SLDS145D October   2001  – February 2024 TFP410

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 T.M.D.S. Pixel Data and Control Signal Encoding
      2. 6.3.2 Universal Graphics Controller Interface Voltage Signal Levels
      3. 6.3.3 Universal Graphics Controller Interface Clock Inputs
    4. 6.4 Device Functional Modes
      1. 6.4.1 Universal Graphics Controller Interface Modes
      2. 6.4.2 Data De-skew Feature
      3. 6.4.3 Hot Plug/Unplug (Auto Connect/Disconnect Detection)
      4. 6.4.4 Device Configuration and I2C RESET Description
      5. 6.4.5 DE Generator
    5. 6.5 Programming
      1. 6.5.1 I2C Interface
    6. 6.6 Register Maps
      1. 6.6.1  VEN_ID Register (Sub-Address = 01−00 ) [reset = 0x014C]
      2. 6.6.2  DEV_ID Register (Sub-Address = 03–02) [reset = 0x0410]
      3. 6.6.3  REV_ID Register (Sub-Address = 04) [reset = 0x00]
      4. 6.6.4  Reserved Register (Sub-Address = 07–05) [reset = 0x641400]
      5. 6.6.5  CTL_1_MODE (Sub-Address = 08) [reset = 0xBE]
      6. 6.6.6  CTL_2_MODE Register (Sub-Address = 09) [reset = 0x00]
      7. 6.6.7  CTL_3_MODE Register (Sub-Address = 0A) [reset = 0x80]
      8. 6.6.8  CFG Register (Sub-Address = 0B)
      9. 6.6.9  RESERVED Register (Sub-Address = 0E–0C) [reset = 0x97D0A9]
      10. 6.6.10 DE_DLY Register (Sub-Address = 32) [reset = 0x00]
      11. 6.6.11 DE_CTL Register (Sub-Address = 33) [reset = 0x00]
      12. 6.6.12 DE_TOP Register (Sub-Address = 34) [reset = 0x00]
      13. 6.6.13 DE_CNT Register (Sub-Address = 37–36) [reset = 0x0000]
      14. 6.6.14 DE_LIN Register (Sub-Address = 39–38) [reset = 0x0000]
      15. 6.6.15 H_RES Register (Sub-Address = 3B−3A)
      16. 6.6.16 V_RES Register (Sub-Address = 3D−3C)
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Data and Control Signals
        2. 7.2.2.2 Configuration Options
        3. 7.2.2.3 Power Supplies Decoupling
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 DVDD
      2. 7.3.2 TVDD
      3. 7.3.3 PVDD
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Layer Stack
        2. 7.4.1.2 Routing High-Speed Differential Signal Traces (RxC-, RxC+, Rx0-, Rx0+, Rx1-, Rx1+, Rx2-, Rx2+)
        3. 7.4.1.3 DVI Connector
      2. 7.4.2 Layout Example
      3. 7.4.3 TI PowerPAD 64-Pin HTQFP Package
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PAP|64
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision C (November 2014) to Revision D (February 2024)

  • Added inclusive terminology throughout the data sheetGo
  • Changed pin 22 from: TVC + to: TXC+ Go
  • Updated MSEN pin description from: when I2C is disabled (ISEL = low), a low level indicates a powered on receiver is detected at the differential outputs. A high level indicates a powered on receiver is not detected to: when I2C is disabled (ISEL = low), a high level indicates a powered on receiver is detected at the differential outputs. A low level indicates a powered on receiver is not detected. Go
  • Changed pin 6 name from CTL3/A3/DK3 to A3/DK3.Go
  • Changed from: When the I2C bus is disabled (ISEL = low) and the de-skew mode is disabled (DKEN = low), these three inputs become the control inputs, CTL[3:1], which can be used to send additional information across the DVI link during the blanking interval (DE = low). The CTL3 input is reserved for HDCP compliant DVI TXs (TFP510) and the CTL[2:1] inputs are reserved for future use. to: When the I2C bus is disabled (ISEL = low) and the de-skew mode is disabled (DKEN = low), pins 7 and 8 become the control inputs, CTL[2:1], which can be used to send additional information across the DVI link during the blanking interval (DE = low). Pin 6 is not used. Go
  • Updated VIH and VIL for Data, DE, VSYNC, HSYNC, and IDCK+/- CMOS inputs and the remaining CMOS inputsGo
  • Changed three user definable control signals, CTL[3:1], during the inactive display or blanking interval to: three control signals, CTL[3:1], during the inactive display or blanking interval Go
  • Changed the TFP410 encodes and transfers the CTL[3:1] inputs during the vertical blanking interval to: the TFP410 encodes and transfers the CTL[2:1] inputs during the vertical blanking interval Go
  • Changed the CTL3 input is reserved for HDCP compliant DVI TXs and the CTL[2:1] inputs are reserved for future use to: CTL3 is reserved for HDCP and is always encoded as 0. The CTL[2:1] inputs are reserved for future use Go
  • Changed RW field for sub-address 0B from RW to R. Go
  • Changed CTL_1_MODE register reset value from: 0xFE to: 0xBE Go
  • Changed in the CTL_3_MODE register, bit 3 from CTL3 to RSVD Go
  • Added in DE_DLY register the value must be less than or equal to (2047 - DE_CNT) Go
  • Added in the DE_CNT register the value must be less than or equal to (2047 - DE_DLY) Go
  • Changed Application Information summary to be focused on TFP410 instead of the TDP401.Go

Changes from Revision B (May 2011) to Revision C (November 2014)

  • Added ESD Ratings table, Thermal Information table, Typical Characteristics section, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go