SLOS423K september   2003  – april 2023 THS3091 , THS3095

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = ±15 V
    6. 7.6 Electrical Characteristics: VS = ±5 V
    7. 7.7 Typical Characteristics: ±15 V
    8. 7.8 Typical Characteristics: ±5 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-Down and Reference Pins Functionality
    4. 8.4 Device Functional Modes
      1. 8.4.1 Wideband, Noninverting Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 PowerPAD Design Considerations
          1. 9.4.1.1.1 PowerPAD Layout Considerations
        2. 9.4.1.2 Power Dissipation and Thermal Considerations
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.8 Typical Characteristics: ±5 V

at TA ≅ 25°C, VS = ±5 V, RF = 1.15 kΩ, G = +2 V/V, and RL = 100 Ω (unless otherwise noted)

GUID-20230208-SS0I-D0SJ-XZ8R-5PNQM75BDDDD-low.svg
VOUT = 200 mVPP
Figure 7-32 Noninverting Small-Signal Frequency Response
GUID-20230208-SS0I-BNCJ-R37K-QPQH0BQG39QT-low.svg
VOUT = 4 VPP
Figure 7-34 Noninverting Large-Signal Frequency Response
GUID-20230208-SS0I-SDBM-CD41-GFJQWNKLN2WV-low.svg
VOUT = 2 VPP
Figure 7-36 Harmonic Distortion vs Frequency
GUID-20230208-SS0I-9QDV-PGQR-ZHFNJ4ZRD4BV-low.svg
G = 1 V/V, RF = 1.78 kΩ
Figure 7-38 Slew Rate vs Output Voltage Step
GUID-20230208-SS0I-2CZH-1PKT-2GCXVPP3HCL9-low.svg
Figure 7-40 Input Bias and Offset Current vs Case Temperature
GUID-20230208-SS0I-XF8F-QFBF-2PFRTV5ZHR0F-low.svg
VOUT = 200 mVPP, RF = 1.21 kΩ
Figure 7-33 0.1-db Gain Flatness Frequency Response
GUID-20230208-SS0I-WXXN-QPKQ-DH8D8MTJ03XS-low.svg
G = -2 V/V, RF = 1 kΩ
Figure 7-35 Settling Time
GUID-20230208-SS0I-BVQC-HV0K-R8MLL06HZWNW-low.svg
G = 5 V/V, RF = 1 kΩ, f = 1 MHz
Figure 7-37 Harmonic Distortion vs Output Voltage Swing
GUID-20230208-SS0I-SHR5-4JPD-DVJBX5PVWD6S-low.svg
Figure 7-39 Output Voltage vs Load Resistance