SBOS780 Data sheet | TI.com

SBOS780C March 2016 – June 2021 THS3215

PRODUCTION DATA

Package Options

Mechanical Data (Package|Pins)

RGV|16
- MPQF121F

Thermal pad, mechanical data (Package|Pins)

Orderable Information

6.9 Typical Characteristics: D2S + OPS

at +V_CC = 6 V, –V_CC = –6 V, 25-Ω D2S source impedance , V_IC = 0.25 V, internal path selected (PATHSEL = GND), V_REF = GND, D2S R_LOAD = 200 Ω at pin 6, R_F = 249 Ω, R_G = 162 Ω, OPS A_V = 2.5 V/V, OPS On (DISABLE = GND), OPS R_LOAD = 100 Ω at pin 11, and T_J ≈ 25°C (unless otherwise noted)

Figure 6-1 Frequency Response vs Output Voltage

Figure 6-3 HD2 vs Frequency

30 units shown

Figure 6-5 Gain vs Temperature

V_OUT = 500 mV_PP, see Table 8-1

Figure 6-7 Small-Signal Frequency Response vs Gain

V_OUT = 5 V_PP, see Table 8-1

Figure 6-9 HD2 vs Gain

Test frequency = 20 MHz

Figure 6-11 HD2 vs Supply Voltage

Figure 6-2 Small- and Large-Signal Step Response

Figure 6-4 HD3 vs Frequency

25-Ω source impedance on each D2S input

Figure 6-6 Input-Referred Differential Noise

V_OUT = 5 V_PP, see Table 8-1

Figure 6-8 Large-Signal Frequency Response vs Gain

V_OUT = 5 V_PP, see Table 8-1

Figure 6-10 HD3 vs Gain

Test frequency = 20 MHz

Figure 6-12 HD3 vs Supply Voltage