. 6.6.12 DE_TOP Register (Sub-Address = 34) [reset = 0x00]
      13. 6.6.13 DE_CNT Register (Sub-Address = 37–36) [reset = 0x0000]
      14. 6.6.14 DE_LIN Register (Sub-Address = 39–38) [reset = 0x0000]
      15. 6.6.15 H_RES Register (Sub-Address = 3B−3A)
      16. 6.6.16 V_RES Register (Sub-Address = 3D−3C)
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Data and Control Signals
        2. 7.2.2.2 Configuration Options
        3. 7.2.2.3 Power Supplies Decoupling
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 DVDD
      2. 7.3.2 TVDD
      3. 7.3.3 PVDD
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Layer Stack
        2. 7.4.1.2 Routing High-Speed Differential Signal Traces (RxC-, RxC+, Rx0-, Rx0+, Rx1-, Rx1+, Rx2-, Rx2+)
        3. 7.4.1.3 DVI Connector
      2. 7.4.2 Layout Example
      3. 7.4.3 TI PowerPAD 64-Pin HTQFP Package
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PAP|64
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.